Towards better characterizing thermal conductivity of cement-based materials: The effects of interfacial thermal resistance and inclusion size

2018 ◽  
Vol 157 ◽  
pp. 105-118 ◽  
Author(s):  
Shilang Xu ◽  
Jiahan Liu ◽  
Qiang Zeng
Keyword(s):  
Thermal Conductivity ◽  
Thermal Resistance ◽  
Inclusion Size ◽  
Interfacial Thermal Resistance ◽  
Cement Based Materials

scholarly journals Effect of Micro- to Nanosize Inclusions upon the Thermal Conductivity of Powdered Composites with High and Low Interface Resistance

2015 ◽  
Vol 2015 ◽  
pp. 1-8 ◽  
Author(s):  
Muhammad Zain-ul-abdein ◽  
Waqas S. Awan ◽  
Hassan Ijaz ◽  
Aqeel A. Taimoor ◽  
Ayyaz Muhammad ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Thermal Resistance ◽  
Volume Fraction ◽  
Effective Properties ◽  
Theoretical Models ◽  
Inclusion Size ◽  
Interfacial Thermal Resistance ◽  
Interfacial Resistance ◽  
Filler Volume Fraction ◽  
The Matrix

Materials for thermal management application require better control over the thermophysical properties, which has largely been achieved by fabricating powdered composite. There are, however, several factors like filler volume fraction, shape morphology, inclusion size, and interfacial thermal resistance that limit the effective properties of the medium. This paper presents a methodology to estimate the effective thermal conductivity of powdered composites where the filler material is more conductive than the matrix. Only a few theoretical models, such as Hasselman and Johnson (HJ) model, include the effect of interfacial resistance in their formulation. Nevertheless, HJ model does not specify the nature of the interfacial thermal resistance. Although Sevostianov and Kachanov (SK) method takes care of interface thickness, they, on the other hand, have not taken into account the interfacial resistance due to atomic imperfections. In the present work, HJ model has been modified using SK method and the results were compared with experimental ones from the literature. It has been found that the effect of interfacial resistance is significant in highly resistive medium at microscale compared to nanoscale, such as Cu/diamond system, while, in a highly conductive medium, like bakelite/graphite system, the effect of shape factor is more significant than interfacial thermal resistance.

scholarly journals Thermal Conductivity of Unidirectionally Aligned SiC Whisker Reinforced Al Alloy Matrix Composite with Interfacial Thermal Resistance

2005 ◽  
Vol 46 (2) ◽  
pp. 148-151 ◽  
Author(s):  
Yibin Xu ◽  
Yoshihisa Tanaka ◽  
Masaharu Murata ◽  
Kazushige Kamihira ◽  
Yukihiro Isoda ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Thermal Resistance ◽  
Matrix Composite ◽  
Interfacial Thermal Resistance ◽  
Al Alloy ◽  
Alloy Matrix

Enhanced Thermal Conductivity of Composite Materials by Filling Sheet and Fiber Under Effect of Filler Contact

2021 ◽  
Author(s):  
Xiao-jian Wang ◽  
Liang-Bi Wang
Keyword(s):  
Thermal Conductivity ◽  
Heat Flux ◽  
Composite Materials ◽  
Thermal Resistance ◽  
Percolation Threshold ◽  
Filler Content ◽  
Interfacial Thermal Resistance ◽  
Combined Effects ◽  
Enhanced Thermal Conductivity ◽  
The Ideal

Abstract The most common non-granular fillers are sheet and fiber. When they are distributed along the heat flux direction, the thermal conductivity of composite increases greatly. Meanwhile, the filler contact also has large effect on the thermal conductivity. However, the effect of filler contact on the thermal conductivity of composite with directional fillers has not been investigated. In this paper, the combined effects of filler contact, content and orientation are investigated. The results show that the effect of filler orientation on the thermal conductivity is greater than filler contact in low filler content, and exact opposite in high filler content. The effect of filler contact on fibrous and sheet fillers is far greater than cube and sphere fillers. This rule is affected by the filler contact. The filler content of 8% is the ideal percolation threshold of composite with fibrous and sheet filler. It is lower than cube filler and previous reports. The space for thermal conductivity growth of composite with directional filler is still very large. The effect of interfacial thermal resistance should be considered in predicting the thermal conductivity of composite under high Rc (>10-4).

Effective Thermal Conductivity of Functionally Graded Particulate Nanocomposites With Interfacial Thermal Resistance

2008 ◽  
Vol 75 (5) ◽  
Author(s):  
H. M. Yin ◽  
G. H. Paulino ◽  
W. G. Buttlar ◽  
L. Z. Sun
Keyword(s):  
Thermal Conductivity ◽  
Thermal Resistance ◽  
Effective Thermal Conductivity ◽  
Functionally Graded ◽  
Interfacial Thermal Resistance ◽  
Conductivity Distribution ◽  
Consistent Model ◽  
The Matrix ◽  
Graded Material ◽  
Perfect Interface

By means of a fundamental solution for a single inhomogeneity embedded in a functionally graded material matrix, a self-consistent model is proposed to investigate the effective thermal conductivity distribution in a functionally graded particulate nanocomposite. The “Kapitza thermal resistance” along the interface between a particle and the matrix is simulated with a perfect interface but a lower thermal conductivity of the particle. The results indicate that the effective thermal conductivity distribution greatly depends on Kapitza thermal resistance, particle size, and degree of material gradient.

Thermal conductivity and interfacial Thermal Resistance Behavior for the Polyaniline (C3N)– boron carbide (BC3) Heterostructure

2021 ◽  
Author(s):  
Arian Mayelifartash ◽  
Mohammad Ali Abdol ◽  
Sadegh Sadeghzadeh
Keyword(s):  
Thermal Conductivity ◽  
Molecular Dynamics ◽  
Thermal Resistance ◽  
Boron Carbide ◽  
Molecular Dynamics Simulations ◽  
Thermal Conductance ◽  
Interfacial Thermal Resistance ◽  
Non Equilibrium Molecular Dynamics ◽  
Dynamics Simulations ◽  
Non Equilibrium

In this paper, by employing non-equilibrium molecular dynamics simulations (NEMD), the thermal conductance of hybrid formed by polyaniline (C3N) and boron carbide (BC3) in both armchair and zigzag configurations has...

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