A review of the use of electro-thermal simulations for the analysis of heterostructure FETs

2007 ◽  
Vol 47 (1) ◽  
pp. 65-73 ◽  
Author(s):  
Giovanna Sozzi ◽  
Roberto Menozzi
Keyword(s):  
Heterostructure Fets ◽  
Thermal Simulations

Failure Analysis Strategies for Multistacked Memory Devices with TSV Interconnects

2015 ◽  
Author(s):  
Frank Altmann ◽  
Christian Grosse ◽  
Falk Naumann ◽  
Jens Beyersdorfer ◽  
Tony Veches
Keyword(s):  
Failure Analysis ◽  
Focused Ion Beam ◽  
Failure Modes ◽  
Ion Beam ◽  
Memory Devices ◽  
Metallographic Cross Section ◽  
Electron Beam Induced Current ◽  
Thermal Simulations ◽  
Lock In ◽  
Non Destructive

Abstract In this paper we will demonstrate new approaches for failure analysis of memory devices with multiple stacked dies and TSV interconnects. Therefore, TSV specific failure modes are studied on daisy chain test samples. Two analysis flows for defect localization implementing Electron Beam Induced Current (EBAC) imaging and Lock-in-Thermography (LIT) as well as adapted Focused Ion Beam (FIB) preparation and defect characterization by electron microscopy will be discussed. The most challenging failure mode is an electrical short at the TSV sidewall isolation with sub-micrometer dimensions. It is shown that the leakage path to a certain TSV within the stack can firstly be located by applying LIT to a metallographic cross section and secondly pinpointing by FIB/SEM cross-sectioning. In order to evaluate the potential of non-destructive determination of the lateral defect position, as well as the defect depth from only one LIT measurement, 2D thermal simulations of TSV stacks with artificial leakages are performed calculating the phase shift values per die level.

An Engine Heat Transfer Model for Comprehensive Thermal Simulations

2006 ◽  
Author(s):  
Filip Kitanoski ◽  
Wolfgang Puntigam ◽  
Martin Kozek ◽  
Josef Hager
Keyword(s):  
Heat Transfer ◽  
Heat Transfer Model ◽  
Transfer Model ◽  
Thermal Simulations

scholarly journals Sensors in the Autoclave-Modelling and Implementation of the IoT Steam Sterilization Procedure Counter

Sensors ◽  
2021 ◽  
Vol 21 (2) ◽  
pp. 510
Author(s):  
Lukas Boehler ◽  
Mateusz Daniol ◽  
Ryszard Sroka ◽  
Dominik Osinski ◽  
Anton Keller
Keyword(s):  
The Body ◽  
Surgical Instruments ◽  
Sensor System ◽  
Temperature Profiles ◽  
Measured Temperature ◽  
Steam Sterilization ◽  
Automated Evaluation ◽  
Normative Requirements ◽  
Thermal Simulations ◽  
The Relationship

Surgical procedures involve major risks, as pathogens can enter the body unhindered. To prevent this, most surgical instruments and implants are sterilized. However, ensuring that this process is carried out safely and according to the normative requirements is not a trivial task. This study aims to develop a sensor system that can automatically detect successful steam sterilization on the basis of the measured temperature profiles. This can be achieved only when the relationship between the temperature on the surface of the tool and the temperature at the measurement point inside the tool is known. To find this relationship, the thermodynamic model of the system has been developed. Simulated results of thermal simulations were compared with the acquired temperature profiles to verify the correctness of the model. Simulated temperature profiles are in accordance with the measured temperature profiles, thus the developed model can be used in the process of further development of the system as well as for the development of algorithms for automated evaluation of the sterilization process. Although the developed sensor system proved that the detection of sterilization cycles can be automated, further studies that address the possibility of optimization of the system in terms of geometrical dimensions, used materials, and processing algorithms will be of significant importance for the potential commercialization of the presented solution.

Numerical Thermal Simulation of Cryogenic Power Modules Under Liquid Nitrogen Cooling

2005 ◽  
Vol 128 (3) ◽  
pp. 267-272 ◽  
Author(s):  
Hua Ye ◽  
Harry Efstathiadis ◽  
Pradeep Haldar
Keyword(s):  
Liquid Nitrogen ◽  
Electrical Current ◽  
Oxide Semiconductor ◽  
Junction Temperature ◽  
Electronic Systems ◽  
Power Module ◽  
Power Modules ◽  
Allowable Range ◽  
Liquid Nitrogen Cooling ◽  
Thermal Simulations

Understanding the thermal performance of power modules under liquid nitrogen cooling is important for the design of cryogenic power electronic systems. When the power device is conducting electrical current, heat is generated due to Joule heating. The heat needs to be efficiently dissipated to the ambient in order to keep the temperature of the device within the allowable range; on the other hand, it would be advantageous to boost the current levels in the power devices to the highest possible level. Projecting the junction temperature of the power module during cryogenic operation is a crucial step in designing the system. In this paper, we present the thermal simulations of two different types of power metal-oxide semiconductor field effect transistor modules used to build a cryogenic inverter under liquid nitrogen pool cooling and discussed their implications on the design of the system.

