Surface void suppression for pure copper by high-speed laser scanner welding
2017 ◽
Vol 240
◽
pp. 52-59
◽
Keyword(s):
Study on Bonding Properties of Copper and Aluminum in Nano Scale Using Molecular Dynamics Simulation
2012 ◽
Vol 152-154
◽
pp. 183-187
◽
Keyword(s):
1992 ◽
Vol 438
(1902)
◽
pp. 153-170
◽
2010 ◽
Vol 20
(11)
◽
pp. 115028
◽
2009 ◽
Vol 15
(S3)
◽
pp. 79-80
◽
Keyword(s):
2021 ◽
Vol 10
(2)
◽
pp. 74-83