Experimental investigation on convective heat transfer mechanism in a scroll compressor

2006 ◽  
Vol 29 (5) ◽  
pp. 744-753 ◽  
Author(s):  
Kitae Jang ◽  
Sangkwon Jeong
Keyword(s):  
Heat Transfer ◽  
Experimental Investigation ◽  
Convective Heat Transfer ◽  
Convective Heat ◽  
Transfer Mechanism ◽  
Heat Transfer Mechanism ◽  
Scroll Compressor

A New Mathematical Model to Understand the Convective Heat Transfer Mechanism in Steam-Assisted Gravity Drainage Process

2017 ◽  
Vol 10 (1) ◽  
Author(s):  
Zhaoxiang Zhang ◽  
Huiqing Liu ◽  
Xiaohu Dong ◽  
Huanli Jiang
Keyword(s):  
Heat Transfer ◽  
Convective Heat Transfer ◽  
Analytical Model ◽  
Convective Heat ◽  
Transfer Mechanism ◽  
Gravity Drainage ◽  
Heat Transfer Mechanism ◽  
Oil Viscosity ◽  
Steam Chamber ◽  
Steam Assisted Gravity Drainage

Steam-assisted gravity drainage (SAGD) process has been an optimized method to explore heavy oil reservoirs in the world. The oil viscosity reduction and gravity force near the interface of steam–chamber are the main development mechanisms. In classical models, conductive heat transfer plays the only or dominant role in the heat transmission from high-temperature steam to low-temperature oil sands. Although some mathematical studies have paid attention to the convective heat transfer, the role of heat transfer by flowable oil normal to the steam–chamber interface has been given little attention. In SAGD, the viscosity of bitumen can be reduced by several orders of magnitude by the release of latent heat from injected steam. In this study, an analytical model is developed for the heat transfer process induced by flowable oil. Also, in order to accurately simulate the oil viscosity characteristics in steam–chamber, a correlation between oil viscosity and pressure is proposed. Results indicate that the oil mobility plays an important role on the flow normal to interface when the distance is smaller than 6 m. Even under the most extreme circumstances (μw = 0.1127 cp), the flowing of oil normal to steam–chamber interface also cannot be ignored. Comparing to Irani and Ghannadi model, it can be easy to draw the conclusion that the new model consists with the underground test facility (UTF) field data much better. This new analytical model will benefit to understanding the convective heat transfer mechanism in SAGD process.

scholarly journals Molecular dynamics study of convective heat transfer mechanism in a nano heat exchanger

RSC Advances ◽  
2020 ◽  
Vol 10 (39) ◽  
pp. 23097-23107
Author(s):  
Haiyi Sun ◽  
Fei Li ◽  
Man Wang ◽  
Gongming Xin ◽  
Xinyu Wang
Keyword(s):  
Heat Transfer ◽  
Molecular Dynamics ◽  
Heat Exchanger ◽  
Molecular Dynamics Simulation ◽  
Convective Heat Transfer ◽  
Convective Heat ◽  
Transfer Mechanism ◽  
Dynamics Simulation ◽  
Heat Transfer Mechanism

The convective heat transfer mechanism in a nano heat exchanger is investigated using molecular dynamics simulation.

Effect of the vapour concentration decrease on the solder joints temperature in a vacuum vapour phase soldering system

2018 ◽  
Vol 30 (2) ◽  
pp. 66-73 ◽  
Author(s):  
Balázs Illés ◽  
Agata Skwarek ◽  
Attila Géczy ◽  
László Jakab ◽  
David Bušek ◽  
...  
Keyword(s):  
Heat Transfer ◽  
Convective Heat Transfer ◽  
Convective Heat ◽  
Solder Joints ◽  
Low Pressure ◽  
Vapour Phase ◽  
Transfer Mechanism ◽  
Substrate Thickness ◽  
Heat Transfer Mechanism ◽  
Content Type

Purpose The vacuum vapour phase soldering method was investigated by numerical simulations. The purpose of this study was to examine the temperature changes of the solder joints during the vapour suctioning process. A low pressure is used to enhance the outgassing of the trapped gas within the solder joints, which otherwise could form voids. However, the system loses heat near the suction pipe during the suctioning process, and it can result in preliminary solidification of the solder joints before the gas could escape. Design/methodology/approach A three-dimensional numerical flow model based on the Reynolds averaged Navier–Stokes equations with the standard k-e turbulence method was developed. The effect of the vapour suctioning on the convective heat transfer mechanism was described by the model. Temperature change of the solder joints was studied at the mostly used substrate and component combinations, as well as at different system settings. Findings In the function of the substrate thickness and the component size, the solder joints can lose large amount of heat during the void reduction process, which leads to preliminary solidification before the entrapped gas voids could be removed. Research limitations/implications The results provide setting information of vacuum vapour phase technology for appropriate and optimal applications. Originality/value The relationship between low pressure generation and convective heat transfer mechanism during vacuum vapour phase soldering has not been studied yet. The possible negative effects of the vapour suctioning process on the solder joint temperature are unknown.

Experimental investigation of convective heat transfer for night ventilation in case of mixing ventilation

2021 ◽  
Vol 193 ◽  
pp. 107670
Author(s):  
Rui Guo ◽  
Per Heiselberg ◽  
Yue Hu ◽  
Hicham Johra ◽  
Rasmus Lund Jensen ◽  
...  
Keyword(s):  
Heat Transfer ◽  
Experimental Investigation ◽  
Convective Heat Transfer ◽  
Convective Heat ◽  
Night Ventilation
Sign in / Sign up

Export Citation Format

Share Document