scholarly journals Experimental investigation of the reliability of Printed Circuit Board (PCB)-embedded power dies with pressed contact made of metal foam

2018 ◽  
Vol 88-90 ◽  
pp. 707-714 ◽  
Author(s):  
Y. Pascal ◽  
D. Labrousse ◽  
M. Petit ◽  
S. Lefebvre ◽  
F. Costa
Keyword(s):  
Experimental Investigation ◽  
Printed Circuit Board ◽  
Metal Foam ◽  
Circuit Board ◽  
Printed Circuit ◽  
Embedded Power

scholarly journals Flat Cross-Shaped Piezoelectric Rotary Motor

2020 ◽  
Vol 10 (14) ◽  
pp. 5022
Author(s):  
Andrius Čeponis ◽  
Dalius Mažeika ◽  
Piotr Vasiljev
Keyword(s):  
Experimental Investigation ◽  
Printed Circuit Board ◽  
Rotation Speed ◽  
Circuit Board ◽  
Geometrical Parameters ◽  
Printed Circuit ◽  
Harmonic Signals ◽  
Bending Mode ◽  
The Cross ◽  
Rotary Motor

A numerical and experimental investigation of a flat, cross-shaped piezoelectric rotary motor is presented. The design and configuration of the motor allow it to be mounted directly to the printed circuit board or integrated into the other system where mounting space is limited. The design of the motor is based on the cross-shaped stator with 16 piezo ceramic plates, which are glued on it. The rotor is placed at the center of the stator and consists of two hemispheres, a shaft, and a preloading spring. Special clamping of the stator was developed as well. It consists of four V-shaped beam structures that allow it to rigidly clamp the stator with reduced damping effect to vibrations. The operation principle of the motor is based on the first in-plane bending mode of the cross-shaped stator. The motor excitation is performed through four harmonic signals, which have a phase difference of π/2. A numerical investigation of the motor was conducted to optimize the geometrical parameters of the stator and to analyze the displacement characteristics of the contacting point. The prototype of the motor was made, and the electrical, as well as rotation speed characteristics of the motor, were measured. The results of the experimental investigation showed that the motor is able to provide a maximum rotation speed of 972.62 RPM at 200 Vp-p when the preload force of 22.65 mN was applied.

Experimental investigation of microdrilling of printed circuit board

Circuit World ◽  
2013 ◽  
Vol 39 (2) ◽  
pp. 82-94 ◽  
Author(s):  
Xiaohu Zheng ◽  
Zhiqiang Liu ◽  
Qinglong An ◽  
Xibin Wang ◽  
Zongwei Xu ◽  
...  
Keyword(s):  
Experimental Investigation ◽  
Printed Circuit Board ◽  
Circuit Board ◽  
Printed Circuit

Performance Comparison Between Surface-mount and Embedded Power Modules

2019 ◽  
Vol 2019 (DPC) ◽  
pp. 000647-000670
Author(s):  
Gerald Weis
Keyword(s):  
Printed Circuit Board ◽  
State Of The Art ◽  
Circuit Board ◽  
Switching Frequency ◽  
Surface Mount ◽  
Printed Circuit ◽  
Power Transistors ◽  
Wide Range ◽  
Power Switches ◽  
Embedded Power

