Investigating the integral-structure of HRBP/CHP/CF consisting of non-woven flexible inter/intra-ply hybrid composites: Compression, puncture-resistance, electromagnetic interference shielding effectiveness

2020 ◽  
Vol 248 ◽  
pp. 112501
Author(s):  
Ruosi Yan ◽  
Qianyu Zhang ◽  
Bao Shi ◽  
Zhigang Qin ◽  
Sainan Wei ◽  
...  
Keyword(s):  
Electromagnetic Interference ◽  
Hybrid Composites ◽  
Shielding Effectiveness ◽  
Electromagnetic Interference Shielding ◽  
Puncture Resistance ◽  
Integral Structure ◽  
Electromagnetic Interference Shielding Effectiveness

Tunable electromagnetic interference shielding ability of MXene/chitosan/silver nanowire sandwich films

2021 ◽  
pp. 2151041
Author(s):  
Wei Wang ◽  
Xiaoyu Bing ◽  
Yutong Zhou ◽  
Miaomiao Geng ◽  
Yanhu Zhan ◽  
...  
Keyword(s):  
Thin Films ◽  
Electromagnetic Interference ◽  
Hybrid Composites ◽  
Core Layer ◽  
Structure Design ◽  
Silver Nanowire ◽  
Shielding Effectiveness ◽  
Electromagnetic Interference Shielding ◽  
Electromagnetic Interference Shielding Effectiveness ◽  
Emi Se

The structural design of thin films is attracting attention in academia and industry in attempts to improve electromagnetic interference shielding effectiveness (EMI SE). In this study, MXene/chitosan/silver nanowire (AgNW) sandwich films, in which the AgNW core layer was bordered by two MXene/chitosan layers, were fabricated by vacuum-assisted filtration. Because of the interconnected AgNWs in the core layer and the aligned MXene sheets in the MXene/chitosan layers, the electrical conductivity of the sandwich film reached 11,459.1 S/m. Consequently, the sandwich film exhibited an SE value of 82.3 dB. What is more, when both the AgNW and MXene contents were 33.3%, the sandwich film’s EMI SE divided by its thickness was 26,167 dB/cm, which was much superior to the values reported for inorganic hybrid composites and polymer composites filled with hybrid fillers. Such a simple approach was proved to be an effective way for further structure design of thin films in EMI shielding field.

Electromagnetic interference shielding effectiveness of polypyrrole-silver nanocomposite films on silane-modified flexible sheet

2021 ◽  
pp. 095400832110645
Author(s):  
Karim Benzaoui ◽  
Achour Ales ◽  
Ahmed Mekki ◽  
Abdelhalim Zaoui ◽  
Boudjemaa Bouaouina ◽  
...  
Keyword(s):  
Surface Treatment ◽  
Electromagnetic Interference ◽  
Nanocomposite Films ◽  
Electrical Characteristics ◽  
Shielding Effectiveness ◽  
Emi Shielding ◽  
Electromagnetic Interference Shielding ◽  
Silver Nanocomposite ◽  
Electromagnetic Interference Shielding Effectiveness ◽  
Emi Se

The conventional electromagnetic interference (EMI) shielding materials are being gradually replaced by a new generation of supported conducting polymer composites (CPC) films due to their many advantages. This work presents a contribution on the effects of silane surface–modified flexible polypyrrole-silver nanocomposite films on the electromagnetic interference shielding effectiveness (EMI-SE). Thus, the UV-polymerization was used to in-situ deposit the PPy-Ag on the biaxial oriented polyethylene terephthalate (BOPET) flexible substrates whose surfaces were treated by 3-aminopropyltrimethoxysilane (APTMS). X-ray Photoelectron Spectroscopy (XPS) analyzes confirmed the APTMS grafting procedure. Structural, morphological, thermal, and electrical characteristics of the prepared films were correlated to the effect of substrate surface treatment. Thereafter, EMI-SE measurements of the elaborated films were carried out as per ASTM D4935 standard for a wide frequency band extending from 50 MHz to 18 GHz. The obtained results confirmed that the APTMS-treated BOPET film exhibit higher EMI shielding performance and better electrical characteristics compared to the untreated film. In fact, a 32% enhancement of EMI-SE was noted for the treated films compared to the untreated ones. Overall, these results put forward the role played by the surface treatment in strengthening the position of flexible PPy-Ag supported films as high-performance materials in electronic devices and electromagnetic interference shielding applications.

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