An analytical force model for ultra-precision diamond sculpturing of micro-grooves with textured surfaces

2019 ◽  
Vol 160 ◽  
pp. 129-139 ◽  
Author(s):  
Zhanwen Sun ◽  
Suet To ◽  
Sujuan Wang
Keyword(s):  
Force Model ◽  
Textured Surfaces ◽  
Ultra Precision ◽  
Analytical Force Model

scholarly journals Modeling of Attractive Force by Magnetic Wheel Used for Mobile Robot

Actuators ◽  
2020 ◽  
Vol 9 (3) ◽  
pp. 67
Author(s):  
Myounggyu Noh ◽  
Eunsang Kwon ◽  
So Hee Park ◽  
Young-Woo Park
Keyword(s):  
Finite Element ◽  
Mobile Robot ◽  
Mobile Robots ◽  
Magnetic Force ◽  
Magnetic Circuit ◽  
Force Model ◽  
Finite Element Analyses ◽  
Test Rig ◽  
Leakage Flux ◽  
Analytical Force Model

Mobile robots that are required to climb inclined ferromagnetic surfaces typically employ magnetic wheels. In order to design magnetic wheels and to properly size the permanent magnet as magnetizing source without the need for finite element analyses, a model that predicts the attractive magnetic force is necessary. In this paper, an analytical force model is derived by estimating the reluctance between the wheel and the surface. A magnetic circuit is constructed, incorporating the leakage flux from the side of the wheel. The model is validated against the results from finite element analyses and measurements from a test rig and a wheel prototype. Within the limitations of the model, it can adequately predict the force and can be used for initial design of magnetic wheels.

Modeling of Ultra-Precision ELID Grinding

2006 ◽  
Vol 129 (2) ◽  
pp. 296-302 ◽  
Author(s):  
K. Fathima ◽  
M. Rahman ◽  
A. Senthil Kumar ◽  
H. S. Lim
Keyword(s):  
Contact Area ◽  
Material Removal ◽  
Real Contact Area ◽  
Grinding Wheel ◽  
Force Model ◽  
The Real ◽  
Real Contact ◽  
Elid Grinding ◽  
Conventional Grinding ◽  
Ultra Precision

The electrolytic in-process dressing (ELID) grinding is a new and an efficient process for ultra-precision finishing of hard and brittle materials. Unlike conventional grinding processes, the ELID grinding is a hybrid process that consists of a mechanical and an electrochemical process, and the performance of the ELID grinding process is influenced by the parameters of the above said processes. Therefore, it is necessary to develop a new grinding model for the ELID grinding, which can be used to avoid the cumbersome and expensive experimental trials. In this paper, the authors proposed a new grinding model for ultra-precision ELID grinding. The main focus is to develop a force model for the ultra-precision ELID grinding where the material removal is significantly lower than the conventional grinding. When the material removal rate is very low, it is very important to estimate the real contact area between the wheel and work surfaces. The developed grinding model estimates the real contact area by considering the wheel and the work surface characterization and the effect of the electrolytic reaction at the grinding wheel edge. The effects of the microstructure changes on the wheel surface by the electrochemical reaction have been implemented in the model in order to improve the efficiency of the developed model. The grinding model has been simulated and the simulated results are substantiated by the experimental findings.

Modeling of Ball-End Milling Forces With Cutter Axis Inclination

1999 ◽  
Vol 122 (1) ◽  
pp. 3-11 ◽  
Author(s):  
Ismail Lazoglu ◽  
Steven Y. Liang
Keyword(s):  
End Milling ◽  
Chip Thickness ◽  
Helix Angle ◽  
Force Model ◽  
Ball End Mill ◽  
Ball End Milling ◽  
Model Predictions ◽  
Milling Forces ◽  
Analytical Force Model ◽  
Convolution Method

In the machining of sculpture surfaces with ball-end mill, the cutter axis or workpiece is often inclined to generate an admissible orientation. This paper primarily presents an enhanced cutting force model for ball-end milling with cutter axis inclination. It involves the kinematic reasoning of cutting edge geometry, local helix angle and average chip thickness followed by the analysis of effects of axis inclination in the contact zone between cutter and workpiece. Thereupon, development of the analytical force model for inclined-axis machining is achieved using cutter angle domain convolution method. Experimental evaluation of the model is discussed, and experimental results and model predictions under various cutting conditions are compared in the frequency as well as in the angular domain. [S1087-1357(00)70601-0]

Analytical Force Modeling of Fixed Abrasive Diamond Wire Saw Machining With Application to SiC Monocrystal Wafer Processing

2016 ◽  
Vol 139 (4) ◽  
Author(s):  
Shujuan Li ◽  
Aofei Tang ◽  
Yong Liu ◽  
Jiabin Wang ◽  
Dan Cui ◽  
...  
Keyword(s):  
Cutting Forces ◽  
Machining Process ◽  
Force Model ◽  
Diamond Wire ◽  
Wire Saw ◽  
Diamond Wire Saw ◽  
The Wire ◽  
The Relationship ◽  
Fixed Abrasive ◽  
Analytical Force Model

Free abrasive diamond wire saw machining is often used to cut hard and brittle materials, especially for wafers in the semiconductor and optoelectronics industries. Wire saws, both free and fixed abrasive, have excellent flexibility, as compared to inner circular saws, outer saws, and ribbon saws, as they produce a narrower kerf, lower cutting forces, and less material waste. However, fixed abrasive wire saw machining is being considered more and more due to its potential for increased productivity and the fact that it is more environmentally friendly as it does not use special coolants that must be carefully disposed. The cutting forces generated during the wire saw process strongly affect the quality of the produced parts. However, the relationship between these forces and the process parameters has only been explored qualitatively. Based on analyzing the forces generated from the chip formation and friction of a single abrasive, this study derives an analytical cutting force model for the wire saw machining process. The analytical model explains qualitative observations seen in the literature describing the relationship between the cutting forces and the wafer feed rate, wire velocity, and contact length between the wire and wafer. Extensive experimental work is conducted to validate the analytical force model. Silicon carbide (SiC) monocrystal, which is employed extensively in the fields of microelectronics and optoelectronics and is known to be particularly challenging to process due to its extremely high hardness and brittleness, is used as the material in these experimental studies. The results show that the analytical force model can predict the cutting forces when wire saw machining SiC monocrystal wafers with average errors between the experimental and predicted normal and tangential forces of 9.98% and 12.1%, respectively.

Sign in / Sign up

Export Citation Format

Share Document