Porous silica xerogel films as antireflective coatings – Fabrication and characterization

2011 ◽  
Vol 33 (12) ◽  
pp. 1989-1994 ◽  
Author(s):  
Paweł Karasiński ◽  
Janusz Jaglarz ◽  
Manuela Reben ◽  
Edyta Skoczek ◽  
Jacek Mazur
Keyword(s):  
Porous Silica ◽  
Silica Xerogel ◽  
Antireflective Coatings ◽  
Fabrication And Characterization ◽  
Xerogel Films

Fabrication and Characterization of Spin-On Silica Xerogel Films

1998 ◽  
Vol 511 ◽  
Author(s):  
S. Nitta ◽  
A. Jain ◽  
V. Pisupatti ◽  
W. N. Gill ◽  
P. C. Wayner ◽  
...  
Keyword(s):  
Activation Energy ◽  
Dielectric Constant ◽  
Convective Diffusion ◽  
Ambient Pressure ◽  
Silica Xerogel ◽  
High Porosity ◽  
Thermal Oxide ◽  
Fabrication And Characterization ◽  
Xerogel Films

ABSTRACTXerogel films of high porosity were fabricated using an ambient pressure technique. The same porosity can be obtained with different microstructures by varying the aging time of the films. The dielectric constant of these films as a function of porosity at 1 MHz follows correlations originally developed for bulk aerogels. Diffusion of copper is orders of magnitude faster in these xerogels than in the corresponding thermal oxide. An activation energy of 0.9 eV was estimated based on a convective diffusion model.

Deposition and Characterization of Porous Silica Xerogel Films

1996 ◽  
Vol 443 ◽  
Author(s):  
Changming Jin ◽  
Scott List ◽  
Stacey Yamanaka ◽  
Wei William Lee ◽  
Kelly Taylor ◽  
...  
Keyword(s):  
Dielectric Breakdown ◽  
Breakdown Strength ◽  
Average Pore Size ◽  
Porous Silica ◽  
Ambient Air ◽  
Dielectric Materials ◽  
Silica Xerogel ◽  
Dielectric Breakdown Strength ◽  
Low Permittivity ◽  
Xerogel Films

AbstractThe continued scaling of device feature size demands the use of low permittivity intermetal dielectric materials. Porous silica xerogel films have low dielectric permittivity through the incorporation of micropores into the SiO2 network. A feasible xerogel process has been developed. Crack-free and uniform silica xerogel films up to two microns in thickness with targeted porosity were readily coated. Xerogel materials completely filled 0.3 μm wide gaps with a 2:1 aspect ratio. MOSCAP measurements revealed a low permittivity and high dielectric breakdown strength. The dielectric breakdown strength is expected to be higher than that of ambient air because the average pore size of in the xerogel film is much smaller than the mean free path of the ambient air. Surface treated xerogel films were found to be hydrophobic as indicated by the absence of adsorbed moisture peaks in FTIR spectra. Xerogel films maintained their porosity after deposition of dense capping layers and a subsequent process under 700 atm Ar pressure at 400 °C. Test structures containing xerogel were successfully planarization with CMP and went through a tungsten plug deposition process without delamination nor collapsing. These results reflect the reasonable mechanical strength of xerogel films.

Modification of Porous Silica Antireflective Coatings with Fluorine-Containing Organosilicon

2009 ◽  
Vol 29 (6) ◽  
pp. 1719-1723 ◽  
Author(s):  
张清华 Zhang Qinghua ◽  
杨伟 Yang Wei ◽  
马红菊 Ma Hongju ◽  
马平 Ma Ping ◽  
许乔 Xu Qiao
Keyword(s):  
Porous Silica ◽  
Antireflective Coatings

Role of Catalyst on Refractive Index Tunability of Porous Silica Antireflective Coatings by Sol−Gel Technique

2007 ◽  
Vol 111 (23) ◽  
pp. 8291-8298 ◽  
Author(s):  
Abhilash Vincent ◽  
Suresh Babu ◽  
Erik Brinley ◽  
Ajay Karakoti ◽  
Sameer Deshpande ◽  
...  
Keyword(s):  
Refractive Index ◽  
Sol Gel ◽  
Porous Silica ◽  
Antireflective Coatings ◽  
Gel Technique

Processing and Characterization of Silica Xerogel Films for Low-K Dielectric Applications

1999 ◽  
Vol 565 ◽  
Author(s):  
Anurag Jain ◽  
Svetlana Rogojevic ◽  
Satya V. Nitta ◽  
Venumadhav Pisupatti ◽  
William N. Gill ◽  
...  
Keyword(s):  
Ambient Pressure ◽  
Concrete Surface ◽  
Dielectric Constants ◽  
Silica Xerogel ◽  
High Porosity ◽  
Wide Range ◽  
Order Of Magnitude ◽  
Lift Off ◽  
Surface Modified ◽  
Xerogel Films

AbstractSurface modified silica xerogel films of high porosity (60 - 90 %) and uniform thickness (0.4–2 μm) were fabricated at ambient pressure on silicon and silicon dioxide. The rheological properties that govern film uniformity were determined. A relation between the final dried film thickness and spin speed was developed. The porosity and thickness of the films could be controlled independently. The same porosity could be obtained over a wide range of aging time and temperature combinations. Fracture toughness was measured using the edge-lift-off technique. The best values were comparable to concrete. Surface modification was affected by treating the film with trimethylcholorosilane (TMCS) and other modifiers. Moisture adsorption was studied at 100% RH using a quartz crystal microbalance technique. Depending upon the degree and kind of surface treatment, films absorbed as much as 32% or as little as 2% of their weight in water. Dielectric constants (K), losses and breakdown strengths were comparable to values for calcined, bulk aerogels. Thin (≤ 500 Å) films of Copper (Cu) and Tantalum (Ta) were deposited on xerogel films and subjected to thermal annealing. No diffusion was observed within the limits of RBS. High-density plasma etching showed that the films etch an order of magnitude faster than conventional SiO2 films.

A fibre-optic humidity sensor based on a porous silica xerogel film as the sensing element

2010 ◽  
Vol 149 (1) ◽  
pp. 122-128 ◽  
Author(s):  
Juncal Estella ◽  
Pablo de Vicente ◽  
Jesús C. Echeverría ◽  
Julián J. Garrido
Keyword(s):  
Humidity Sensor ◽  
Porous Silica ◽  
Silica Xerogel ◽  
Fibre Optic ◽  
Sensing Element

Effects of processing history on the modulus of silica xerogel films

2001 ◽  
Vol 90 (11) ◽  
pp. 5832-5834 ◽  
Author(s):  
Anurag Jain ◽  
Svetlana Rogojevic ◽  
William N. Gill ◽  
Joel L. Plawsky ◽  
Itty Matthew ◽  
...  
Keyword(s):  
Silica Xerogel ◽  
Processing History ◽  
Xerogel Films

Preparation and characterization of porous silica xerogel film for low dielectric application

1997 ◽  
Vol 308-309 ◽  
pp. 495-500 ◽  
Author(s):  
Jung-Kyun Hong ◽  
Hee-Sun Yang ◽  
Moon-Ho Jo ◽  
Hyung-Ho Park ◽  
Se-Young Choi
Keyword(s):  
Porous Silica ◽  
Silica Xerogel ◽  
Low Dielectric
Sign in / Sign up

Export Citation Format

Share Document