Lattice Boltzmann method study of effect three dimensional stacking-chip package layout on micro-void formation during encapsulation process
2016 ◽
Vol 65
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pp. 205-216
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2020 ◽
2022 ◽
Vol 171
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pp. 107236
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2015 ◽
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pp. 248-256
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2010 ◽
Vol 33
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pp. 1671-1676
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2010 ◽
Vol 39
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pp. 499-511
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Vol 229
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pp. 5022-5042
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