Numerical simulations of migration and coalescence behavior of microvoids driven by diffusion and electric field in solder interconnects
2017 ◽
Vol 71
◽
pp. 71-81
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2017 ◽
2017 ◽
Vol 18
(6)
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pp. 541-547
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2021 ◽
Vol 35
(11)
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pp. 1404-1405