scholarly journals Thermal conductivity and Kapitza resistance of cyanate ester epoxy mix and tri-functional epoxy electrical insulations at superfluid helium temperature

Cryogenics ◽  
2012 ◽  
Vol 52 (2-3) ◽  
pp. 100-104 ◽  
Author(s):  
S. Pietrowicz ◽  
A. Four ◽  
S. Jones ◽  
S. Canfer ◽  
B. Baudouy
Cryogenics ◽  
2005 ◽  
Vol 45 (6) ◽  
pp. 404-407 ◽  
Author(s):  
G. Hattenberger ◽  
S. Carré ◽  
F.-P. Juster ◽  
B. Baudouy

2012 ◽  
Author(s):  
Slawomir Pietrowicz ◽  
Aurelian Four ◽  
Simon Canfer ◽  
Stephanie Jones ◽  
Bertrand Baudouy

Author(s):  
Aaron Bain ◽  
Ethan Languri ◽  
Venkat Padmanabhan ◽  
Jim Davidson ◽  
David Kerns

Abstract Nanoparticle additives, with their anomalous thermal conductivity, have attracted attention in research and industry as a novel mode of enhancing the heat transfer mediums. Most studies conducted on nanoparticle suspensions in liquids, pastes, or composites at present have relied on constitutive relations using properties of the bulk substance and of the nanoparticle to explain the effective thermal conductivity. In order to utilize nanoparticles in real world engineering applications, chemical functionalization of the surface of the nanoparticle is frequently employed, either to suspend in liquid applications or to stabilize in arrays. In this study, we have sought to explain the underlying mechanisms of thermal conductivity enhancement taking into consideration the nanoscale effects, such as phonon transport in the nanoparticle coupled with vibrational modes of the surface functional molecules, in order to tailor the functional groups not only for suspension stability but also for minimizing Kapitza resistance at the surface of the nanoparticle. Density functional theory simulations in SIESTA and equilibrium transport theory analysis via GOLLUM2 were used in tandem to evaluate the thermal transport at the nanoparticle to surface ligand junction. By treating the nanoparticle surface and the polymer or acid coating as distinct homogeneous substrates, a model for thermal conductivity becomes more tractable.


RSC Advances ◽  
2019 ◽  
Vol 9 (10) ◽  
pp. 5722-5730 ◽  
Author(s):  
Le Zhai ◽  
Zhenxin Liu ◽  
Chen Li ◽  
Xiongwei Qu ◽  
Qingxin Zhang ◽  
...  

h-BN particles were used to fabricate cyanate ester/core–shell structured polyacrylic/BN composites. The impact strength and the thermal conductivity of the composites were simultaneously increased, which may be used in microelectronic packaging.


High Voltage ◽  
2017 ◽  
Vol 2 (3) ◽  
pp. 167-171 ◽  
Author(s):  
Lin Wan ◽  
Xia Zhang ◽  
Guanglei Wu ◽  
Ailing Feng

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