Sequential interfacial intermetallic compound formation of Cu6Sn5 and Ni3Sn4 between Sn–Ag–Cu solder and ENEPIG substrate during a reflow process

2011 ◽  
Vol 509 (9) ◽  
pp. L153-L156 ◽  
Author(s):  
Jeong-Won Yoon ◽  
Bo-In Noh ◽  
Jae-Hyun Yoon ◽  
Han-Byul Kang ◽  
Seung-Boo Jung
Keyword(s):  
Intermetallic Compound ◽  
Reflow Process ◽  
Compound Formation ◽  
Intermetallic Compound Formation ◽  
Interfacial Intermetallic Compound

Influence of Bi Addition on Wettability and Mechanical Properties of Sn-0.7Cu Solder Alloy

2018 ◽  
Vol 273 ◽  
pp. 27-33 ◽  
Author(s):  
Mohd Izrul Izwan Ramli ◽  
M.S.S. Yusof ◽  
Mohd Arif Anuar Mohd Salleh ◽  
Rita Mohd Said ◽  
Kazuhiro Nogita
Keyword(s):  
Mechanical Properties ◽  
Intermetallic Compound ◽  
Lead Free Solder ◽  
Compound Formation ◽  
Alloying Additions ◽  
Wetting Properties ◽  
Intermetallic Compound Formation ◽  
Interfacial Intermetallic Compound ◽  
Free Solder ◽  
Intermetallic Layers

The effect of bismuth (Bi) micro-alloying additions on wettability and mechanical properties of Sn-0.7Cu lead-free solder were explored. This paper also investigates the influences of various Bi percentages on the suppression of intermetallic compound formation. Scanning electron microscope (SEM) was used to observe the microstructure evolution of solder joint including the thickness of interfacial intermetallic layers. Overall, with the addition of Bi to Sn-0.7Cu solder, the size of primary Cu6Sn5become smaller and suppresses the thickness of interfacial intermetallic compound between solder and the Cu substrate. Microhardness value and wetting properties also increased with Bi addition which resulted in smaller size of β-Sn and Cu6Sn5.

Effect of supersaturation of Cu on reaction and intermetallic compound formation between Sn–Cu solder and thin film metallization

2003 ◽  
Vol 18 (9) ◽  
pp. 2109-2114 ◽  
Author(s):  
J. S. Ha ◽  
T. S. Oh ◽  
K. N. Tu
Keyword(s):  
Thin Film ◽  
Intermetallic Compound ◽  
Solubility Limit ◽  
Molten Solder ◽  
Interfacial Reactions ◽  
Interfacial Stability ◽  
Compound Formation ◽  
Cu Content ◽  
Intermetallic Compound Formation ◽  
Interfacial Intermetallic Compound

Interfacial reactions and intermetallic compound formation of the eutectic Sn–0.7Cu and hypereutectic Sn–3Cu on thin film metallization of Al/Ni/Cu, Al/Cu, and Al/Ni were investigated. While the Ni layer of Al/Ni/Cu was almost consumed by Sn–0.7Cu after one reflow at 240 °C, most of it was preserved with Sn–3Cu even after ten reflows. Since the Cu content in Sn–0.7Cu is below the solubility limit of Cu in Sn at 240 °C, the Cu layer of Al/Ni/Cu was dissolved completely into Sn–0.7Cu, and the Ni was exposed to the molten solder to form intermetallics. As Cu content in Sn–3Cu is more than the solubility limit, intermetallics formed between the solder and the Cu layer, but not the Ni layer, of Al/Ni/Cu. The supersaturation of Cu in Sn–3Cu was found to be beneficial in reducing the interfacial intermetallic compound formation and in improving the interfacial stability.

Effect of adding Ag to the medium entropy SnBiIn alloy on intermetallic compound formation

2020 ◽  
Vol 272 ◽  
pp. 127891 ◽  
Author(s):  
Li Pu ◽  
Yingxia Liu ◽  
Yong Yang ◽  
Quanfeng He ◽  
Ziqing Zhou ◽  
...  
Keyword(s):  
Intermetallic Compound ◽  
Compound Formation ◽  
Intermetallic Compound Formation

Morphology of wetting reactions of SnPb alloys on Cu as a function of alloy composition

1998 ◽  
Vol 13 (1) ◽  
pp. 37-44 ◽  
Author(s):  
C. Y. Liu ◽  
K. N. Tu
Keyword(s):  
Free Energy ◽  
Intermetallic Compound ◽  
Intermetallic Compounds ◽  
Driving Force ◽  
Alloy Composition ◽  
Wetting Angle ◽  
Compound Formation ◽  
Side Band ◽  
Intermetallic Compound Formation ◽  
Pure Sn

We have investigated the wetting angle, side band growth, and intermetallic compound formation of seven SnPb alloys on Cu ranging from pure Sn to pure Pb. The wetting angle has a minimum near the middle composition and increases toward pure Sn and pure Pb, but the side band growth has a maximum near the middle composition. The intermetallic compounds formed are Cu6Sn5 and Cu3Sn for the eutectic and high-Sn alloys, yet for the high-Pb alloys, only Cu3Sn can be detected. While no intermetallic compound forms between Cu and pure Pb, the latter nevertheless wets the former with an angle of 115°. The driving force of a wetting reaction, which may be affected by the free energy gain in compound formation, is discussed by assuming that rate of compound formation is fast.

Relationship between intermetallic compound formation and glass forming ability of Al–Ni–La alloy

2003 ◽  
Vol 319 (3-4) ◽  
pp. 424-428 ◽  
Author(s):  
Pengchao Si ◽  
Xiufang Bian ◽  
Wang Li ◽  
Junyan Zhang ◽  
Zhongxi Yang
Keyword(s):  
Intermetallic Compound ◽  
Glass Forming Ability ◽  
Compound Formation ◽  
Glass Forming ◽  
Intermetallic Compound Formation
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