Increasing efficiency in power electronic circuits requires innovative cooling concepts and a low impedance connection in the power path as well as low inductance driving circuits placed as close as possible to the main power switches. A direct comparison between state-of-the-art standard surface-mount build-ups and power switches embedded directly into the printed circuit board shows the high potential of integrated electronics. Measurements at defined operating point(s) verify improved thermal performance due to more heat spreading area, as well as higher achievable switching speed. For performance benchmarking two similar versions of half bridge circuits in DC-DC buck configuration were built to be compared in measurement. The first configuration uses standard, state-of-the-art SMD packages assembled onto the module. For the second half bridge module an embedded power path was used: The power transistors (GaN HEMT devices) are mounted inside the printed circuit board (PCB) and galvanically isolated from the heat sink pad on top of the package. Both versions use exactly the same schematic, layer stack-up and copper structure on the six layers used. A slightly different laser drill configuration was necessary because embedded parts are connected by copper filled laser drill holes. This measure was taken to optimize the modules according to their technology. Each module has an NTC thermistor mounted at the same distance to the half bridge transistors, and is used to indicate the temperature of the transistor dies during measurement. To cover a wide range of operational conditions the devices under test (DUTs) were stressed under hard switching operation (HSW) as well as triangular current mode (TCM). HSW causes more stress because the opposite transistor is switched before the whole energy of Coss has been discharged. In TCM the current through the inductor is becoming negative for a short time period and discharges the Coss capacitors of the power transistors. The test conditions were set as follows: 150V, 11A with 200kHz switching frequency in HSW mode. The switching behavior is similar, because both modules uses the same power transistors. Due to less parasitic impedance at the embedded module the turn-on behavior is slightly improved at the embedded module. Embedding as a new, innovative concept is compared to standard technologies. First measurements show that the embedded DUT stays 20K below the temperature of the standard module while running at the same load current. Additionally fewer disturbances were observed at the embedded module.

Experimental Investigation on the Process-Induced Damage of a Direct Methanol Fuel Cell Assembled by the Printed Circuit Board Technique

2008 ◽  
Vol 6 (1) ◽  
Author(s):  
Yean-Der Kuan ◽  
Chia-Hao Chang
Keyword(s):  
Experimental Investigation ◽  
Fuel Cell ◽  
Process Parameters ◽  
Direct Methanol Fuel Cell ◽  
Printed Circuit Board ◽  
Circuit Board ◽  
Hot Press ◽  
Printed Circuit ◽  
Direct Methanol ◽  
Methanol Fuel Cell

The printed circuit board (PCB)-based direct methanol fuel cell (DMFC) package is a novel manufacturing and assembly process, which is full potential in mass production, and very limited literatures make study on the effects of the related process parameters. The hot press is a necessary and key process to make the PCB package, i.e., the key component of a DMFC, membrane electrode assemblies (MEA), needs to sustain a severe test. In order to minimize the process-induced damage of the MEAs, it is important to make a good control on the process parameters. Therefore, the objective of this paper is to present a methodology to explore a good combination of hot-press parameters. The considered parameters include the compression ratio of the MEA, heating time, heating temperature, and hot pressing pressure acting on the MEA. During the experimental investigation, a series of experiments was made first to discuss the effect of the individual parameter of the hot-press process on the MEA performance, wherein a reasonable range of each process parameter condition was able to be well defined. Moreover, the Taguchi experimental method was adopted to explore the parameter effects on the DMFC performance during the digital packaging process and to determine the best combination of parameter conditions. At the end, a MEA was made a hot press under the best parameter combination, which could verify the result obtained from Taguchi’s experiments. The result is able to be an important reference for the future manufacturing design guideline of PCB-based DMFC package.

Experimental Investigation on Drilling PCB Through-Holes

2012 ◽  
Vol 426 ◽  
pp. 56-59 ◽  
Author(s):  
Xiang Wang ◽  
Xiao Hu Zheng ◽  
Qing Long An ◽  
Ming Chen
Keyword(s):  
Experimental Investigation ◽  
Printed Circuit Board ◽  
Flank Wear ◽  
Circuit Board ◽  
Apparent Effect ◽  
Electronic Products ◽  
Printed Circuit ◽  
Burr Size ◽  
Increasing Demand

More and more attention is put on the machinability of printed circuit board (PCB) with the increasing demand of PCBs driven by the strong need of the market of the electronic products. In this paper, drill wear and burr size, as two main objects of experimental investigation, have been observed and analyzed in drilling PCB through-holes. The results of the drilling experiment conducted with normal drill and specialized drill, indicate that appropriate chisel edge thinning is in favor of decreasing flank wear of the drill, but has no apparent effect on reducing burr size for PCB through-holes drilling.

Characteristics of Radiated Emission from a Printed Circuit Board with a Slit

2012 ◽  
Vol 132 (6) ◽  
pp. 404-410 ◽  
Author(s):  
Kenichi Nakayama ◽  
Kenichi Kagoshima ◽  
Shigeki Takeda
Keyword(s):  
Printed Circuit Board ◽  
Circuit Board ◽  
Printed Circuit ◽  
Radiated Emission
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