scholarly journals Mechanical and thermal characterization of a novel nanocomposite thermal interface material for electronic packaging

2016 ◽  
Vol 56 ◽  
pp. 129-135 ◽  
Author(s):  
Shuangxi Sun ◽  
Si Chen ◽  
Xin Luo ◽  
Yifeng Fu ◽  
Lilei Ye ◽  
...  
Keyword(s):  
Electronic Packaging ◽  
Thermal Characterization ◽  
Thermal Interface Material ◽  
Thermal Interface

Characterization of a Liquid-Metal Micro Droplets Thermal Interface Material

2010 ◽  
Author(s):  
Amer M. Hamdan ◽  
Aric R. McLanahan ◽  
Robert F. Richards ◽  
Cecilia D. Richards
Keyword(s):  
Liquid Metal ◽  
Thermal Resistance ◽  
Contact Resistance ◽  
Applied Load ◽  
Thermal Interface Material ◽  
Thermal Interface ◽  
Interface Resistance ◽  
Thermal Interface Resistance ◽  
Droplet Array

This work presents the characterization of a thermal interface material consisting of an array of mercury micro droplets deposited on a silicon die. Three arrays were tested, a 40 × 40 array (1600 grid) and two 20 × 20 arrays (400 grid). All arrays were assembled on a 4 × 4 mm2 silicon die. An experimental facility which measures the thermal resistance across the mercury array under steady state conditions is described. The thermal interface resistance of the arrays was characterized as a function of the applied load. A thermal interface resistance as low as 0.253 mm2 K W−1 was measured. A model to predict the thermal resistance of a liquid-metal micro droplet array was developed and compared to the experimental results. The model predicts the deformation of the droplet array under an applied load and then the geometry of the deformed droplets is used to predict the thermal resistance of the array. The contact resistance of the mercury arrays was estimated based on the experimental and model data. An average contact resistance was estimated to be 0.14 mm2 K W−1.

Simulation of Nano Carbon Tube (NCT) in Thermal Interface Material for Electronic Packaging Application by Using CFD Software

2014 ◽  
Vol 803 ◽  
pp. 337-342 ◽  
Author(s):  
Mazlan Mohamed ◽  
A.M. Mustafa Al Bakri ◽  
Razak Wahab ◽  
A.K. Zulhisyam ◽  
A.M. Iqbal ◽  
...  
Keyword(s):  
Electronic Packaging ◽  
Material Selection ◽  
Three Dimensional ◽  
Thermal Interface Material ◽  
Junction Temperature ◽  
Thermal Interface ◽  
Different Types ◽  
Fluent Software ◽  
Transfer Problems ◽  
Heat And Fluid Flow

This paper presents the nanocarbon tube in thermal interface material for electronic packaging application by using three dimensional numerical analysis of heat and fluid flow in computer. 3D model of electronic packaging is built using GAMBIT and simulated using FLUENT software. The study was made for a microprocessors arranged in line under different types of inlet velocities and package (chip) powers. The results are presented in terms of average junction temperature when chip powers have been increased from 2 W to 5 W. The junction temperature is been observed and it was found that the junction temperature of the electronic packaging using nanocarbon was able to wind stand the increasing in chip power from 2 W until 5 W. It also found that the material selection play important roles to control and manage the junction temperature. The strength of CFD software in handling heat transfer problems is proved to be excellent.

Characterization of a liquid–metal microdroplet thermal interface material

2011 ◽  
Vol 35 (7) ◽  
pp. 1250-1254 ◽  
Author(s):  
A. Hamdan ◽  
A. McLanahan ◽  
R. Richards ◽  
C. Richards
Keyword(s):  
Liquid Metal ◽  
Thermal Interface Material ◽  
Thermal Interface

Characterization of Thermal Contact Resistance Doped with Thermal Interface Material

2013 ◽  
Vol 30 (9) ◽  
pp. 943-950 ◽  
Author(s):  
Iswor Bajracharya ◽  
Yoshimi Ito ◽  
Wataru Nakayama ◽  
Byeong-Jun Moon ◽  
Sun-Kyu Lee
Keyword(s):  
Contact Resistance ◽  
Thermal Contact Resistance ◽  
Thermal Contact ◽  
Thermal Interface Material ◽  
Thermal Interface

Microstructural and Thermal Characterization of Copper Based Composites for Thermal Management in Electronic Packaging

2014 ◽  
Vol 976 ◽  
pp. 148-153 ◽  
Author(s):  
Carlos Alberto León ◽  
Gabriel Rodríguez-Ortiz ◽  
E.A. Aguilar-Reyes ◽  
Makoto Nanko ◽  
M. Takeda
Keyword(s):  
Electronic Packaging ◽  
Coefficient Of Thermal Expansion ◽  
Thermal Characterization ◽  
Electroless Copper Plating ◽  
Pulsed Electric Current ◽  
Alumina Particles ◽  
The Matrix ◽  
Materials Used ◽  
Thermo Physical Properties

Copper based composites with 30, 40, 50 and 60 vol.% Al2O3 were fabricated by powder metallurgy and consolidated by pulsed electric current sintering (PECS). For the purpose of determining the advantage of using coated fillers, composite alumina particles with 18 vol.% copper were prepared by electroless copper plating. Coatings were continuous and homogeneous through alumina surface. Thus, composites consolidated by the modified process increased contact between the matrix and filler, which resulted in superior thermo-physical properties. Thermal conductivities of 210-99 and 227-114 W/mK were obtained for Cu/Al2O3 made by the admixture and the coated filler method, respectively. Such superiority is mainly attributed to the continuity in the matrix phase; the thermal conductivity values observed are similar to those shown by the traditional materials used in electronic packaging. The coefficient of thermal expansion was slight lower in composites fabricated by the coated filler method; values in the ranges of 14-11 and 13-10.5 μm/m°C were obtained for the admixture and the coated filler method, respectively.

Modeling and Experimental Characterization of Metal Microtextured Thermal Interface Materials

2013 ◽  
Vol 136 (1) ◽  
Author(s):  
R. Kempers ◽  
A. M. Lyons ◽  
A. J. Robinson
Keyword(s):  
Thermal Resistance ◽  
Contact Resistance ◽  
Thermal Contact Resistance ◽  
Thermal Contact ◽  
Thermal Interface Material ◽  
Small Scale ◽  
Thermal Interface Materials ◽  
Thermal Interface ◽  
Main Challenge

A metal microtextured thermal interface material (MMT-TIM) has been proposed to address some of the shortcomings of conventional TIMs. These materials consist of arrays of small-scale metal features that plastically deform when compressed between mating surfaces, conforming to the surface asperities of the contacting bodies and resulting in a low-thermal resistance assembly. The present work details the development of an accurate thermal model to predict the thermal resistance and effective thermal conductivity of the assembly (including contact and bulk thermal properties) as the MMT-TIMs undergo large plastic deformations. The main challenge of characterizing the thermal contact resistance of these structures was addressed by employing a numerical model to characterize the bulk thermal resistance and estimate the contribution of thermal contact resistance. Furthermore, a correlation that relates electrical and thermal contact resistance for these MMT-TIMs was developed that adequately predicted MMT-TIM properties for several different geometries. A comparison to a commercially available graphite TIM is made as well as suggestions for optimizing future MMT-TIM designs.

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