Experimentation and modeling of the steady-state and transient thermal performances of a helicoidally grooved cylindrical heat pipe

2016 ◽  
Vol 62 ◽  
pp. 102-112 ◽  
Author(s):  
Améni Driss ◽  
Samah Maalej ◽  
Mohamed Chaker Zaghdoudi
Keyword(s):  
Steady State ◽  
Heat Pipe ◽  
Transient Thermal

Mathematical Modeling of a Miniature Loop Heat Pipe With Two Evaporators and Two Condensers

2009 ◽  
Author(s):  
Jentung Ku ◽  
Triem Hoang ◽  
Tamara O’Connell
Keyword(s):  
Steady State ◽  
Heat Pipe ◽  
Analytical Model ◽  
Computer Code ◽  
Loop Heat Pipe ◽  
Performance Tests ◽  
Thermal Vacuum ◽  
Start Up ◽  
Gravity Effects ◽  
Transient Thermal

A loop heat pipe (LHP) analytical model that simulates the steady state and transient thermal behaviors of LHPs with multiple evaporators and multiple condensers has recently been developed. It can be used as a stand-alone computer code or as a subroutine to general spacecraft thermal analyzers. Multi-evaporator and multi-condenser LHPs are more complex in their operation when compared to single-evaporator LHPs because of the thermal and fluid interactions among the evaporators, compensation chambers, and condensers. This analytical model has been used to simulate the thermal performance of a miniature loop heat pipe (MLHP) with two evaporators and two condensers in laboratory and thermal vacuum tests. In addition, the MLHP was tested in the laboratory under five different configurations where the relative elevations and tilts among loop components were varied so as to investigate the gravity effects on the loop performance and to verify the analytical model’s capability to predict such effects. The MLHP performance tests that were simulated included start-up, high power, heat transport limit, and heat load sharing between the two evaporators. In all tests that were modeled, the LHP analytical model accurately predicted the steady state and transient behaviors of the LHP. Furthermore, the model was run-time efficient and yielded stable solutions in all cases.

Quasi-steady-state performance of a heat pipe subjected to transient acceleration loadings

10.2514/3.895 ◽  
1997 ◽  
Vol 11 ◽  
pp. 306-309 ◽  
Author(s):  
Edwin H. Olmstead ◽  
Edward S. Taylor ◽  
Meng Wang ◽  
Parviz Moin ◽  
Scott K. Thomas ◽  
...  
Keyword(s):  
Steady State ◽  
Heat Pipe ◽  
Quasi Steady State ◽  
Steady State Performance

Finite Element Analysis of a Gasketed Flange Joint Under Combined Internal Pressure and Thermal Transient Loading

2007 ◽  
Author(s):  
Muhammad Abid ◽  
Javed A. Chattha ◽  
Kamran A. Khan
Keyword(s):  
Finite Element Analysis ◽  
Steady State ◽  
Internal Pressure ◽  
Thermal Loading ◽  
Flange Joint ◽  
Element Analysis ◽  
Transient Loading ◽  
Thermal Transient ◽  
Transient Thermal ◽  
Bolted Flange

Performance of a bolted flange joint is characterized mainly by its ‘strength’ and ‘sealing capability’. A number of analytical and experimental studies have been conducted to study these characteristics only under internal pressure loading. In the available published work, thermal behavior of the pipe flange joints is discussed under steady state loading with and without internal pressure and under transient loading condition without internal pressure. The present design codes also do not address the effects of steady state and thermal transient loading on the structural integrity and sealing ability. It is realized that due to the ignorance of any applied transient thermal loading, the optimized performance of the bolted flange joint can not be achieved. In this paper, in order to investigate gasketed joint’s performance i.e. joint strength and sealing capability under combined internal pressure and transient thermal loading, an extensive nonlinear finite element analysis is carried out and its behavior is discussed.

Steady-State Investigation of Vapor Deposited Micro Heat Pipe Arrays

1995 ◽  
Vol 117 (1) ◽  
pp. 75-81 ◽  
Author(s):  
A. K. Mallik ◽  
G. P. Peterson
Keyword(s):  
Thermal Conductivity ◽  
Steady State ◽  
Surface Temperature ◽  
Heat Pipe ◽  
Effective Thermal Conductivity ◽  
Heat Pipes ◽  
Temperature Gradients ◽  
Bottom Surface ◽  
Micro Heat Pipe ◽  
Micro Heat Pipes

An experimental investigation of vapor deposited micro heat pipe arrays was conducted using arrays of 34 and 66 micro heat pipes occupying 0.75 and 1.45 percent of the cross-sectional area, respectively. The performance of wafers containing the arrays was compared with that of a plain silicon wafer. All of the wafers had 8 × 8 mm thermofoil heaters located on the bottom surface to simulate the active devices in an actual application. The temperature distributions across the wafers were obtained using a Hughes Probeye TVS Infrared Thermal Imaging System and a standard VHS video recorder. For wafers containing arrays of 34 vapor deposited micro heat pipes, the steady-state experimental data indicated a reduction in the maximum surface temperature and temperature gradients of 24.4 and 27.4 percent, respectively, coupled with an improvement in the effective thermal conductivity of 41.7 percent. For wafers containing arrays of 66 vapor deposited micro heat pipes, the corresponding reductions in the surface temperature and temperature gradients were 29.0 and 41.7 percent, respectively, and the effective thermal conductivity increased 47.1 percent, for input heat fluxes of 4.70 W/cm2. The experimental results were compared with the results of a previously developed numerical model, which was shown to predict the temperature distribution with a high degree of accuracy, for wafers both with and without the heat pipe arrays.

