Ultra low-dielectric-constant methylated mesoporous silica films with high hydrophobicity and stability

2011 ◽  
Vol 129 (3) ◽  
pp. 1195-1200 ◽  
Author(s):  
Hao Yuan ◽  
Jiaqiang Xu ◽  
Lili Xie
Keyword(s):  
Dielectric Constant ◽  
Mesoporous Silica ◽  
Low Dielectric Constant ◽  
Silica Films ◽  
Low Dielectric

Sol-gel derived mesoporous silica films used as low dielectric constant materials

2004 ◽  
Vol 462-463 ◽  
pp. 311-315 ◽  
Author(s):  
Suzhu Yu ◽  
Terence K.S. Wong ◽  
Xiao Hu ◽  
Kantisara Pita
Keyword(s):  
Dielectric Constant ◽  
Mesoporous Silica ◽  
Sol Gel ◽  
Low Dielectric Constant ◽  
Silica Films ◽  
Low Dielectric ◽  
Low Dielectric Constant Materials

Stress Development in Low Dielectric Constant Silica Films During Drying and Heating Process

1999 ◽  
Vol 594 ◽  
Author(s):  
Mengcheng Lu ◽  
C. Jeffrey Brinker
Keyword(s):  
Dielectric Constant ◽  
Tensile Stress ◽  
Sol Gel ◽  
Low Dielectric Constant ◽  
Heating Process ◽  
Residual Tensile Stress ◽  
Silica Films ◽  
Stress Development ◽  
Low Dielectric

AbstractLow dielectric constant silica films are made using a surfactant templated sol-gel process (K∼2.5) or an ambient temperature and pressure aerogel process (K∼1.5). This paper will present the in-situ measurement and analysis of stress development during the making of these films, from the onset of drying till the end of heating. The drying stress is measured by a cantilever beam technique; the thermal stress is measured by monitoring the wafer curvature using a laser deflection method. During the course of drying, the surfactant templated films experience a low drying stress due to the influence of the surfactant on surface tension and extent of siloxane condensation. The aerogel films first develop a biaxial tensile stress due to solidification and initial drying. At the final stage of drying where the drying stress vanishes, dilation of the film recreates the porosity of the wet gel state, reducing the residual stress to zero. For the surfactant templated films, very small residual tensile stress remains after the heat treatment is finished (∼30MPa). Aerogel film has almost no measurable stress developed in the calcination process. In situ spectroscopic ellipsometry analysis during drying and heating, and TGA/DTA are all used to help understand the stress development.

Study on the Dielectric Properties of Hybrid and Porous Polyimide-Silica Films

2008 ◽  
Vol 47-50 ◽  
pp. 973-976 ◽  
Author(s):  
Yi He Zhang ◽  
Qing Song Su ◽  
Li Yu ◽  
Hong Zheng ◽  
Hai Tao Huang ◽  
...  
Keyword(s):  
Dielectric Constant ◽  
Sol Gel ◽  
Silica Particles ◽  
Low Dielectric Constant ◽  
Hybrid Films ◽  
Porous Films ◽  
Silica Films ◽  
Low Dielectric ◽  
Dimethyl Acetamide ◽  
Sol Gel Process

A sol-gel process was used to prepare polyimide-silica hybrid films from the polyimide precursors and TEOS in N,N- dimethyl acetamide, then the hybrid film was treated with hydrofluoric acid to remove the dispersed silica particles, leaving pores with diameters between 80nm to 1µm, depending on the size of silica particles. The structure and dielectric constant of the hybrid and porous films were characterized by FTIR,SEM. The porous films displayed relatively low dielectric constant compared to the hybrid polyimide-silica films.

Low dielectric constant silica films with ordered nanoporous structure

2007 ◽  
Vol 27 (5-8) ◽  
pp. 1145-1148 ◽  
Author(s):  
Jun Shen ◽  
Aiyun Luo ◽  
Lanfang Yao ◽  
Xuejin Lin ◽  
Bin Zhou ◽  
...  
Keyword(s):  
Dielectric Constant ◽  
Nanoporous Structure ◽  
Low Dielectric Constant ◽  
Silica Films ◽  
Low Dielectric

Facile and Controlled Synthesis of Ultra-Thin Low Dielectric Constant Meso/Microporous Silica Films

ChemPhysChem ◽  
2008 ◽  
Vol 9 (11) ◽  
pp. 1524-1527 ◽  
Author(s):  
Richard A. Farrell ◽  
Nikolay Petkov ◽  
Karim Cherkaoui ◽  
Heinz Amenitsch ◽  
Justin D. Holmes ◽  
...  
Keyword(s):  
Dielectric Constant ◽  
Low Dielectric Constant ◽  
Controlled Synthesis ◽  
Silica Films ◽  
Microporous Silica ◽  
Low Dielectric

Thermal stability of low dielectric constant porous silica films

2005 ◽  
Vol 87 (26) ◽  
pp. 262909 ◽  
Author(s):  
L. Esposito ◽  
G. Ottaviani ◽  
E. Carollo ◽  
M. Bacchetta
Keyword(s):  
Thermal Stability ◽  
Dielectric Constant ◽  
Porous Silica ◽  
Low Dielectric Constant ◽  
Silica Films ◽  
Low Dielectric ◽  
Thermal Stability Of
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