Role of pH value during material synthesis and grain-grain boundary contribution on the observed semiconductor to metal like conductivity transition in Ni 1.5 Fe 1.5 O 4 spinel ferrite

2016 ◽  
Vol 177 ◽  
pp. 417-428 ◽  
Author(s):  
R.N. Bhowmik ◽  
K.S. Aneesh Kumar
Keyword(s):  
Grain Boundary ◽  
Ph Value ◽  
Spinel Ferrite ◽  
Material Synthesis ◽  
Boundary Contribution

Strain-induced martensite effects on transgranular carbide precipitation in type 304 stainless steels

1991 ◽  
Vol 49 ◽  
pp. 604-605
Author(s):  
A.H. Advani ◽  
L.E. Murr ◽  
D. Matlock
Keyword(s):  
Heat Treatment ◽  
Grain Boundary ◽  
Stress Corrosion Cracking ◽  
Stainless Steels ◽  
Deformation Twin ◽  
Austenitic Stainless Steels ◽  
Carbide Precipitation ◽  
Strain Induced Martensite ◽  
Type 304

Thermomechanically induced strain is a key variable producing accelerated carbide precipitation, sensitization and stress corrosion cracking in austenitic stainless steels (SS). Recent work has indicated that higher levels of strain (above 20%) also produce transgranular (TG) carbide precipitation and corrosion simultaneous with the grain boundary phenomenon in 316 SS. Transgranular precipitates were noted to form primarily on deformation twin-fault planes and their intersections in 316 SS.Briant has indicated that TG precipitation in 316 SS is significantly different from 304 SS due to the formation of strain-induced martensite on 304 SS, though an understanding of the role of martensite on the process has not been developed. This study is concerned with evaluating the effects of strain and strain-induced martensite on TG carbide precipitation in 304 SS. The study was performed on samples of a 0.051%C-304 SS deformed to 33% followed by heat treatment at 670°C for 1 h.

On the role of tin underlays for the prevention of thermal grooving in thin gold films

1986 ◽  
Vol 44 ◽  
pp. 732-733
Author(s):  
Jin Young Kim ◽  
R. E. Hummel ◽  
R. T. DeHoff
Keyword(s):  
Thin Film ◽  
Free Surface ◽  
Grain Boundary ◽  
Beneficial Effect ◽  
Failure Mechanism ◽  
Failure Mechanisms ◽  
Distinct Advantage ◽  
Gold Films ◽  
Gold Thin Film

Gold thin film metallizations in microelectronic circuits have a distinct advantage over those consisting of aluminum because they are less susceptible to electromigration. When electromigration is no longer the principal failure mechanism, other failure mechanisms caused by d.c. stressing might become important. In gold thin-film metallizations, grain boundary grooving is the principal failure mechanism.Previous studies have shown that grain boundary grooving in gold films can be prevented by an indium underlay between the substrate and gold. The beneficial effect of the In/Au composite film is mainly due to roughening of the surface of the gold films, redistribution of indium on the gold films and formation of In2O3 on the free surface and along the grain boundaries of the gold films during air annealing.

scholarly journals The role of iron in magnetic damping of Mg(Al,Fe)2O4 spinel ferrite thin films

2020 ◽  
Vol 116 (14) ◽  
pp. 142406 ◽  
Author(s):  
Jacob J. Wisser ◽  
Lauren J. Riddiford ◽  
Aaron Altman ◽  
Peng Li ◽  
Satoru Emori ◽  
...  
Keyword(s):  
Thin Films ◽  
Spinel Ferrite ◽  
Magnetic Damping ◽  
Ferrite Thin Films

Role of grain boundary engineered microstructure on high temperature steam oxidation behaviour of Ni based superalloy alloy 617

2019 ◽  
Vol 778 ◽  
pp. 224-233 ◽  
Author(s):  
C.N. Athreya ◽  
K. Deepak ◽  
Dong-Ik Kim ◽  
B. de Boer ◽  
Sumantra Mandal ◽  
...  
Keyword(s):  
High Temperature ◽  
Grain Boundary ◽  
Oxidation Behaviour ◽  
Steam Oxidation ◽  
Alloy 617 ◽  
High Temperature Steam
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