Cu-SiO2 hybrid bonding simulation including surface roughness and viscoplastic material modeling: A critical comparison of 2D and 3D modeling approach
2018 ◽
Vol 86
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pp. 1-9
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2013 ◽
Vol 55
(11)
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pp. 115004
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Keyword(s):
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1988 ◽
Vol 8
(4)
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pp. 13-23
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2019 ◽
Vol 311
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pp. 012061