scholarly journals Micromechanical finite element parametric study of polyamide 6 based single polymer composites reinforced by woven textile structures

2019 ◽  
Vol 225 ◽  
pp. 111088
Author(s):  
Shafagh D. Tohidi ◽  
Ana Maria Rocha ◽  
Bernhard Engesser ◽  
Nadya V. Dencheva ◽  
Zlatan Denchev
Keyword(s):  
Finite Element ◽  
Polymer Composites ◽  
Parametric Study ◽  
Polyamide 6 ◽  
Woven Textile

scholarly journals Finite Element Modeling of the Fiber-Matrix Interface in Polymer Composites

2020 ◽  
Vol 4 (2) ◽  
pp. 58 ◽  
Author(s):  
Daljeet K. Singh ◽  
Amol Vaidya ◽  
Vinoy Thomas ◽  
Merlin Theodore ◽  
Surbhi Kore ◽  
...  
Keyword(s):  
Finite Element ◽  
Stress Distribution ◽  
Polymer Composites ◽  
Parametric Study ◽  
Single Fiber ◽  
Interface Debonding ◽  
Matrix Interface ◽  
The Matrix ◽  
Fiber Matrix Interface ◽  
Fiber Matrix

Polymer composites are used in numerous industries due to their high specific strength and high specific stiffness. Composites have markedly different properties than both the reinforcement and the matrix. Of the several factors that govern the final properties of the composite, the interface is an important factor that influences the stress transfer between the fiber and matrix. The present study is an effort to characterize and model the fiber-matrix interface in polymer matrix composites. Finite element models were developed to study the interfacial behavior during pull-out of a single fiber in continuous fiber-reinforced polymer composites. A three-dimensional (3D) unit-cell cohesive damage model (CDM) for the fiber/matrix interface debonding was employed to investigate the effect of interface/sizing coverage on the fiber. Furthermore, a two-dimensional (2D) axisymmetric model was used to (a) analyze the sensitivity of interface stiffness, interface strength, friction coefficient, and fiber length via a parametric study; and (b) study the shear stress distribution across the fiber-interface-matrix zone. It was determined that the force required to debond a single fiber from the matrix is three times higher if there is adequate distribution of the sizing on the fiber. The parametric study indicated that cohesive strength was the most influential factor in debonding. Moreover, the stress distribution model showed the debonding mechanism of the interface. It was observed that the interface debonded first from the matrix and remained in contact with the fiber even when the fiber was completely pulled out.

Parametric Study of a Simply Supported Composite Plate Using Finite Element Method

2014 ◽  
Vol 4 (4) ◽  
pp. 26-33
Author(s):  
P.Deepak Kumar ◽  
◽  
Ishan Sharma ◽  
P.R. Maiti ◽  
◽  
...  
Keyword(s):  
Finite Element Method ◽  
Finite Element ◽  
Parametric Study ◽  
Composite Plate ◽  
Simply Supported ◽  
Element Method

A Fracture Mechanics Based Parametric Study of the Copper-to-Copper Direct Thermo-Compression Bonded Interface Using Finite Element Method

2013 ◽  
Author(s):  
Ah-Young Park ◽  
Satish Chaparala ◽  
Seungbae Park
Keyword(s):  
Finite Element Method ◽  
Finite Element ◽  
Parametric Study ◽  
Initial Crack ◽  
Bonding Interface ◽  
Interface Condition ◽  
Large Temperature ◽  
Bonded Interface ◽  
The Impact ◽  
Element Method

