Intermetallic phase formation in nanometric Ni/Al multilayer thin films

2008 ◽  
Vol 16 (9) ◽  
pp. 1061-1065 ◽  
Author(s):  
J. Noro ◽  
A.S. Ramos ◽  
M.T. Vieira
Keyword(s):  
Thin Films ◽  
Phase Formation ◽  
Intermetallic Phase ◽  
Multilayer Thin Films

Peculiarities of Intermetallic Phase Formation in the Process of a Solid State Reaction in (Al/Cu)n Multilayer Thin Films

JOM ◽  
2021 ◽  
Author(s):  
Evgeny T. Moiseenko ◽  
Sergey M. Zharkov ◽  
Roman R. Altunin ◽  
Oleg V. Belousov ◽  
Leonid A. Solovyov ◽  
...  
Keyword(s):  
Thin Films ◽  
Solid State ◽  
Phase Formation ◽  
Solid State Reaction ◽  
Intermetallic Phase ◽  
Multilayer Thin Films

scholarly journals Correction to: Peculiarities of Intermetallic Phase Formation in the Process of a Solid State Reaction in (Al/Cu)n Multilayer Thin Films

JOM ◽  
2021 ◽  
Author(s):  
Evgeny T. Moiseenko ◽  
Sergey M. Zharkov ◽  
Roman R. Altunin ◽  
Oleg V. Belousov ◽  
Leonid A. Solovyov ◽  
...  
Keyword(s):  
Thin Films ◽  
Solid State ◽  
Phase Formation ◽  
Solid State Reaction ◽  
Intermetallic Phase ◽  
Multilayer Thin Films

Characterization of reactive phase formation in sputter-deposited Ni/Al multilayer thin films using TEM

1996 ◽  
Vol 54 ◽  
pp. 1000-1001
Author(s):  
G. Lucadamo ◽  
K. Barmak ◽  
C. Michaelsen
Keyword(s):  
Thin Films ◽  
Phase Formation ◽  
Dark Field ◽  
Nickel Layer ◽  
Multilayer Thin Films ◽  
Cross Sectional ◽  
Dark Field Imaging ◽  
Transmission Electron ◽  
Sputter Deposited ◽  
Constant Heating

The subject of reactive phase formation in multilayer thin films of varying periodicity has stimulated much research over the past few years. Recent studies have sought to understand the reactions that occur during the annealing of Ni/Al multilayers. Dark field imaging from transmission electron microscopy (TEM) studies in conjunction with in situ x-ray diffraction measurements, and calorimetry experiments (isothermal and constant heating rate), have yielded new insights into the sequence of phases that occur during annealing and the evolution of their microstructure.In this paper we report on reactive phase formation in sputter-deposited lNi:3Al multilayer thin films with a periodicity A (the combined thickness of an aluminum and nickel layer) from 2.5 to 320 nm. A cross-sectional TEM micrograph of an as-deposited film with a periodicity of 10 nm is shown in figure 1. This image shows diffraction contrast from the Ni grains and occasionally from the Al grains in their respective layers.

Effect of Microstructure on Phase Formation in Reaction of The Nb/Al Multilayer Thin Films

1991 ◽  
Vol 230 ◽  
Author(s):  
Katayun Barmak ◽  
Kevin R. Coffey ◽  
David A. Rudman ◽  
Simon Foner
Keyword(s):  
Thin Film ◽  
Thin Films ◽  
Phase Diagram ◽  
Grain Boundary ◽  
Phase Formation ◽  
Boundary Diffusion ◽  
Equilibrium Phase ◽  
Equilibrium Phase Diagram ◽  
Thin Layers ◽  
Multilayer Thin Films

AbstractWe investigated the phase formation sequence in the reaction of multilayer thin films of Nb/Al with overall compositions of 25 and 33 at.% AI. We report novel phenomena which distinguish thin-film reactions unequivocally from those in bulk systems. For sufficiently thin layers composition and stability of product phases are found to deviate significantly from that predicted from the equilibrium phase diagram. We demonstrate that in the Nb/Al system the length scales below which such deviations occur is about 150 nm. We believe that these phenomena occur due to the importance of grain boundary diffusion and hence microstructure in these thin films.

