Evaluation new corner stress relief structure layout for high robust metallization

2014 ◽  
Vol 54 (9-10) ◽  
pp. 1977-1981
Author(s):  
V. Hein ◽  
J. Kludt ◽  
K. Weide-Zaage
Keyword(s):  
Stress Relief ◽  
Relief Structure ◽  
Structure Layout

Development of a focusing micromirror device with an in-plane stress relief structure in SOI technology

2013 ◽  
Author(s):  
Wolfgang Kronast ◽  
Ulrich Mescheder ◽  
Bernhard Müller ◽  
Rolf Huster
Keyword(s):  
Plane Stress ◽  
Stress Relief ◽  
Relief Structure ◽  
Soi Technology

TEM investigations of surface residual stress relaxation in A12O3 and Al2O3-SiC nanocomposite

1994 ◽  
Vol 52 ◽  
pp. 628-629
Author(s):  
J. Fang ◽  
H. M. Chan ◽  
M. P. Harmer
Keyword(s):  
Residual Stress ◽  
Single Phase ◽  
Stress Relief ◽  
Stress Recovery ◽  
Surface Residual Stress ◽  
Microscopic Mechanism ◽  
Sic Particles ◽  
Annealing Procedure ◽  
The Difference ◽  
Nano Size

It was Niihara et al. who first discovered that the fracture strength of Al2O3 can be increased by incorporating as little as 5 vol.% of nano-size SiC particles (>1000 MPa), and that the strength would be improved further by a simple annealing procedure (>1500 MPa). This discovery has stimulated intense interest on Al2O3/SiC nanocomposites. Recent indentation studies by Fang et al. have shown that residual stress relief was more difficult in the nanocomposite than in pure Al2O3. In the present work, TEM was employed to investigate the microscopic mechanism(s) for the difference in the residual stress recovery in these two materials.Bulk samples of hot-pressed single phase Al2O3, and Al2O3 containing 5 vol.% 0.15 μm SiC particles were simultaneously polished with 15 μm diamond compound. Each sample was cut into two pieces, one of which was subsequently annealed at 1300° for 2 hours in flowing argon. Disks of 3 mm in diameter were cut from bulk samples.

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