On the fine-grained fingerprinting threat to software-defined networks

2020 ◽  
Vol 107 ◽  
pp. 485-497
Author(s):  
Jianwei Hou ◽  
Minjian Zhang ◽  
Ziqi Zhang ◽  
Wenchang Shi ◽  
Bo Qin ◽  
...  
Keyword(s):  
Software Defined Networks ◽  
Fine Grained

scholarly journals Improving Fairness for Distributed Interactive Applications in Software-Defined Networks

2020 ◽  
Vol 2020 ◽  
pp. 1-10
Author(s):  
Ran Xu ◽  
Weiqiang Zhang
Keyword(s):  
Resource Provisioning ◽  
Software Defined Networks ◽  
Network Resource ◽  
Interactive Applications ◽  
Fine Grained ◽  
Routing Optimization ◽  
Multiple Flows ◽  
Assignment Algorithm ◽  
Request Rate ◽  
Priority Order

With the popularization of distributed interactive applications (DIAs), for getting good interactive experience among participants, efficient and fair allocation of network resource should be considered. In software-defined networks, the presence of central controllers provides novel solution to deploy customizable routing for interactive applications, which allows fine-grained resource allocation for DIAs to achieve fairness among participants. But opportunities always come with challenges, the wide spread user locations often require distribution of controllers to meet the requirements of applications. Hence, the latency involved among participants is directly affected by the processing time of controllers. In this context, we address the DIAs’ fair resource provisioning problems on computing and links load with the objective of balancing the achievable request rate and fairness among multiple flows in SDN networks. We firstly formulate the problems as a combination of controller loading and routing optimization. Then, we propose proactive assignment controller algorithm based on deep learning and fairness path allocation algorithm to share the bottleneck links. Compared with the state-of-the-art greedy assignment algorithm and priority order allocating algorithm, the final result is proven to get better fairness on controller and link load among DIAs’ participants by trace driven simulation.

Fine-Grained Fingerprinting Threats to Software-Defined Networks

2017 ◽  
Author(s):  
Minjian Zhang ◽  
Jianwei Hou ◽  
Ziqi Zhang ◽  
Wenchang Shi ◽  
Bo Qin ◽  
...  
Keyword(s):  
Software Defined Networks ◽  
Fine Grained

scholarly journals SLA-Aware Fine-Grained QoS Provisioning for Multi-Tenant Software-Defined Networks

IEEE Access ◽  
2018 ◽  
Vol 6 ◽  
pp. 159-170 ◽  
Author(s):  
Gaolei Li ◽  
Jun Wu ◽  
Jianhua Li ◽  
Zhenyu Zhou ◽  
Longhua Guo
Keyword(s):  
Software Defined Networks ◽  
Qos Provisioning ◽  
Fine Grained

Designing Fine-grained Access Control for Software Defined Networks using Private Blockchain

2021 ◽  
pp. 1-1
Author(s):  
Durbadal Chattaraj ◽  
Basudeb Bera ◽  
Ashok Kumar Das ◽  
Joel J. P. C. Rodrigues ◽  
Young Ho Park
Keyword(s):  
Access Control ◽  
Software Defined Networks ◽  
Fine Grained

Application of an image management system in microscopy

1992 ◽  
Vol 50 (2) ◽  
pp. 1052-1053
Author(s):  
Richard S. Chemock
Keyword(s):  
Data Storage ◽  
Cost Savings ◽  
Image Data ◽  
Analytical Techniques ◽  
Operational Mode ◽  
Fine Grained ◽  
Image Recording ◽  
Primary Output ◽  
Capacity Data ◽  
Image Management System

One of the most common tasks in a typical analysis lab is the recording of images. Many analytical techniques (TEM, SEM, and metallography for example) produce images as their primary output. Until recently, the most common method of recording images was by using film. Current PS/2R systems offer very large capacity data storage devices and high resolution displays, making it practical to work with analytical images on PS/2s, thereby sidestepping the traditional film and darkroom steps. This change in operational mode offers many benefits: cost savings, throughput, archiving and searching capabilities as well as direct incorporation of the image data into reports.The conventional way to record images involves film, either sheet film (with its associated wet chemistry) for TEM or PolaroidR film for SEM and light microscopy. Although film is inconvenient, it does have the highest quality of all available image recording techniques. The fine grained film used for TEM has a resolution that would exceed a 4096x4096x16 bit digital image.

