scholarly journals Lead-free solder alloys: Thermodynamic properties of the (Au+Sb+Sn) and the (Au+Sb) system

2012 ◽  
Vol 55 ◽  
pp. 102-109 ◽  
Author(s):  
Michael Hindler ◽  
Zhongnan Guo ◽  
Adolf Mikula
Keyword(s):  
Thermodynamic Properties ◽  
Lead Free ◽  
Lead Free Solder ◽  
Solder Alloys ◽  
Free Solder

Thermodynamic properties of the liquid Ag–Cu–Sn lead-free solder alloys

2010 ◽  
Vol 122 (2-3) ◽  
pp. 480-484 ◽  
Author(s):  
Marek Kopyto ◽  
Boguslaw Onderka ◽  
Leszek A. Zabdyr
Keyword(s):  
Thermodynamic Properties ◽  
Lead Free ◽  
Lead Free Solder ◽  
Solder Alloys ◽  
Free Solder

scholarly journals Electrochemical migration of lead-free solder alloys in Na2SO4 environment

2017 ◽  
Author(s):  
Balint Medgyes ◽  
Sandor Adam ◽  
Lajos Tar ◽  
Vadimas Verdingovas ◽  
Rajan Ambat ◽  
...  
Keyword(s):  
Lead Free ◽  
Electrochemical Migration ◽  
Lead Free Solder ◽  
Solder Alloys ◽  
Free Solder

scholarly journals The Influences Which Constitutive Models for Lead-Free Solder Alloys in General FEA Programs Give to Accumulated Inelastic Strain Behavior

2016 ◽  
Vol 5 (4) ◽  
pp. 266-274
Author(s):  
Takeharu HAYASHI ◽  
Hirohiko WATANABE ◽  
Masaaki TAKABE ◽  
Yoshinori EBIHARA ◽  
Tatsuhiko ASAI ◽  
...  
Keyword(s):  
Constitutive Models ◽  
Inelastic Strain ◽  
Lead Free ◽  
Lead Free Solder ◽  
Solder Alloys ◽  
Strain Behavior ◽  
Free Solder

Solder Joint Reliability of Sn-Cu and Sn-Ag-Cu Lead-Free Solder Alloys Solidified on Copper Substrates with Different Surface Roughnesses

2015 ◽  
Vol 830-831 ◽  
pp. 265-269
Author(s):  
Satyanarayan ◽  
K.N. Prabhu
Keyword(s):  
Solder Joint ◽  
Solder Matrix ◽  
Lead Free ◽  
Lead Free Solder ◽  
Solder Alloys ◽  
Cu Substrate ◽  
Cu Substrates ◽  
Free Solder ◽  
Substrate Surfaces ◽  
Lead Free Solders

In the present work, the bond strength of Sn-0.7Cu, Sn-0.3Ag-0.7Cu, Sn-2.5Ag-0.5Cu and Sn-3Ag-0.5Cu lead free solders solidified on Cu substrates was experimentally determined. The bond shear test was used to assess the integrity of Sn–Cu and Sn–Ag–Cu lead-free solder alloy drops solidified on smooth and rough Cu substrate surfaces. The increase in the surface roughness of Cu substrates improved the wettability of solders. The wettability was not affected by the Ag content of solders. Solder bonds on smooth surfaces yielded higher shear strength compared to rough surfaces. Fractured surfaces revealed the occurrence of ductile mode of failure on smooth Cu surfaces and a transition ridge on rough Cu surfaces. Though rough Cu substrate improved the wettability of solder alloys, solder bonds were sheared at a lower force leading to decreased shear energy density compared to the smooth Cu surface. A smooth surface finish and the presence of minor amounts of Ag in the alloy improved the integrity of the solder joint. Smoother surface is preferable as it favors failure in the solder matrix.

Nanoindentation Characterization of Lead-free Solders and Intermetallic Compounds under Thermal Aging

2010 ◽  
Vol 2010 (1) ◽  
pp. 000314-000318
Author(s):  
Tong Jiang ◽  
Fubin Song ◽  
Chaoran Yang ◽  
S. W. Ricky Lee
Keyword(s):  
Mechanical Properties ◽  
Thermal Aging ◽  
Solder Joints ◽  
Lead Free ◽  
Small Range ◽  
Lead Free Solder ◽  
Solder Alloys ◽  
Aging Test ◽  
Free Solder ◽  
Lead Free Solders

The enforcement of environmental legislation is pushing electronic products to take lead-free solder alloys as the substitute of traditional lead-tin solder alloys. Applications of such alloys require a better understanding of their mechanical behaviors. The mechanical properties of the lead-free solders and IMC layers are affected by the thermal aging. The lead-free solder joints on the pads subject to thermal aging test lead to IMC growth and cause corresponding reliability concerns. In this paper, the mechanical properties of the lead-free solders and IMCs were characterized by nanoindentation. Both the Sn-rich phase and Ag3Sn + β-Sn phase in the lead-free solder joint exhibit strain rate depended and aging soften effect. When lead-free solder joints were subject to thermal aging, Young's modulus of the (Cu, Ni)6Sn5 IMC and Cu6Sn5 IMC changed in very small range. While the hardness value decreased with the increasing of the thermal aging time.

scholarly journals Wetting of Different Lead Free Solder Alloys During Vapour Phase Soldering

2019 ◽  
Author(s):  
Mohamed Amine Alaya ◽  
Laszlo Gal ◽  
Tamas Hurtony ◽  
Balint Medgyes ◽  
Daniel Straubinger ◽  
...  
Keyword(s):  
Vapour Phase ◽  
Lead Free ◽  
Lead Free Solder ◽  
Solder Alloys ◽  
Free Solder
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