Thermomechanical fatigue behaviors and failure mechanism of 2.5D shallow curve-link-shaped woven composites

2021 ◽  
pp. 115080
Author(s):  
Jian Song ◽  
Yongkang Zhang ◽  
Xiaojun Guo
2020 ◽  
Vol 90 (23-24) ◽  
pp. 2806-2817
Author(s):  
Juanzi Li ◽  
Wei Fan ◽  
Tao Liu ◽  
Linjia Yuan ◽  
Lili Xue ◽  
...  

Recent increases in the use of carbon fiber reinforced plastics, especially for high-temperature applications, has induced new challenges in evaluating their mechanical properties. The effects of temperature on the shear performance of 3-dimensional orthogonal and 2-dimensional plain woven composites were compared in this study through double-notch shear tests. A scanning electron microscope was employed to investigate the fiber/matrix interface properties to reveal the failure characteristics. The results showed that temperature had a visible impact on the inter-laminar shear strength (ILSS), deformation modes, and failure mechanism. The ILSS decreased as temperature increased, which was caused by the degradation of the matrix properties and fiber/matrix interface properties at high temperature. A finite element model was established to analyze the transient deformation process and the damage mechanism of the 3D orthogonal woven composite. This indicated that Z-binder yarns could improve the delamination resistance of 3D orthogonal woven composites, especially under high temperatures. The changes in failure modes of the 3D orthogonal woven composites was put down to thermal softening of the epoxy resin caused by high temperature and the undulation of the yarns.


2021 ◽  
Vol 166 ◽  
pp. 108115
Author(s):  
Qiwei Guo ◽  
Yifan Zhang ◽  
Diansen Li ◽  
Mohan Li ◽  
Xiaolun Sun ◽  
...  

Author(s):  
Jin Young Kim ◽  
R. E. Hummel ◽  
R. T. DeHoff

Gold thin film metallizations in microelectronic circuits have a distinct advantage over those consisting of aluminum because they are less susceptible to electromigration. When electromigration is no longer the principal failure mechanism, other failure mechanisms caused by d.c. stressing might become important. In gold thin-film metallizations, grain boundary grooving is the principal failure mechanism.Previous studies have shown that grain boundary grooving in gold films can be prevented by an indium underlay between the substrate and gold. The beneficial effect of the In/Au composite film is mainly due to roughening of the surface of the gold films, redistribution of indium on the gold films and formation of In2O3 on the free surface and along the grain boundaries of the gold films during air annealing.


2008 ◽  
Vol 11 (-1) ◽  
pp. 188-201 ◽  
Author(s):  
Piotr Bogacz ◽  
Jarosława Kaczmarek ◽  
Danuta Leśniewska

Sign in / Sign up

Export Citation Format

Share Document