Ultrafast pulse laser inscription and surface quality characterization of micro-structured silicon wafer

2021 ◽  
Vol 62 ◽  
pp. 323-336
Author(s):  
Shalini S. ◽  
Samuel G.L.
Keyword(s):  
Surface Quality ◽  
Silicon Wafer ◽  
Pulse Laser ◽  
Ultrafast Pulse

Use of Wavelet Packet Transform in Characterization of Surface Quality

2007 ◽  
Vol 46 (15) ◽  
pp. 5152-5158 ◽  
Author(s):  
J. Jay Liu ◽  
Daeyoun Kim ◽  
Chonghun Han
Keyword(s):  
Surface Quality ◽  
Wavelet Packet ◽  
Wavelet Packet Transform

Observation in the Surface Roughness of Silicon Wafer during Semi-Fixed Abrasive Machining with Large Grains

2009 ◽  
Vol 69-70 ◽  
pp. 253-257
Author(s):  
Ping Zhao ◽  
Jia Jie Chen ◽  
Fan Yang ◽  
K.F. Tang ◽  
Ju Long Yuan ◽  
...  
Keyword(s):  
Surface Roughness ◽  
Surface Quality ◽  
Silicon Wafer ◽  
Processing Parameters ◽  
Wafer Surface ◽  
Abrasive Machining ◽  
Fixed Abrasive ◽  
Is Failure ◽  
Better Than

Semi-fixed abrasive is a novel abrasive. It has a ‘trap’ effect on the hard large grains that can prevent defect effectively on the surface of the workpiece which is caused by large grains. In this paper, some relevant experiments towards silicon wafers are carried out under the different processing parameters on the semi-fixed abrasive plates, and 180# SiC is used as large grains. The processed workpieces’ surface roughness Rv are measured. The experimental results show that the surface quality of wafer will be worse because of higher load and faster rotating velocity. And it can make a conclusion that the higher proportion of bond of the plate, the weaker of the ‘trap’ effect it has. Furthermore the wet environment is better than dry for the wafer surface in machining. The practice shows that the ‘trap’ effect is failure when the workpiece is machined by abrasive plate which is 4.5wt% proportion of bond in dry lapping.

Surface quality characterization of textile-reinforced thermoplastics

2000 ◽  
Vol 21 (4) ◽  
pp. 630-635 ◽  
Author(s):  
M. Neitzel ◽  
M. Blinzler ◽  
K. Edelmann ◽  
F. Hoecker
Keyword(s):  
Surface Quality ◽  
Reinforced Thermoplastics

Fabrication of Ultra Thick Ferromagnetic Structures in Silicon

2004 ◽  
Author(s):  
Debbie G. Jones ◽  
Albert P. Pisano
Keyword(s):  
Electron Microscopy ◽  
Thin Films ◽  
Scanning Electron Microscopy ◽  
Saturation Magnetization ◽  
Silicon Wafer ◽  
Fabrication Process ◽  
Sem Images ◽  
Deep Reactive Ion Etching ◽  
Scanning Electron

A novel fabrication process is presented to create ultra thick ferromagnetic structures in silicon. The structures are fabricated by electroforming NiFe into silicon templates patterned with deep reactive ion etching (DRIE). Thin films are deposited into photoresist molds for characterization of an electroplating cell. Results show that electroplated films with a saturation magnetization above 1.6 tesla and compositions of approximately 50/50 NiFe can be obtained through agitation of the electrolyte. Scanning electron microscopy (SEM) images show that NiFe structures embedded in a 500 μm thick silicon wafer are realized and the roughening of the mold sidewalls during the DRIE aids in adhesion of the NiFe to the silicon.

Characterization of regular periodic surface structure by multi-pulse laser irradiation of a Zinc target

2012 ◽  
Vol 10 (5) ◽  
pp. 051402-51404 ◽  
Author(s):  
Ming Chen Ming Chen ◽  
Xiangdong Liu Xiangdong Liu ◽  
Yuehua Liu Yuehua Liu ◽  
Mingwen Zhao Mingwen Zhao
Keyword(s):  
Surface Structure ◽  
Laser Irradiation ◽  
Pulse Laser ◽  
Pulse Laser Irradiation ◽  
Periodic Surface ◽  
Periodic Surface Structure
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