Effect of Joule heating on the reliability of solder joints under power cycling conditions

2018 ◽  
Vol 88-90 ◽  
pp. 684-690 ◽  
Author(s):  
J. Mei ◽  
R. Haug ◽  
O. Lanier ◽  
T. Grözinger ◽  
A. Zimmermann
Keyword(s):  
Joule Heating ◽  
Solder Joints ◽  
Power Cycling ◽  
Reliability Of Solder Joints

Effects of Current Crowding and Joule Heating on Reliability of Solder Joints

2007 ◽  
Author(s):  
S. W. Liang ◽  
S. H. Chiu ◽  
Chih Chen ◽  
Shinichi Ogawa ◽  
Paul S. Ho ◽  
...  
Keyword(s):  
Joule Heating ◽  
Solder Joints ◽  
Current Crowding ◽  
Reliability Of Solder Joints

scholarly journals Effect of Power Cycling and Heat Aging on Reliability and IMC Growth of Sn-5Sb and Sn-10Sb Solder Joints

2018 ◽  
Vol 2018 ◽  
pp. 1-6
Author(s):  
Tatsuya Kobayashi ◽  
Ikuo Shohji ◽  
Yusuke Nakata
Keyword(s):  
Growth Kinetics ◽  
Aging Temperature ◽  
Solder Joints ◽  
High Reliability ◽  
Power Cycles ◽  
Power Cycle ◽  
Cycling Test ◽  
Power Cycling ◽  
Reliability Of Solder Joints ◽  
Kinetics Of

Power cycle reliability of solder joints with Sn-5Sb (mass%) and Sn-10Sb (mass%) alloys was investigated. The effects of power cycling and heat aging on the growth of intermetallic compound (IMC) layers at the interfaces between Sn-Sb alloys and Cu plates were also investigated. In the power cycling test, the solder joint with Sn-10Sb has high reliability compared with that of Sn-5Sb. IMC layers grew in both joints with increasing number of power cycles. Compared with Sn-5Sb and Sn-10Sb, difference in growth kinetics of IMC layers was negligible. A similar tendency was observed in the heat aging test. Compared with the power cycling and the heat aging, growth of IMC layers at the aging temperature of 200°C is faster than that in the power cycling test at the temperature range of 100°C to 200°C, while that at the aging temperature of 100°C, the growth is slower. On the basis of the comparison between the power cycling and the heat aging, it was clarified that growth kinetics of IMC layers in the power cycling can be predicted by investigating growth kinetics of the IMC layer at the temperatures in the vicinity of the peak temperature in power cycling.

scholarly journals Microstructure and shear properties of ultrasonic-assisted Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints under thermal cycling

2021 ◽  
Vol 11 (1) ◽  
Author(s):  
Jianguo Cui ◽  
Keke Zhang ◽  
Di Zhao ◽  
Yibo Pan
Keyword(s):  
Shear Strength ◽  
Thermal Cycling ◽  
Solder Joints ◽  
High Reliability ◽  
Sharp Decrease ◽  
Thermal Shock Test ◽  
Shear Properties ◽  
Equivalent Time ◽  
Ultrasonic Assisted ◽  
Reliability Of Solder Joints

AbstractThrough ultrasonic wave assisted Sn2.5Ag0.7Cu0.1RExNi/Cu (x = 0, 0.05, 0.1) soldering test and − 40 to 125 °C thermal shock test, the microstructure and shear properties of Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints under thermal cycling were studied by the SEM, EDS and XRD. The results show that the Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints with high quality and high reliability can be obtained by ultrasonic assistance. When the ultrasonic vibration power is 88 W, the ultrasonic-assisted Sn2.5Ag0.7Cu0.1RE0.05Ni/Cu solder joints exhibits the optimized performance. During the thermal cycling process, the shear strength of ultrasonic-assisted Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints had a linear relationship with the thickness of interfacial intermetallic compound (IMC). Under the thermal cycling, the interfacial IMC layer of ultrasonic-assisted Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints consisted of (Cu,Ni)6Sn5 and Cu3Sn. The thickness of interfacial IMC of ultrasonic-assisted Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints was linearly related to the square root of equivalent time. The growth of interfacial IMC of ultrasonic-assisted Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints had an incubation period, and the growth of IMC was slow within 300 cycles. And after 300 cycles, the IMC grew rapidly, the granular IMC began to merge, and the thickness and roughness of IMC increased obviously, which led to a sharp decrease in the shear strength of the solder joints. The 0.05 wt% Ni could inhibit the excessive growth of IMC, improve the shear strength of solder joints and improve the reliability of solder joints. The fracture mechanism of ultrasonic-assisted Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints changed from the ductile–brittle mixed fracture in the solder/IMC transition zone to the brittle fracture in the interfacial IMC.

Reinforced Solder Technology for Increased Reliability

2017 ◽  
Vol 2017 (1) ◽  
pp. 000641-000645
Author(s):  
Tim Jensen ◽  
Sunny Neoh ◽  
Adam Murling
Keyword(s):  
Melting Point ◽  
Solder Joint ◽  
Solder Joints ◽  
Reliability Of Solder Joints ◽  
Impact Reliability ◽  
Selection Of

Abstract The reliability of solder joints have been studied for many years. The selection of a solder for a particular application is often limited based on melting point requirements. This limits the number of options that are available for use. When alloy selection options are limited, people look to process changes to try and improve the reliability. Two such areas that have been identified that can impact reliability are bondline control and void reduction. This paper analyzes a new reinforced solder technology to maintain a consistent solder joint bondline. Experiments were also conducted to determine how best to design these preforms to minimize voiding.

A competition between stress triaxiality and joule heating on microstructure evolution and degradation of SnAgCu solder joints

2020 ◽  
Vol 54 ◽  
pp. 221-227
Author(s):  
Waluyo Adi Siswanto ◽  
M. Arun ◽  
Irina V. Krasnopevtseva ◽  
A. Surendar ◽  
Andino Maseleno
Keyword(s):  
Joule Heating ◽  
Microstructure Evolution ◽  
Solder Joints ◽  
Stress Triaxiality ◽  
Snagcu Solder
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