Low-cycle fatigue failure behavior and life evaluation of lead-free solder joint under high temperature

2014 ◽  
Vol 54 (12) ◽  
pp. 2922-2928 ◽  
Author(s):  
Yongxin Zhu ◽  
Xiaoyan Li ◽  
Ruiting Gao ◽  
Chao Wang
Keyword(s):  
High Temperature ◽  
Solder Joint ◽  
Fatigue Failure ◽  
Low Cycle Fatigue ◽  
Lead Free ◽  
Failure Behavior ◽  
Lead Free Solder ◽  
Cycle Fatigue ◽  
Life Evaluation ◽  
Free Solder

Low-cycle fatigue behavior and mechanisms of a lead-free solder 96.5Sn/3.5Ag

2002 ◽  
Vol 31 (2) ◽  
pp. 142-151 ◽  
Author(s):  
Chaosuan Kanchanomai ◽  
Yukio Miyashita ◽  
Yoshiharu Mutoh
Keyword(s):  
Low Cycle Fatigue ◽  
Fatigue Behavior ◽  
Lead Free ◽  
Lead Free Solder ◽  
Cycle Fatigue ◽  
Free Solder

A Basic Study on Creep-Fatigue Damages Interaction for Sn-3.0Ag-0.5Cu as Lead Free Solder Material

2015 ◽  
Author(s):  
Hirokazu Oriyama ◽  
Takashi Kawakami ◽  
Takahiro Kinoshita
Keyword(s):  
Solder Joint ◽  
Fatigue Damage ◽  
Solder Joints ◽  
Mechanical Design ◽  
Low Cycle Fatigue ◽  
Creep Damage ◽  
Lead Free ◽  
Lead Free Solder ◽  
Creep Fatigue ◽  
Free Solder

Sn-Ag-Cu solder materials have been widely used for the mount process of electronics devices or semiconductor packages on print circuit board (PCB). The solder joints are sometimes opened under thermal cyclic loads as low cycle fatigue phenomenon. The fatigue life of solder joint has been investigated by many researchers with experimental and numerical methods. Generally, the induced thermal stress in solder joints should be relaxed as soon and creep damage is considered to be ignored in order to estimate lives of joints. However, it is probable that long term stress is applied to solder joints by the elastic follow-up phenomenon which are depending on the stiffness ratio between solder joints and the electronics device, because the elastic strain in PCB or the electronics device shifts to creep strain in solder joints gradually during a long time. Then the creep damage of solder joint should be counted for the mechanical design of mounted PCBs. And it is known that the interaction between creep damage and fatigue damage significantly shorten the life. In this study, it was discussed whether the interaction between fatigue damage and creep damage has to be considered or not for the mechanical design of the lead free solder joint with basic creep-fatigue tests at an elevated temperature.

A Study on Strain Concentration Around V Notch in Lead Free Solder Material and the Low Cycle Fatigue Life

2015 ◽  
Author(s):  
Takashi Kawakami ◽  
Takahiro Kinoshita ◽  
Hirokazu Oriyama
Keyword(s):  
Fatigue Life ◽  
Solder Joints ◽  
Low Cycle Fatigue ◽  
Lead Free ◽  
Design Rule ◽  
Lead Free Solder ◽  
Cycle Fatigue ◽  
Stress Strain ◽  
Test Pieces ◽  
Free Solder

Solder joints are sometimes opened under thermal cyclic loads as low cycle fatigue phenomena. The fatigue crack is usually initiated around the edge of the interface where stress and strain very severely concentrate, having stress strain singularity. In this study, Sn-3.0Ag-0.5Cu test pieces with V shape notch were supplied to low cycle fatigue tests at 100°C. And inelastic stress strain simulations, which were based on time-dependent non-unified material model, were carried out under several cyclic load levels to obtain strain distributions around the bottom of the V notch. By results of fatigue test and inelastic simulation, the depth from the bottom of the V notch, where the strain range agrees with the prediction of the fatigue life based on smooth test pieces on Coffin-Manson rule, was investigated as the mechanical design rule for lead free solder joints.

Implementation of a High-Temperature Inelastic Constitutive Model in FEM and Application to Lead-Free Solder Joint Analysis

2002 ◽  
Vol 2002.15 (0) ◽  
pp. 771-772
Author(s):  
Mineo KOBAYASHI ◽  
Minoru MUKAI ◽  
Hiroyuki TAKAHASHI ◽  
Tomofumi ISHIKAWA ◽  
Takashi KAWAKAMI ◽  
...  
Keyword(s):  
High Temperature ◽  
Solder Joint ◽  
Constitutive Model ◽  
Lead Free ◽  
Joint Analysis ◽  
Lead Free Solder ◽  
Free Solder

S031021 A Study on Low Cycle Fatigue Strength Properties of Lead Free Solder Materials

2011 ◽  
Vol 2011 (0) ◽  
pp. _S031021-1-_S031021-3
Author(s):  
Syungo SATAKE ◽  
Takashi KAWAKAMI ◽  
Takahiro KINOSHITA ◽  
Hiroyuki KOBAYASHI ◽  
Tetsuya KUGIMIYA ◽  
...  
Keyword(s):  
Fatigue Strength ◽  
Low Cycle Fatigue ◽  
Strength Properties ◽  
Lead Free ◽  
Lead Free Solder ◽  
Cycle Fatigue ◽  
Free Solder
Sign in / Sign up

Export Citation Format

Share Document