Compact model of power MOSFET with temperature dependent Cauer RC network for more accurate thermal simulations

2014 ◽  
Vol 94 ◽  
pp. 44-50 ◽  
Author(s):  
Juraj Marek ◽  
Aleš Chvála ◽  
Daniel Donoval ◽  
Patrik Príbytný ◽  
Marián Molnár ◽  
...  
Keyword(s):  
Compact Model ◽  
Temperature Dependent ◽  
Power Mosfet ◽  
Thermal Simulations

Chip and Board Scale Transient Thermal Simulations for Power MOS Devices Reliability Analysis

2021 ◽  
Author(s):  
Madalin Vasile Moise ◽  
Paul Svasta ◽  
Norocel Codreanu ◽  
Ciprian Ionescu ◽  
Mihaela Pantazica ◽  
...  
Keyword(s):  
Reliability Analysis ◽  
Mos Devices ◽  
Transient Thermal ◽  
Thermal Simulations

Erwärmung von Kugelgewindetrieben*/Heating of ball screws - Time- and position-dependent heat sources in thermal simulations and experiments

2015 ◽  
Vol 105 (07-08) ◽  
pp. 475-481
Author(s):  
W. Maier
Keyword(s):  
Ball Screw ◽  
Experimental Temperature ◽  
Heat Sources ◽  
Infrared Sensor ◽  
Transient Model ◽  
Ir Sensors ◽  
Thermal Transient ◽  
Thermal Simulations

In diesem Fachaufsatz wird die Entwicklung eines thermischen „Matlab Simscape“-Modells vorgestellt. Das geometrisch und zeitlich thermisch transiente Modell „SimTherm“ erlaubt die Berechnung der Erwärmung und Ausdehnung eines Kugelgewindetriebs. Das Modell wird anhand experimenteller Untersuchungen bezüglich der Temperaturverteilung validiert. Die Temperaturen der Kugelgewindetrieb-Spindel werden hierbei ortsvariabel mittels eines Infrarot (IR)-Sensors lokal auf der Spindeloberfläche ermittelt.   This paper presents the development of a thermal “Matlab Simscape“ model. The geometrically and timewise thermal-transient model called “SimTherm“ makes it possible to calculate the temperature and the expansion of ball screws. The model is validated with experimental temperature tests. The temperature of the ball screw spindle is established locally on the spindle surface by using an infrared sensor.

Technology Focus: Wellbore Tubulars (July 2021)

2021 ◽  
Vol 73 (07) ◽  
pp. 50-50
Author(s):  
Robello Samuel
Keyword(s):  
Geothermal Energy ◽  
Elevated Temperatures ◽  
Clean Energy ◽  
Well Integrity ◽  
The Future ◽  
Geothermal Wells ◽  
Abandoned Wells ◽  
Thermal Simulations ◽  
Technology Focus

How we think about the future of the pipe industry must evolve. How must tubular design and manufacturing change as we transition to clean energy? Geothermal energy is an area that needs attention and, further, needs very specific attention on tubulars. Tubulars are an important component in the construction of geothermal wells, and we must align our requirements for geothermal energy. Some of the main challenges encountered in geothermal wells are corrosion and scaling. Moreover, temperature becomes a major consideration for tubulars, even more so with the temperature excursion during geothermal production. Perhaps the critical aspect in the design of the geothermal wells involves casing selection and design. Beyond manufacturing casing pipes to withstand these problems, considering the manufacturing of other components, such as connections, float collars, and float shoes, also is essential. Thermal expansion and thermal excursion of casings are well-integrity concerns; thus, casing design is important for long-term sustainability of geothermal wells. Apart from thermal simulations, guidelines and software are needed to undergird the designs to withstand not only temperature excursions but also thermomechanical and thermochemical loadings. Engineered nonmetallic casings also provide an alternative solution because they provide the desired strength and corrosion resistance in addition to meeting the goals of sustainability. Undoubtedly, the future of the tubular industry is going to be revitalized. The question now is how we can retrofit existing abandoned wells for this purpose. Recommended additional reading at OnePetro: www.onepetro.org. SPE 199570 - Special Considerations for Well-Tubular Design at Elevated Temperatures by Gang Tao, C-FER Technologies, et al.

Simulation and Characterization of Nanoparticle Thermal Conductivity for a Microscale Selective Laser Sintering System

2021 ◽  
Author(s):  
Joshua Grose ◽  
Obehi G. Dibua ◽  
Dipankar Behera ◽  
Chee S. Foong ◽  
Michael Cullinan
Keyword(s):  
Thermal Conductivity ◽  
Selective Laser Sintering ◽  
Primary Source ◽  
Laser Sintering ◽  
Metal Nanoparticle ◽  
Feature Size ◽  
Cad Models ◽  
Minimum Feature Size ◽  
Geometric Arrangements ◽  
Thermal Simulations

Abstract Additive Manufacturing (AM) technologies are often restricted by the minimum feature size of parts they can repeatably build. The microscale selective laser sintering (μ-SLS) process, which is capable of producing single micron resolution parts, addresses this issue directly. However, the unwanted dissipation of heat within the powder bed of a μ-SLS device during laser sintering is a primary source of error that limits the minimum feature size of the producible parts. A particle scale thermal model is needed to characterize the thermal properties of the nanoparticles undergoing sintering and allow for the prediction of heat affected zones (HAZ) and the improvement of final part quality. Thus, this paper presents a method for the determination of the effective thermal conductivity of metal nanoparticle beds in a microscale selective laser sintering process using finite element simulations in ANSYS. CAD models of nanoparticle groups at various timesteps during sintering are developed from Phase Field Modeling (PFM) output data, and steady state thermal simulations are performed on each group. The complete simulation framework developed in this work is adaptable to particle groups of variable sizes and geometric arrangements. Results from the thermal models are used to estimate the thermal conductivity of the copper nanoparticles as a function of sintering duration.

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