Stress in three-dimensionally integrated sensor systems

2016 ◽  
Vol 61 ◽  
pp. 3-10 ◽  
Author(s):  
Lado Filipovic ◽  
Siegfried Selberherr
Keyword(s):  
Sensor Systems ◽  
Integrated Sensor

scholarly journals Using the Variable Geometry in a Planar Inductor for an Optimised Performance

Electronics ◽  
2021 ◽  
Vol 10 (6) ◽  
pp. 721
Author(s):  
Maha Aldoumani ◽  
Baris Yuce ◽  
Dibin Zhu
Keyword(s):  
Smart Cities ◽  
Theoretical Concept ◽  
Displacement Sensor ◽  
Sensor Systems ◽  
Performance Modelling ◽  
Integrated Sensor ◽  
Complex Information ◽  
Electromagnetic Sensor ◽  
The Individual ◽  
Uncertainty Models

In this paper, the performance, modelling and application of a planar electromagnetic sensor are discussed. Due to the small size profiles and their non-contact nature, planar sensors are widely used due to their simple and basic design. The paper discusses the experimentation and the finite element modelling (FEM) performed for developing the design of planar coils. In addition, the paper investigates the performance of various topologies of planar sensors when they are used in inductive sensing. This technique has been applied to develop a new displacement sensor. The ANSYS Maxwell FEM package has been used to analyse the models while varying the topologies of the coils. For this purpose, different models in FEM were constructed and then tested with topologies such as circular, square and hexagon coil configurations. The described methodology is considered an effective way for the development of sensors based on planar coils with better performance. Moreover, it also confirms a good correlation between the experimental data and the FEM models. Once the best topology is chosen based on performance, an optimisation exercise was then carried out using uncertainty models. That is, the influence of variables such as number of turns and the spacing between the coils on the output inductance has been investigated. This means that the combined effects of these two variables on the output inductance was studied to obtain the optimum values for the number of turns and the spacing between the coils that provided the highest level of inductance from the coils. Integrated sensor systems are a pre-requisite for developing the concept of smart cities in practice due to the fact that the individual sensors can hardly meet the demands of smart cities for complex information. This paper provides an overview of the theoretical concept of smart cities and the integrated sensor systems.

The European 3D Heterogeneous Integration Platform (e-BRAINS) - a Particular Focus on Reliability and Low-Temperature Processes for 3D Integrated Sensor Systems

2015 ◽  
Vol 2015 (DPC) ◽  
pp. 001847-001884
Author(s):  
Peter Ramm ◽  
Armin Klumpp ◽  
Alan Mathewson ◽  
Kafil M. Razeeb ◽  
Reinhard Pufall
Keyword(s):  
Low Temperature ◽  
Heterogeneous Integration ◽  
Sensor Systems ◽  
Wafer Level ◽  
3D Integration ◽  
Integrated Sensor ◽  
Integration Platform ◽  
Ultrasonic Agitation ◽  
Bonding Technology ◽  
Low Temperature Bonding

