Interfacial delamination and fatigue life estimation of 3D solder bumps in flip-chip packages
2004 ◽
Vol 44
(3)
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pp. 471-483
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1999 ◽
Vol 65
(636)
◽
pp. 1690-1695
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2001 ◽
Vol 44
(4)
◽
pp. 567-572
◽
Keyword(s):
Keyword(s):
Keyword(s):
1997 ◽
Vol 119
(2)
◽
pp. 161-170
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Keyword(s):