Use of fractals to describe microstructures of porous thick-film platinum electrodes

1992 ◽  
Vol 50 (1) ◽  
pp. 314-315
Author(s):  
Steven D. Toteda
Keyword(s):  
Fractal Dimension ◽  
Power Plants ◽  
Electrical Response ◽  
Cubic Phase ◽  
Platinum Electrodes ◽  
Fine Grained ◽  
Impedance Response ◽  
Platinum Particles ◽  
Energy Surfaces ◽  
Highly Porous

Zirconia oxygen sensors, in such applications as power plants and automobiles, generally utilize platinum electrodes for the catalytic reaction of dissociating O2 at the surface. The microstructure of the platinum electrode defines the resulting electrical response. The electrode must be porous enough to allow the oxygen to reach the zirconia surface while still remaining electrically continuous. At low sintering temperatures, the platinum is highly porous and fine grained. The platinum particles sinter together as the firing temperatures are increased. As the sintering temperatures are raised even further, the surface of the platinum begins to facet with lower energy surfaces. These microstructural changes can be seen in Figures 1 and 2, but the goal of the work is to characterize the microstructure by its fractal dimension and then relate the fractal dimension to the electrical response. The sensors were fabricated from zirconia powder stabilized in the cubic phase with 8 mol% percent yttria. Each substrate was sintered for 14 hours at 1200°C. The resulting zirconia pellets, 13mm in diameter and 2mm in thickness, were roughly 97 to 98 percent of theoretical density. The Engelhard #6082 platinum paste was applied to the zirconia disks after they were mechanically polished ( diamond). The electrodes were then sintered at temperatures ranging from 600°C to 1000°C. Each sensor was tested to determine the impedance response from 1Hz to 5,000Hz. These frequencies correspond to the electrode at the test temperature of 600°C.

Amorphous silica coating on α-alumina particles

1995 ◽  
Vol 53 ◽  
pp. 210-211
Author(s):  
J. W. Mellowes ◽  
C. M. Chun ◽  
I. A. Aksay
Keyword(s):  
Amorphous Silica ◽  
Heterogeneous Nucleation ◽  
Homogeneous Nucleation ◽  
Silica Coating ◽  
Full Density ◽  
Optimal Conditions ◽  
Fine Grained ◽  
Alumina Particles ◽  
Complete Mullitization ◽  
Powder Compacts

Mullite (3Al2O32SiO2) can be fabricated by transient viscous sintering using composite particles which consist of inner cores of a-alumina and outer coatings of amorphous silica. Powder compacts prepared with these particles are sintered to almost full density at relatively low temperatures (~1300°C) and converted to dense, fine-grained mullite at higher temperatures (>1500°C) by reaction between the alumina core and the silica coating. In order to achieve complete mullitization, optimal conditions for coating alumina particles with amorphous silica must be achieved. Formation of amorphous silica can occur in solution (homogeneous nucleation) or on the surface of alumina (heterogeneous nucleation) depending on the degree of supersaturation of the solvent in which the particles are immersed. Successful coating of silica on alumina occurs when heterogeneous nucleation is promoted and homogeneous nucleation is suppressed. Therefore, one key to successful coating is an understanding of the factors such as pH and concentration that control silica nucleation in aqueous solutions. In the current work, we use TEM to determine the optimal conditions of this processing.

Interfacial structures of dissimilar materials joined by capacitor-discharge welding

1994 ◽  
Vol 52 ◽  
pp. 534-535
Author(s):  
C. P. Doğan ◽  
R. D. Wilson ◽  
J. A. Hawk
Keyword(s):  
Rapid Solidification ◽  
Fusion Zone ◽  
Dissimilar Materials ◽  
Solidification Process ◽  
Weld Interface ◽  
Capacitor Discharge ◽  
Fine Grained ◽  
Iron Aluminum ◽  
Conductive Ceramics ◽  
Capacitor Discharge Welding

Capacitor Discharge Welding is a rapid solidification technique for joining conductive materials that results in a narrow fusion zone and almost no heat affected zone. As a result, the microstructures and properties of the bulk materials are essentially continuous across the weld interface. During the joining process, one of the materials to be joined acts as the anode and the other acts as the cathode. The anode and cathode are brought together with a concomitant discharge of a capacitor bank, creating an arc which melts the materials at the joining surfaces and welds them together (Fig. 1). As the electrodes impact, the arc is extinguished, and the molten interface cools at rates that can exceed 106 K/s. This process results in reduced porosity in the fusion zone, a fine-grained weldment, and a reduced tendency for hot cracking.At the U.S. Bureau of Mines, we are currently examining the possibilities of using capacitor discharge welding to join dissimilar metals, metals to intermetallics, and metals to conductive ceramics. In this particular study, we will examine the microstructural characteristics of iron-aluminum welds in detail, focussing our attention primarily on interfaces produced during the rapid solidification process.

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