Using Taguchi method to obtain the optimal design of heat dissipation mechanism for electronic component packaging
2016 ◽
Vol 65
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pp. 131-141
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Keyword(s):
2020 ◽
2020 ◽
2020 ◽
2020 ◽
2019 ◽
2021 ◽
Vol 1965
(1)
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pp. 012056
2017 ◽
Vol 11
(1)
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pp. 41-48
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Keyword(s):
2019 ◽
Vol 43
(6)
◽
pp. 409-418