Characterizing crack growth behavior and damage evolution in P92 steel under creep-fatigue conditions

2017 ◽  
Vol 134 ◽  
pp. 63-74 ◽  
Author(s):  
Lianyong Xu ◽  
Lei Zhao ◽  
Yongdian Han ◽  
Hongyang Jing ◽  
Zhifang Gao
Keyword(s):  
Crack Growth ◽  
Damage Evolution ◽  
Growth Behavior ◽  
Crack Growth Behavior ◽  
P92 Steel ◽  
Creep Fatigue

808 Creep fatigue crack growth behavior of 63Sn-37Pb solder

2010 ◽  
Vol 2010.47 (0) ◽  
pp. 283-284
Author(s):  
Shunsuke Inoue ◽  
Yoshiharu Mutoh ◽  
Yuichi Otsuka ◽  
Kosoku Nagata ◽  
Kazuya Kodani
Keyword(s):  
Fatigue Crack ◽  
Fatigue Crack Growth ◽  
Crack Growth ◽  
Growth Behavior ◽  
Crack Growth Behavior ◽  
Fatigue Crack Growth Behavior ◽  
Creep Fatigue ◽  
Creep Fatigue Crack

Prediction of creep crack growth behavior in ASME P92 steel welded joint

2012 ◽  
Vol 61 ◽  
pp. 185-193 ◽  
Author(s):  
Lei Zhao ◽  
Hongyang Jing ◽  
Yongdian Han ◽  
Junjie Xiu ◽  
Lianyong Xu
Keyword(s):  
Crack Growth ◽  
Welded Joint ◽  
Creep Crack Growth ◽  
Growth Behavior ◽  
Crack Growth Behavior ◽  
P92 Steel ◽  
Creep Crack

Solution chemistry effects on cracking and damage evolution during chemical-mechanical planarization

2010 ◽  
Vol 25 (10) ◽  
pp. 1904-1909 ◽  
Author(s):  
Markus D. Ong ◽  
Patrick Leduc ◽  
Daniel W. McKenzie ◽  
Thierry Farjot ◽  
Gerard Passemard ◽  
...  
Keyword(s):  
Crack Growth ◽  
Damage Evolution ◽  
Chemical Mechanical Planarization ◽  
Growth Behavior ◽  
Solution Chemistry ◽  
Crack Growth Behavior ◽  
Defect Growth ◽  
Highly Hydrophobic ◽  
Extent Of Damage ◽  
Growth Threshold

We describe progress in understanding the effect of simulated chemical-mechanical planarization (CMP) slurry chemistry on the evolution of defects and formation of damage that occurs during CMP processing. Specifically, we demonstrate the significant effect of aqueous solution chemistry on accelerating crack growth in porous methylsilsesquioxane (MSSQ) films. In addition, we show that the same aqueous solutions can diffuse rapidly into the highly hydrophobic nanoporous MSSQ films containing interconnected porosity. Such diffusion has deleterious effects on both dielectric properties and the acceleration of defect growth rates. Crack propagation rates were measured in several CMP solutions, and the resulting crack growth behavior was used to qualitatively predict the extent of damage during CMP. These predictions are compared with damage formed during actual CMP processes in identical chemistries. We discuss the effects of both the high and low crack growth rate regimes, including the presence of a crack growth threshold, on the predicted CMP damage. Finally, implications for improved CMP processing were considered.

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