The European 3D heterogeneous integration platform has been established by the consortium of the Integrated Project e-BRAINS [1], where technologies of the following relevant main categories of 3D integration are provided to enable future applications of smart sensor systems:3D System-on-Chip Integration - 3D-SOC: TSV technology for stacking of thinned devices or large IC blocks (global level),3D Wafer-Level-Packaging - 3D-WLP: embedding technology with through-polymer vias (TPV) for stacking of thinned ICs on wafer-level (no TSV), and3D System-in-Package - 3D-SIP: 3D stacking of packaged devices or substrates *definitions according to [2] Regarding TSV performance, the applications do not need ultra-high vertical interconnect densities as for 3D stacked Integrated Circuits – 3D-SIC*. Nevertheless, the lateral sizes of the TSVs are preferably minimized to allow for place and route for small “open” IC areas. Smaller TSVs are also preferred in order to reduce thermo-mechanical stress. e-BRAINS' focus is on how heterogeneous integration and sensor device technologies can be combined to bring new performance levels to targeted applications with high market potentials. The consortium, under coordination of Infineon and technical management by Fraunhofer EMFT, is composed of major European system manufacturers (Infineon, Siemens, SensoNor, 3D PLUS, Vermon and IQE), SMEs (DMCE, Magna Diagnostics, SORIN and eesy-ID), the large research institutions CEA Grenoble, Fraunhofer (EMFT Munich & IIS-EAS Dresden), imec, SINTEF, Tyndall and ITE Warsaw, and universities (EPFL Lausanne, TU Chemnitz and TU Graz). Target applications include automotive, ambient living and medical devices, with a specific focus on wireless sensor systems. Concerning the enabling 3D Heterogeneous Integration Platform, the e-BRAINS partners are working close together, where Infineon, Fraunhofer EMFT, imec and SINTEF are focusing mainly on 3D-SOC and 3D-WLP, and the French system manufacturer 3D PLUS and Tyndall on 3D-WLP and 3D-SIP technologies. The focus of this paper is on low-temperature bonding processes for highly reliable 3D integrated sensor systems. One of the key issues for heterogeneous systems production is the impact of 3D processes to the reliability of the product, i.e. the high built-in stresses caused by e.g. the CTE mismatch of complex layer structures (thin Si, ILDs, metals etc.) in combination with elevated bonding temperatures. As consequence, extensive project work was dedicated in the developments of reliable low-temperature bonding processes. Mainly intermetallic compound (IMC) bonding with Cu/Sn metal systems supported by ultrasonic agitation (Fraunhofer EMFT) was successfully introduced in 3D integration technology (see Fig. 2). A copper/tin solid-liquid interdiffusion (SLID) system was investigated using ultrasonic agitation to reduce the assembly temperature below the melting point of tin. Cleaning procedures are important shortly before joining the samples; dry cleaning has best results due to removal of thin oxide layers. Figure 2 shows a cross section of US supported Cu/Sn bonding at 150C. The intermetallic compounds Cu3Sn and Cu6Sn5 as well as pure tin easily can be identified. Due to low temperature assembly the most stable intermetallic compound (IMC) Cu3Sn has a minor share of the metal system. Most importantly there is no gap between top and bottom part of the joint despite the macroscopic assembly temperature is far away from the melting point of tin. But maybe the ultrasonic agitation brings enough energy to the interfaces, so locally melting can occur. In this way robust IMC bonding technology at 150C could be demonstrated with shear forces of 17 MPa and an alignment accuracy of 3 μm, well-suited for 3D integration. Figure 2: Low-temperature IMC bonding technology using ultrasonic agitation (Fraunhofer EMFT) Reliability for SLID contacts is certainly a very challenging objective especially looking for robust solutions in automotive applications. Thermally induced mechanical stress is the main reason for early fails during temperature cycling. Cross sectioned samples were investigated and methods like nanoindentation, Raman spectroscopy, fibDAC, and high local resolution x-ray scattering were applied to measure the intrinsic stresses. It can be shown that low temperature bonding is the right approach to avoid excessive stress cracking the interface or even fracturing the silicon. Also fatigue of metals can be reduced in a range that plastic deformation is no lifetime limiting factor.

2P1-C17 Development of Very Small High Power Motor Driver with Integrated Sensor Systems for Humanoid

2010 ◽  
Vol 2010 (0) ◽  
pp. _2P1-C17_1-_2P1-C17_4
Author(s):  
Nobuyuki Ito ◽  
Junichi Urata ◽  
Yuto Nakanishi ◽  
Kei Okada ◽  
Masayuki Inaba
Keyword(s):  
High Power ◽  
Sensor Systems ◽  
Integrated Sensor

scholarly journals Flexographic and Inkjet Printing of Polymer Optical Waveguides for Fully Integrated Sensor Systems

