Influence of organic additives on the initial stages of copper electrodeposition on polycrystalline platinum

2009 ◽  
Vol 54 (5) ◽  
pp. 1529-1536 ◽  
Author(s):  
M. Quinet ◽  
F. Lallemand ◽  
L. Ricq ◽  
J.-Y. Hihn ◽  
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Copper Electrodeposition ◽  
Organic Additives ◽  
Polycrystalline Platinum

Interface dynamics for copper electrodeposition: The role of organic additives in the growth mode

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R. C. Salvarezza ◽  
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Growth Mode ◽  
Copper Electrodeposition ◽  
Organic Additives ◽  
Interface Dynamics

Initial stages of copper electrodeposition in the presence of organic additives

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I. Vitanova ◽  
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Copper Electrodeposition ◽  
Organic Additives

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Vol 15 (5) ◽  
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Adriana Muntean ◽  
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Organic Additives

Instantaneous Fabrication of Thin MEMS Features by Copper Electrodeposition Using Modified Inkjet Printer

2020 ◽  
Vol 12 (2) ◽  
pp. 02044-1-02044-4
Author(s):  
Vimal Kumar Deshmukh ◽  
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Ankit Namdev ◽  
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...  
Keyword(s):  
Copper Electrodeposition ◽  
Inkjet Printer
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