The underpotential deposition of bismuth and tellurium on cold rolled silver substrate by ECALE

2005 ◽  
Vol 50 (27) ◽  
pp. 5465-5472 ◽  
Author(s):  
W. Zhu ◽  
J.Y. Yang ◽  
X.H. Gao ◽  
J. Hou ◽  
S.Q. Bao ◽  
...  
Keyword(s):  
Underpotential Deposition ◽  
Silver Substrate ◽  
Cold Rolled

scholarly journals Investigation of Lead Underpotential Deposition on Silver Substrate in Magnetically Treated Electrolyte

1997 ◽  
Vol 65 (4) ◽  
pp. 328-329
Author(s):  
Kazunobu YASUHARA ◽  
Takao SHIMIZU ◽  
Sachio YOSHIHARA ◽  
Takashi SHIRAKASHI ◽  
Atsushi CHIBA
Keyword(s):  
Underpotential Deposition ◽  
Silver Substrate

scholarly journals Al-Ag alloy formation by aluminium underpotential deposition from AlCl3+NaCl melts on silver substrate

2010 ◽  
Vol 48 (1) ◽  
pp. 55-71 ◽  
Author(s):  
B. RADOVIC ◽  
R. EDWARDS ◽  
V. CVETKOVIC ◽  
J. JOVICEVIC
Keyword(s):  
Underpotential Deposition ◽  
Alloy Formation ◽  
Silver Substrate

The Ordered Phase Formation in Ti-Al-Ga Alloys

1970 ◽  
Vol 28 ◽  
pp. 440-441
Author(s):  
Shiro Fujishiro ◽  
Harold L. Gegel
Keyword(s):  
Thermal Stability ◽  
High Temperature ◽  
Titanium Alloys ◽  
Growth Kinetics ◽  
Stoichiometric Composition ◽  
Good Potential ◽  
Alpha Titanium ◽  
Cold Rolled ◽  
Kinetics Of ◽  
Thermal Stability Of

Ordered-alpha titanium alloys having a DO19 type structure have good potential for high temperature (600°C) applications, due to the thermal stability of the ordered phase and the inherent resistance to recrystallization of these alloys. Five different Ti-Al-Ga alloys consisting of equal atomic percents of aluminum and gallium solute additions up to the stoichiometric composition, Ti3(Al, Ga), were used to study the growth kinetics of the ordered phase and the nature of its interface.The alloys were homogenized in the beta region in a vacuum of about 5×10-7 torr, furnace cooled; reheated in air to 50°C below the alpha transus for hot working. The alloys were subsequently acid cleaned, annealed in vacuo, and cold rolled to about. 050 inch prior to additional homogenization

Slip traces caused by plastic deformation during recrystallization of thin metal sheets

1994 ◽  
Vol 52 ◽  
pp. 620-621
Author(s):  
H. Lin ◽  
D. P. Pope
Keyword(s):  
Grain Size ◽  
Grain Boundaries ◽  
Sample Thickness ◽  
List Type ◽  
Metal Sheets ◽  
Second Phases ◽  
Slip Traces ◽  
Series Of Experiments ◽  
Cold Rolled ◽  
Individual Grains

During a study of mechanical properties of recrystallized B-free Ni3Al single crystals, regularly spaced parallel traces within individual grains were discovered on the surfaces of thin recrystallized sheets, see Fig. 1. They appeared to be slip traces, but since we could not find similar observations in the literature, a series of experiments was performed to identify them. We will refer to them “traces”, because they contain some, if not all, of the properties of slip traces. A variety of techniques, including the Electron Backscattering Pattern (EBSP) method, was used to ascertain the composition, geometry, and crystallography of these traces. The effect of sample thickness on their formation was also investigated.In summary, these traces on the surface of recrystallized Ni3Al have the following properties:1.The chemistry and crystallographic orientation of the traces are the same as the bulk. No oxides or other second phases were observed.2.The traces are not grooves caused by thermal etching at previous locations of grain boundaries.3.The traces form after recrystallization (because the starting Ni3Al is a single crystal).4.For thicknesses between 50 μm and 720 μm, the density of the traces increases as the sample thickness decreases. Only one set of “protrusion-like” traces is visible in a given grain on the thicker samples, but multiple sets of “cliff-like” traces are visible on the thinner ones (See Fig. 1 and Fig. 2).5.They are linear and parallel to the traces of {111} planes on the surface, see Fig. 3.6.Some of the traces terminate within the interior of the grains, and the rest of them either terminate at or are continuous across grain boundaries. The portion of latter increases with decreasing thickness.7.The grain size decreases with decreasing thickness, the decrease is more pronounced when the grain size is comparable with the thickness, Fig. 4.8.Traces also formed during the recrystallization of cold-rolled polycrystalline Cu thin sheets, Fig. 5.

Reduction in Down-Gradation of Cold-Rolled Extra-Deep Drawing Steels at Tata Steel

2020 ◽  
Author(s):  
A. Paul ◽  
D. Kumar ◽  
R. Chaudhary ◽  
S. Bhusan ◽  
S. Nayak ◽  
...  
Keyword(s):  
Deep Drawing ◽  
Cold Rolled

WC-3015 Alloy

Alloy Digest ◽  
1974 ◽  
Vol 23 (5) ◽  
Keyword(s):  
Mechanical Properties ◽  
High Temperature ◽  
Physical Properties ◽  
Surface Treatment ◽  
Base Alloy ◽  
Heat Treating ◽  
Rolled Sheet ◽  
Good Oxidation Resistance ◽  
Structural Applications ◽  
Cold Rolled

Abstract WC-3015 is a columbium-base alloy developed for structural applications in high-temperature oxidizing environments. It is characterized by good oxidation resistance, good mechanical properties and compatibility with silicide coatings. Cold-rolled sheet can be joined and welded without cracking. This datasheet provides information on composition, physical properties, elasticity, and tensile properties as well as creep. It also includes information on forming, heat treating, machining, joining, and surface treatment. Filing Code: Cb-21. Producer or source: Wah Chang, a Teledyne Corporation.

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