scholarly journals Laser Induced Forward Transfer of High Viscosity Silver Paste for New Metallization Methods in Photovoltaic and Flexible Electronics Industry

2016 ◽  
Vol 83 ◽  
pp. 204-210 ◽  
Author(s):  
Y. Chen ◽  
D. Munoz-Martin ◽  
M. Morales ◽  
C. Molpeceres ◽  
E. Sánchez-Cortezon ◽  
...  
Keyword(s):  
Flexible Electronics ◽  
High Viscosity ◽  
Electronics Industry ◽  
Silver Paste ◽  
Forward Transfer

Laser induced forward transfer of high viscosity silver paste on double groove structure

2022 ◽  
Vol 148 ◽  
pp. 107795
Author(s):  
Yilin Shan ◽  
Xianmin Zhang ◽  
Gengchao Chen ◽  
Kai Li
Keyword(s):  
High Viscosity ◽  
Silver Paste ◽  
Forward Transfer ◽  
Groove Structure

scholarly journals Overlapping Limitations for ps-Pulsed LIFT Printing of High Viscosity Metallic Pastes

Metals ◽  
2020 ◽  
Vol 10 (2) ◽  
pp. 168 ◽  
Author(s):  
David Munoz-Martin ◽  
Yu Chen ◽  
Miguel Morales ◽  
Carlos Molpeceres
Keyword(s):  
Laser Pulse ◽  
Short Distance ◽  
Laser Pulse Energy ◽  
Laser Pulses ◽  
High Viscosity ◽  
Single Step ◽  
High Speeds ◽  
Forward Transfer ◽  
Micron Size ◽  
Interference Problems

Laser-induced forward transfer (LIFT) technique has been used for printing a high viscosity (250 Pa·s) commercial silver paste with micron-size particles (1–4 µm). Volumetric pixels (voxels) transferred using single ps laser pulses are overlapped in order to obtain continuous metallic lines. However, interference problems between successive voxels is a major issue that must be solved before obtaining lines with good morphologies. The effects of the laser pulse energy, thickness of the donor paste film, and distance between successive voxels on the morphology of single voxels and lines are discussed. Due to the high viscosity of the paste, the void in the donor film after a printing event remains, and it negatively affects the physical transfer mechanism of the next laser pulses. When two laser pulses are fired at a short distance, there is no transfer at all. Only when the pulses are separated by a distance long enough to avoid interference but short enough to allow overlapping (≈100 µm), is it possible to print continuous lines in a single step. Finally, the knowledge obtained has allowed the printing of silver lines at high speeds (up to 60 m/s).

Transparent and through thickness conductive polystyrene films using external magnetic fields for “Z” alignment of nickel nanoparticles

Nanoscale ◽  
2015 ◽  
Vol 7 (35) ◽  
pp. 14636-14642 ◽  
Author(s):  
Yuwei Chen ◽  
Yuanhao Guo ◽  
Saurabh Batra ◽  
Enmin Wang ◽  
Yanping Wang ◽  
...  
Keyword(s):  
Electrical Conductivity ◽  
Magnetic Fields ◽  
Flexible Electronics ◽  
Nickel Nanoparticles ◽  
Electronics Industry

A combination of transparency, electrical conductivity and flexibility is desired in the emerging flexible electronics industry for current and future applications.

scholarly journals Silver Nanowires from Sonication-Induced Scission

Micromachines ◽  
2019 ◽  
Vol 10 (1) ◽  
pp. 29 ◽  
Author(s):  
Yuehui Wang ◽  
Xing Yang ◽  
Dexi Du
Keyword(s):  
Flexible Electronics ◽  
Solvothermal Method ◽  
Silver Nanowires ◽  
Electronics Industry ◽  
Transparent Conductors ◽  
Ultrasonic Power ◽  
Optical And Electrical Properties ◽  
Ultrasonic Time ◽  
Mean Diameter ◽  
The Relationship

Silver nanowires (AgNWs) have great potential to be used in the flexible electronics industry for their applications in flexible, transparent conductors due to high conductivity and light reflectivity. Those applications always involve size which strongly affects the optical and electrical properties of AgNWs. AgNWs of mean diameter 70 nm and mean length 12.5 μm were achieved by the polyol solvothermal method. Sonication-induced scission was used to obtain the small size AgNWs. The relationship between the size of AgNWs and the ultrasonic time, ultrasonic power, and concentration of AgNWs were studied. The results show that the length of AgNWs gradually reduces with the increase of the ultrasonic time and ultrasonic power, and with the decrease of concentration of AgNWs. Meanwhile, there is an existence of a limiting length below which fragmentation of AgNWs no longer occurs. Further, the mechanics of sonication-induced scission for the fragmentation of AgNWs was discussed.