2014 ◽  
Vol 15 ◽  
pp. 521-529 ◽  
Author(s):  
Tim Wolfer ◽  
Patrick Bollgruen ◽  
Dario Mager ◽  
Ludger Overmeyer ◽  
Jan G. Korvink
Keyword(s):  
Inkjet Printing ◽  
Optical Waveguides ◽  
Sensor Systems ◽  
Integrated Sensor ◽  
Fully Integrated

A High Temperature SOI-CMOS Chipset Focusing Sensor Electronics for Operating Temperatures up to 300 °C

2021 ◽  
Vol 2021 (HiTEC) ◽  
pp. 000018-000024
Author(s):  
Holger Kappert ◽  
Sebastian Braun ◽  
Norbert Kordas ◽  
Andre Kosfeld ◽  
Alexander Utz ◽  
...  
Keyword(s):  
High Temperature ◽  
Flip Chip ◽  
Mechanical Load ◽  
Industrial Processes ◽  
Sensor Systems ◽  
Integrated Sensor ◽  
Chip Technology ◽  
Operating Temperatures ◽  
Silver Sintering ◽  
Soi Cmos

Abstract Sensors are key elements for capturing environmental properties and are increasingly important in the industry for the intelligent control of industrial processes. While in many everyday objects highly integrated sensor systems are already state of the art, the situation in an industrial environment is clearly different. Frequently the use of sensor systems is impossible, because the extreme ambient conditions of industrial processes like high operating temperatures or strong mechanical load do not allow a reliable operation of sensitive electronic components. Fraunhofer is running the Lighthouse Project ‘eHarsh’ to overcome this hurdle. In the course of the project an integrated sensor readout electronic has been realized based on a set of three chips. A dedicated sensor frontend provides the analog sensor interface for resistive sensors typically arranged in a Wheatstone configuration. Furthermore, the chipset includes a 32-bit microcontroller for signal conditioning and sensor control. Finally, it comprises an interface chip including a bus transceiver and voltage regulators. The chipset has been realized in a high temperature 0.35 micron SOI-CMOS technology focusing operating temperatures up to 300 °C. The chipset is assembled on a multilayer ceramic LTCC-board using flip chip technology. The ceramic board consists of 4 layers with a total thickness of approx. 0.9 mm. The internal wiring is based on silver paste while external contacts were alternatively manufactured in silver (sintering/soldering) or in gold-alloys (wire bonding). As interconnection technology, silver sintering has been applied. It has already been shown that a significant increase in lifetime can be reached by using silver sintering for die attach applications. Using silver sintering for flip chip technology is a new and challenging approach. By adjusting the process parameter geared to the chipset design and the design of the ceramic board high quality flip chip interconnects can be generated.

Optical Fibers in Integrated Molecular Sensor Systems – More Than Interconnects

2012 ◽  
Vol 1438 ◽  
Author(s):  
Xuan Yang ◽  
Claire Gu
Keyword(s):  
Optical Fibers ◽  
Optical Power ◽  
Building Blocks ◽  
Optical Systems ◽  
Sensor Systems ◽  
Integrated Sensor ◽  
Molecular Sensors ◽  
Surface Enhanced Raman ◽  
Potential Applications ◽  
Enhanced Raman Scattering

ABSTRACTOptical fibers have been successfully used in long-haul communication, endoscopy, and other optical systems to transmit optical power as well as information from one point to another, serving as interconnects at various scales. In integrated sensor systems, optical fibers have been frequently employed to connect the source and the detector, due to their flexibility, compactness, and low loss. However, optical fibers can provide more functions than a simple transmission channel. In this paper, we review our work on optical fibers as a platform for molecular sensors based on Raman spectroscopy (RS) and surface enhanced Raman scattering (SERS). The fibers serve to significantly increase the sensitivity of RS/SERS and to facilitate the integration of a compact sensor system. We will discuss the principles of operation of various building blocks, demonstrate our recent results, and highlight some potential applications.

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