Thermal characterization of planar high temperature power module packages with sintered nanosilver interconnection
2016 ◽
Vol 63
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pp. 104-110
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2009 ◽
Vol 15
(8)
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pp. 1279-1285
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2016 ◽
Vol 128
(3)
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pp. 1241-1249
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Keyword(s):
2013 ◽
Vol 34
(2)
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pp. 322-340
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