scholarly journals Influence of the Gap between Substrates in the Laser-Induced Transference of High-Viscosity Pastes

Materials ◽  
2021 ◽  
Vol 14 (19) ◽  
pp. 5567
Author(s):  
Juan José Moreno-Labella ◽  
David Munoz-Martin ◽  
Guillermo Vallejo ◽  
Carlos Molpeceres ◽  
Miguel Morales
Keyword(s):  
Finite Element ◽  
Finite Element Model ◽  
Element Model ◽  
High Viscosity ◽  
Comsol Multiphysics ◽  
Forward Transfer

Laser-induced forward transfer for high-viscosity—of Pa·s—pastes differ from standard LIFT processes in its dynamics. In most techniques, the transference after setting a great gap does not modify the shape acquired by the fluid, so it stretches until it breaks into droplets. In contrast, there is no transferred material when the gap is bigger than three times the paste thickness in LIFT for high-viscosity pastes, and only a spray is observed on the acceptor using this configuration. In this work, the dynamics of the paste have been studied using a finite-element model in COMSOL Multiphysics, and the behavior of the paste varying the gap between the donor and the acceptor substrates has also been modeled. The paste bursts for great gaps, but it is confined when the acceptor is placed close enough. The obtained simulations have been compared with a previous work, in which the paste structures were photographed. The analysis of the simulations in terms of speed allows for predicting the burst of the paste—spray regime—and the construction of a printability map regarding the gap between the substrates.

An ultrasensitive and highly compressive piezoresistive sensor based on a biopolyol-reinforced polyurethane sponge coated with silver nanoparticles and carbon nanotubes/cellulose nanocrystals

2020 ◽  
Vol 8 (46) ◽  
pp. 16603-16614
Author(s):  
Qiming Yan ◽  
Weidi Xie ◽  
Meng Zhou ◽  
Heqing Fu
Keyword(s):  
Carbon Nanotubes ◽  
Silver Nanoparticles ◽  
Flexible Electronics ◽  
Cellulose Nanocrystals ◽  
Electronics Industry ◽  
Piezoresistive Sensor ◽  
Wide Range ◽  
Polyurethane Sponge

A wearable, lightweight and wide-range detecting piezoresistive sensor is highly desired for the development of the flexible electronics industry.

Adhesive Deposition Process Characterization for Microstructure Assembly

2021 ◽  
Author(s):  
Andriy Sherehiy ◽  
Andres Montenegro ◽  
Danming Wei ◽  
Dan O. Popa
Keyword(s):  
Flexible Electronics ◽  
Inkjet Printing ◽  
Silicon Substrate ◽  
Deposition Process ◽  
High Viscosity ◽  
Direct Write ◽  
Good Reliability ◽  
Micro Electro Mechanical Systems ◽  
Process Characterization ◽  
Multiscale Structures

Abstract Recent advancements in additive manufacturing such as Direct Write Inkjet printing introduced novel tools that allow controlled and precise deposition of fluid in nano-liter volumes, enabling fabrication of multiscale structures with submillimeter dimensions. Applications include fabrication of flexible electronics, sensors, and assembly of Micro-Electro-Mechanical Systems (MEMS). Critical challenges remain in the control of fluid deposition parameters during Inkjet printing to meet specific dimensional footprints at the microscale necessary for the assembly process of microscale structures. In this paper we characterize an adhesive deposition printing process with a piezo-electric dispenser of nano-liter volumes. Applications include the controlled delivery of high viscosity Ultraviolet (UV) and thermal curable adhesives for the assembly of the MEMS structures. We applied the Taguchi Design of Experiment (DOE) method to determine an optimal set of process parameters required to minimize the size of adhesive printed features on a silicon substrate with good reliability and repeatability of the deposition process. Experimental results demonstrate repeatable deposition of UV adhesive features with 150 μm diameter on the silicon substrate. Based on the observed wettability effect of adhesive printed onto different substrates we propose a solution for further reduction of the deposit-substrate contact area for microassembly optimization.

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