scholarly journals Characteristic Mechanism of Fatigue Crack Propagation in Submicron-thick Freestanding Copper Films

2014 ◽  
Vol 3 ◽  
pp. 544-549 ◽  
Author(s):  
Toshiyuki Kondo ◽  
Hiroyuki Hirakata ◽  
Masayuki Sakihara ◽  
Kohji Minoshima
Keyword(s):  
Fatigue Crack ◽  
Crack Propagation ◽  
Fatigue Crack Propagation ◽  
Copper Films

Effects of stress ratio on fatigue crack propagation properties of submicron-thick free-standing copper films

2013 ◽  
Vol 61 (16) ◽  
pp. 6310-6327 ◽  
Author(s):  
Toshiyuki Kondo ◽  
Takahiro Imaoka ◽  
Hiroyuki Hirakata ◽  
Masayuki Sakihara ◽  
Kohji Minoshima
Keyword(s):  
Fatigue Crack ◽  
Crack Propagation ◽  
Fatigue Crack Propagation ◽  
Stress Ratio ◽  
Copper Films ◽  
Free Standing ◽  
Effects Of Stress ◽  
Propagation Properties

Mechanics of Fatigue Crack Propagation in Submicron-Thick Freestanding Copper Films

2014 ◽  
Vol 891-892 ◽  
pp. 1681-1687
Author(s):  
Hiroyuki Hirakata ◽  
Toshiyuki Kondo ◽  
Masayuki Sakihara ◽  
Kohji Minoshima
Keyword(s):  
Stress Intensity Factor ◽  
Fatigue Crack ◽  
Stress Intensity ◽  
Intensity Factor ◽  
Crack Propagation ◽  
Fatigue Crack Propagation ◽  
Fracture Mode ◽  
Dominant Factor ◽  
Tensile Fracture ◽  
Copper Films

The dominant mechanics and mechanisms of fatigue crack propagation in approximately 500-nm-thick freestanding copper films were evaluated at three stress ratios, R = 0.1, 0.5, and 0.8. The fatigue crack propagation rate (da/dN) versus stress intensity factor range (ΔK) relation was dependent on the stress ratio (R): da/dN increased with increasing R. Plots of da/dN versus the maximum stress intensity factor (Kmax) exhibited coincident features in the high-Kmax region (Kmax 4.5 MPam1/2) irrespective of R, indicating that Kmax was the dominant factor in fatigue crack propagation. In this region, the fatigue crack propagated in tensile fracture mode, or chisel-point fracture, irrespective of the R value. In contrast, in the low-Kmax region (Kmax < 4.5 MPam1/2), da/dN increased with decreasing R. In this region, the fracture mechanism depended on R. At the higher R value (R = 0.8), the fatigue crack propagated in the tensile fracture mode similar to that in the high-Kmax region. On the other hand, at the lower R values (R = 0.1 and 0.5), a characteristic mechanism of fatigue crack propagation appeared: within several grains, intrusions/extrusions formed ahead of the crack tip along the Σ3 twin boundaries, and the fatigue crack propagated preferentially through the intrusions/extrusions.

scholarly journals Crystal Rotation with Fatigue Crack Propagation in Copper Films

2005 ◽  
Vol 54 (9) ◽  
pp. 903-908 ◽  
Author(s):  
Kenichi SHIMIZU ◽  
Tashiyuki TORII ◽  
Toshiyuki MORI
Keyword(s):  
Fatigue Crack ◽  
Crack Propagation ◽  
Fatigue Crack Propagation ◽  
Copper Films ◽  
Crystal Rotation
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