High-speed organic transistors fabricated using a novel hybrid-printing technique

2011 ◽  
Vol 12 (7) ◽  
pp. 1120-1125 ◽  
Author(s):  
Huai-Yuan Tseng ◽  
Balaji Purushothaman ◽  
John Anthony ◽  
Vivek Subramanian
Membranes ◽  
2019 ◽  
Vol 9 (6) ◽  
pp. 71 ◽  
Author(s):  
Maria Montanino ◽  
Giuliano Sico ◽  
Anna De Girolamo Del Mauro ◽  
Margherita Moreno

Printed batteries have undergone increased investigation in recent years because of the growing daily use of small electronic devices. With this in mind, industrial gravure printing has emerged as a suitable production technology due to its high speed and quality, and its capability to produce any shape of image. The technique is one of the most appealing for the production of functional layers for many different purposes, but it has not been highly investigated. In this study, we propose a LiFePO4 (LFP)-based gravure printed cathode for lithium-ion rechargeable printed batteries and investigate the possibility of employing this printing technique in battery manufacture.


2015 ◽  
Vol 799-800 ◽  
pp. 402-406 ◽  
Author(s):  
S. Hassan ◽  
Mohd Sallehuddin Yusof ◽  
M.I. Maksud ◽  
M.N. Nodin ◽  
Noor Azlina Rejab

Roll to roll process is one of the famous printing techniques that are possible to create graphic and electronic device on variable substrate by using conductive ink. Graphene is an example of material that can be used as printing ink which usually used in producing micro-scale electronic devices. Here, it is proposed that extending roll to roll printing technique into the multiple micro-scale printing fine solid line onto substrate by using graphene as a printing ink. Flexography is a high speed roll to roll printing technique commonly used in paper printing industry. And this study elaborates the feasibility of graphene as a printing ink use in combination of flexography and micro-contact or micro-flexo printing for micro fine solid line. This paper will illustrates the review of graphene in producing multiple micro-solid lines printing capability for the application of printing electronic, graphic and bio-medical.


2009 ◽  
Vol 2 ◽  
pp. 071501 ◽  
Author(s):  
Tomoki Takano ◽  
Hiroshi Yamauchi ◽  
Masaaki Iizuka ◽  
Masakazu Nakamura ◽  
Kazuhiro Kudo

2002 ◽  
Vol 736 ◽  
Author(s):  
Graciela B. Blanchet ◽  
Yueh-Lin Loo ◽  
J. A. Rogers ◽  
F. Gao ◽  
C. R. Fincher

Organic electronic systems offer the advantage of low weight and flexibility at potentially lower cost. Although the fabrication of functioning plastic transistors using approaches such as ink jet, lithography and stamping has been described i1–3, chemically compatible materials that allow for the sequential application of liquid layers is a technical barrier. Material issues maybe the Achilles heel of ultimately printing organic electronic devices as newspapers today, at high speeds and in a reel to reel process. We introduce a novel process–thermal transfer–a non-lithographic technique that enables printing multiple, successive layers via a dry additive process. This method is capable of patterning a range of organic materials at high speed over large areas with micron size resolution and excellent electrical performance. Such a dry, potentially reel-to-reel printing method may provide a practical route to realizing the expected benefits of plastics for electronics. We illustrate the viability of thermal transfer and the ability to develop suitable printable organics conductors by fabricating a functioning 4000 cm2 transistor array.


2019 ◽  
Vol 9 (1) ◽  
Author(s):  
Shohei Kumagai ◽  
Akifumi Yamamura ◽  
Tatsuyuki Makita ◽  
Junto Tsurumi ◽  
Ying Ying Lim ◽  
...  

Abstract Building on significant developments in materials science and printing technologies, organic semiconductors (OSCs) promise an ideal platform for the production of printed electronic circuits. However, whether their unique solution-processing capability can facilitate the reliable mass manufacture of integrated circuits with reasonable areal coverage, and to what extent mass production of solution-processed electronic devices would allow substantial reductions in manufacturing costs, remain controversial. In the present study, we successfully manufactured a 4-inch (c.a. 100 mm) organic single-crystalline wafer via a simple, one-shot printing technique, on which 1,600 organic transistors were integrated and characterized. Owing to their single-crystalline nature, we were able to verify remarkably high reliability and reproducibility, with mobilities up to 10 cm2 V−1 s−1, a near-zero turn-on voltage, and excellent on-off ratio of approximately 107. This work provides a critical milestone in printed electronics, enabling industry-level manufacturing of OSC devices concomitantly with lowered manufacturing costs.


2010 ◽  
Vol 49 (4) ◽  
pp. 04DK03 ◽  
Author(s):  
Kazuhiro Kudo ◽  
Tomoki Takano ◽  
Hiroshi Yamauchi ◽  
Masaaki Iizuka ◽  
Masakazu Nakamura

Author(s):  
Kailun Chen ◽  
Changqi Yan ◽  
Cable Kurwitz ◽  
Kun Cheng ◽  
Haozhi Bian

This research presents results from experimental investigations on helix-finned surface fabricated by a 3D printing technique to evaluate boiling heat transfer performance. The experiments were conducted in saturated water at atmospheric pressure. To the author’s knowledge, this is the first attempt that helical pin fins are employed in thermal management. The boiling curve of the enhanced surface was characterized by a much lower wall superheat at the same heat flux compared with plain surfaces. High-speed visualization was used to display instantaneous bubble behaviors such as the bubble departure frequency, which was obtained from analyzed images. It was observed that the helix-finned surface had higher bubble departure frequencies compared to plain surfaces and an earlier onset of nucleate boiling was noticed. It is concluded that the surface roughness and micron level cavities produced by the 3D printing technique on the helix surface are key factors to enhance boiling heat transfer. With the experience gained, dimension optimization of helical structure should be studied further to meet the needs of increased heat dissipation rate.


1970 ◽  
Vol 5 (2) ◽  
pp. 110-114
Author(s):  
C H Chiang

A printing technique to replace the usual marking practice of punching dots or scribing lines on a round tensile specimen is described. With this method the specimen surface will not be influenced by marking, hence premature failure can be avoided in high-speed testing. The printing technique is simple to apply. The printed gauge mark can be controlled to an accuracy of ± 0.002 in for a 1.4 in gauge length. The width of the printed lines is about 0.003 in.


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