Stress development, intermetallic phase formation, and reaction kinetics in Co‐Cr and Co‐Ti thin films

1990 ◽  
Vol 67 (11) ◽  
pp. 6807-6812 ◽  
Author(s):  
F. Faupel ◽  
D. Gupta ◽  
B. N. Agarwala ◽  
P. S. Ho
Keyword(s):  
Thin Films ◽  
Reaction Kinetics ◽  
Phase Formation ◽  
Intermetallic Phase ◽  
Stress Development

scholarly journals Effect of Deposition Parameters on the Reactivity of Al/Ni Multilayer Thin Films

Coatings ◽  
2020 ◽  
Vol 10 (8) ◽  
pp. 721
Author(s):  
Ana Sofia Ramos ◽  
Sónia Simões ◽  
Lukasz Maj ◽  
Jerzy Morgiel ◽  
Maria Teresa Vieira
Keyword(s):  
Thin Films ◽  
Intermetallic Phase ◽  
Ion Bombardment ◽  
Deposition Process ◽  
Phase Identification ◽  
Multilayer Thin Films ◽  
Substrate Bias ◽  
X Ray Diffraction ◽  
Deposition Parameters ◽  
Transmission Electron

Nanoscale multilayers can be used as highly localized heat sources, making them attractive for several applications, in particular for joining and as igniters. Over the last decades, academia and industry have given particular emphasis to nanoscale multilayers from the Ni–Al system. In this study, Al/Ni (V) multilayer thin films with periods of nominally 25 and 50 nm (bilayer thickness) and near equiatomic average stoichiometry were produced by d.c. magnetron sputtering from Al (99.999% pure) and Ni (93 wt % Ni, 7 wt % V) targets (vanadium was added to the Ni target to make it non-magnetic). Deposition parameters such as the substrate rotation speed and substrate bias were varied in order to evaluate their effect on the reactivity of the multilayers. The influence of in situ ion bombardment of the multilayer thin films was also studied. Phase identification was carried out by X-ray diffraction, while the microstructure was analyzed in detail by transmission electron microscopy, distinguishing alternating layers throughout the entire thickness of the films. Although the films mainly consist of Al- and Ni-rich layers, the presence of the Al3Ni intermetallic phase was detected, except in the multilayers produced with the ion gun switched on during the deposition process. The ion bombardment, as well as the increase of the substrate bias, promote some microstructural disorder and thus affect the multilayers’ reactivity.

Atomic scale analysis of phase formation and diffusion kinetics in Ag/Al multilayer thin films

2016 ◽  
Vol 120 (19) ◽  
pp. 195306 ◽  
Author(s):  
Hisham Aboulfadl ◽  
Isabella Gallino ◽  
Ralf Busch ◽  
Frank Mücklich
Keyword(s):  
Thin Films ◽  
Phase Formation ◽  
Atomic Scale ◽  
Multilayer Thin Films ◽  
Scale Analysis ◽  
Diffusion Kinetics ◽  
And Diffusion

Reactive Phase Formation in Sputter-Deposited Ni/Al Thin Films

1995 ◽  
Vol 382 ◽  
Author(s):  
K. Barmak ◽  
C. Michaelsen ◽  
R. Bormann ◽  
G. Lucadamo
Keyword(s):  
Thin Films ◽  
Amorphous Phase ◽  
Phase Formation ◽  
Molar Ratio ◽  
Multilayer Thin Films ◽  
Nucleation Kinetics ◽  
Second Stage ◽  
Stage Process ◽  
Magnetron Sputter ◽  
Sputter Deposited

ABSTRACTWe have investigated reactive phase formation in magnetron sputter-deposited Ni/Al multilayer thin films with a 3:1 molar ratio and periodicities ranging from 2.5-320 nm. In addition, we studied the transformation of a codeposited film of the same composition. We find that an amorphous phase has already formed during deposition, and that the extentof formation of this phase increases with decreasing periodicity. The first crystalline phase then nucleates from this amorphous phase upon annealing. The formation of the amorphous phase considerably reduces the driving force and explains why during subsequent reactions nucleation kinetics become important. We obtain Ni2Al9 as the first product phase during heat treatment in some cases before NiAl3 occurs. For films with modulation periods larger than 40 nm, formation of NiAI3 is a two stage process as reported earlier, with the first stage being due to nucleation and growth to coalescence of NiAl3 grains, and the second stage being the growth of NiA13 normal to the initial interface until the reactant phases are consumed.

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