Efficient Thermal Analysis of Lab-Grown Diamond Heat Spreaders

2021 ◽  
Author(s):  
Zihao Yuan ◽  
Tao Zhang ◽  
Jeroen Van Duren ◽  
Ayse K. Coskun
Keyword(s):  
Steady State ◽  
Real World ◽  
High Performance ◽  
Silicon Layer ◽  
Maximum Temperature ◽  
Cooling Performance ◽  
Thermal Models ◽  
Heat Spreaders ◽  
Transient Simulations ◽  
Transient Thermal

Abstract Lab-grown diamond heat spreaders are becoming attractive solutions compared to traditional copper heat spreaders due to their high thermal conductivity, the ability to directly bond them on silicon, and allow for an ultra-thin silicon layer. Researchers have developed various thermal models and prototypes of lab-grown diamond heat spreaders to evaluate their cooling performance and heat spreading ability. The majority of existing thermal models are built using finite-element method (FEM) based simulators such as COMSOL and ANSYS. However, such commercial simulators are computationally expensive and lead to long solution times along with large memory requirements. These limitations make commercial simulators unsuitable for evaluating numerous design alternatives or runtime scenarios for real-world high-performance processors. Because of this modeling challenge, none of the existing works have evaluated the thermal behavior of lab-grown diamond heat spreaders on real-world high-performance processors running realistic application benchmarks. Recently, we have developed a parallel compact thermal simulator, PACT, that is able to carry out fast and accurate steady-state and transient thermal simulations and can be extended to support emerging integration and cooling technologies. In this paper, we use PACT to evaluate the steady-state and transient cooling performance of lab-grown diamond heat spreaders against traditional copper heat spreaders on various real-world high-performance processors (e.g., Intel i7 6950X, IBM Power9, and PicoSoC). By using PACT with architectural performance and power simulators such as Sniper and McPAT, we are able to run transient simulations with realistic benchmarks. Simulation results show that lab-grown diamond heat spreaders achieve maximum temperature and thermal gradient reductions of up to 26.73 °C and 13.75 °C when compared to traditional copper heat spreaders, respectively. The maximum steady-state and transient simulation times of PACT for the real-world high-performance chips and realistic applications used in our experiments are 259 s and 22 min, respectively.

scholarly journals A Novel Analytical Modeling of a Loop Heat Pipe Employing Thin-Film Theory: Part II—Experimental Validation

Energies ◽  
2019 ◽  
Vol 12 (12) ◽  
pp. 2403 ◽  
Author(s):  
Eui Guk Jung ◽  
Joon Hong Boo
Keyword(s):  
Steady State ◽  
Heat Pipe ◽  
Film Theory ◽  
Design Parameters ◽  
Working Fluid ◽  
Coolant Temperature ◽  
Loop Heat Pipe ◽  
Analysis Model ◽  
Proposed Model ◽  
Flat Evaporator

Part I of this study introduced a mathematical model capable of predicting the steady-state performance of a loop heat pipe (LHP) with enhanced rationality and accuracy. Additionally, investigation of the effect of design parameters on the LHP thermal performance was also reported in Part I. The objective of Part II is to experimentally verify the utility of the steady-state analytical model proposed in Part I. To this end, an experimental device comprising a flat-evaporator LHP (FLHP) was designed and fabricated. Methanol was used as the working fluid, and stainless steel as the wall and tubing-system material. The capillary structure in the evaporator was made of polypropylene wick of porosity 47%. To provide vapor removal passages, axial grooves with inverted trapezoidal cross-section were machined at the inner wall of the flat evaporator. Both the evaporator and condenser components measure 40 × 50 mm (W × L). The inner diameters of the tubes constituting the liquid- and vapor-transport lines measure 2 mm and 4 mm, respectively, and the lengths of these lines are 0.5 m. The maximum input thermal load was 90 W in the horizontal alignment with a coolant temperature of 10 °C. Validity of the said steady-state analysis model was verified for both the flat and cylindrical evaporator LHP (CLHP) models in the light of experimental results. The observed difference in temperature values between the proposed model and experiment was less than 4% based on the absolute temperature. Correspondingly, a maximum error of 6% was observed with regard to thermal resistance. The proposed model is considered capable of providing more accurate performance prediction of an LHP.

scholarly journals Modeling of an Integrated Thermoelectric Generation–Cooling System for Thermoelectric Cooler Waste Heat Recovery

Energies ◽  
2020 ◽  
Vol 13 (18) ◽  
pp. 4691
Author(s):  
Jia Yu ◽  
Qingshan Zhu ◽  
Li Kong ◽  
Haoqing Wang ◽  
Hongji Zhu
Keyword(s):  
Steady State ◽  
Heat Source ◽  
Heat Recovery ◽  
Waste Heat Recovery ◽  
Waste Heat ◽  
Cooling System ◽  
Thermoelectric Cooler ◽  
Thermoelectric Generation ◽  
Maximum Value ◽  
Transient Thermal

This paper focuses on the problem of thermoelectric cooler waste heat recovery and utilization, and proposes taking the waste heat together with the original heat source as the input heat source of the integrated thermoelectric generation–cooling system. By establishing an analytic model of this integrated thermoelectric generation–cooling system, the steady-state and transient thermal effects of this system are analyzed. The steady-state analysis results show that the thermoelectric generator’s actual heat source is about 20% larger than the intrinsic heat source. The transient analysis results prove that the current of thermoelectric power generation and the cold end temperature of the system show a nonlinear change rate with time. The cold end temperature of the system has a maximum value. Under different intrinsic heat sources, this maximum value can be reached between 1 s and 2.5 s.

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