Through-silicon via (TSV) technology is expected to overcome the limitations of I/O density and helps in enhancing system performance of conventional flip chip packages. One of the challenges for producing reliable TSV packages is the stacking and joining of thin wafers or dies. In the case of the conventional solder interconnections, many reliability issues arise at the interface between solder and copper bump. As an alternative solution, Cu-Cu direct thermo-compression bonding (CuDB) is a possible option to enable three-dimension (3D) package integration. CuDB has several advantages over the solder based micro bump joining, such as reduction in soldering process steps, enabling higher interconnect density, enhanced thermal conductivity and decreased concerns about intermetallic compounds (IMC) formation. Critical issue of CuDB is bonding interface condition. After the bonding process, Cu-Cu direct bonding interface is obtained. However, several researchers have reported small voids at the bonded interface. These defects can act as an initial crack which may lead to eventual fracture of the interface. The fracture could happen due to the thermal expansion coefficient (CTE) mismatch between the substrate and the chip during the postbonding process, board level reflow or thermal cycling with large temperature changes. In this study, a quantitative assessment of the energy release rate has been made at the CuDB interface during temperature change finite element method (FEM). A parametric study is conducted to analyze the impact of the initial crack location and the material properties of surrounding materials. Finally, design recommendations are provided to minimize the probability of interfacial delamination in CuDB.

scholarly journals A Computational Study of the Shear Behavior of Reinforced Concrete Beams Affected from Alkali–Silica Reactivity Damage

Materials ◽  
2021 ◽  
Vol 14 (12) ◽  
pp. 3346
Author(s):  
Bora Gencturk ◽  
Hadi Aryan ◽  
Mohammad Hanifehzadeh ◽  
Clotilde Chambreuil ◽  
Jianqiang Wei
Keyword(s):  
Finite Element ◽  
Reinforced Concrete ◽  
Parametric Study ◽  
Computational Study ◽  
Element Model ◽  
Shear Behavior ◽  
Shear Capacity ◽  
Reinforced Concrete Beams ◽  
Alkali Silica Reactivity ◽  
Concrete Mechanical Properties

In this study, an investigation of the shear behavior of full-scale reinforced concrete (RC) beams affected from alkali–silica reactivity damage is presented. A detailed finite element model (FEM) was developed and validated with data obtained from the experiments using several metrics, including a force–deformation curve, rebar strains, and crack maps and width. The validated FEM was used in a parametric study to investigate the potential impact of alkali–silica reactivity (ASR) degradation on the shear capacity of the beam. Degradations of concrete mechanical properties were correlated with ASR expansion using material test data and implemented in the FEM for different expansions. The finite element (FE) analysis provided a better understanding of the failure mechanism of ASR-affected RC beam and degradation in the capacity as a function of the ASR expansion. The parametric study using the FEM showed 6%, 19%, and 25% reduction in the shear capacity of the beam, respectively, affected from 0.2%, 0.4%, and 0.6% of ASR-induced expansion.

Modal Analyses of Deployable Truss Structures Based on Shape Memory Polymer Composites

2016 ◽  
Vol 08 (07) ◽  
pp. 1640009 ◽  
Author(s):  
Fengfeng Li ◽  
Liwu Liu ◽  
Xin Lan ◽  
Tong Wang ◽  
Xiangyu Li ◽  
...  
Keyword(s):  
Finite Element ◽  
Shape Memory ◽  
Polymer Composites ◽  
Dynamic Properties ◽  
Low Cost ◽  
Shape Memory Polymer ◽  
Truss Structures ◽  
Modal Test ◽  
The Stability ◽  
Mechanical Devices

With large spatial deployable antennas used more widely, the stability of deployable antennas is attracting more attention. The form of the support structure is an important factor of the antenna’s natural frequency, which is essential to study to prevent the resonance. The deployable truss structures based on shape memory polymer composites (SMPCs) have made themselves feasible for their unique properties such as highly reliable, low-cost, light weight, and self-deployment without complex mechanical devices compared with conventional deployable masts. This study offers deliverables as follows: an establishment of three-longeron beam and three-longeron truss finite element models by using ABAQUS; calculation of natural frequencies and vibration modes; parameter studies for influence on their dynamic properties; manufacture of a three-longeron truss based on SMPC, and modal test of the three-longeron truss. The results show that modal test and finite element simulation fit well.

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