Fracture analysis of a metal to CFRP hybrid with thermoplastic interlayers for interfacial stress relaxation using in situ thermography

2018 ◽  
Vol 193 ◽  
pp. 19-28 ◽  
Author(s):  
Jannik Summa ◽  
Michael Becker ◽  
Felix Grossmann ◽  
Markus Pohl ◽  
Markus Stommel ◽  
...  
Keyword(s):  
Stress Relaxation ◽  
Fracture Analysis ◽  
Interfacial Stress

The Effect of Line Geometry on Void Growth in Thin, Narrow Aluminum Lines

1991 ◽  
Vol 226 ◽  
Author(s):  
P. Borgesen ◽  
J. K. Lee ◽  
M. A. Korhonen ◽  
C.-Y. Li
Keyword(s):  
Stress Relaxation ◽  
Void Growth ◽  
Room Temperature ◽  
Line Geometry

AbstractThe stress induced growth of individual voids in passivated Al-lines at room temperature was monitored in-situ without removing the passivation. The kinetics was strongly influenced by variations in line gec.etry, even over distances of many Am, indicating variations in the stress relaxation as well.

Enhancing the toughness of composites via dynamic thiol–thioester exchange (TTE) at the resin–filler interface

2020 ◽  
Vol 11 (29) ◽  
pp. 4760-4767 ◽  
Author(s):  
Nancy Sowan ◽  
Yinan Lu ◽  
Kevin J. Kolb ◽  
Lewis M. Cox ◽  
Rong Long ◽  
...  
Keyword(s):  
Stress Relaxation ◽  
Mechanical Performance ◽  
Interfacial Stress ◽  
Adaptive Interface ◽  
Thioester Exchange

An adaptive interface employing thiol-thioester exchange (TTE) at the resin-filler interface is introduced to promote interfacial stress relaxation and improve the mechanical performance of thermosetting composites.

Effect of Deposition Conditions on Intrinsic Stress, Phase Transformation and Stress Relaxation in Tantalum Thin Films

1991 ◽  
Vol 239 ◽  
Author(s):  
A. Mutscheller ◽  
L. A. Clevenger ◽  
J.M.E. Harper ◽  
C. Cabrai ◽  
K. Barmakt
Keyword(s):  
Thin Films ◽  
Phase Transition ◽  
Phase Transformation ◽  
Stress Relaxation ◽  
Compressive Stress ◽  
Stress Relief ◽  
Beta Phase ◽  
Alpha Phase ◽  
Intrinsic Stress

AbstractWe demonstrate that the high temperature polymorphic tantalum phase transition from the tetragonal beta phase to the cubic alpha phase causes complete stress relaxation and a large decrease in the resistance of tantalum thin films. 100 nm beta tantalum thin films were deposited onto thermally oxidized <100> silicon wafers by dc magnetron sputtering with argon. In situ stress and resistance at temperature were measured during temperature-ramped annealing in purified He. Upon heating, films that were initially compressively stressed showed increasing compressive stress due to thermo-elastic deformation from 25 to 550°C, slight stress relief due to plastic deformation from 550 to 700°C and complete stress relief due to the beta to alpha phase transformation at approximately 700–800°C. Incomplete compressive stress relaxation was observed at high temperatures if the film was initially deposited in the alpha phase or if the beta phase did not completely transform into alpha by 800°C. This incomplete beta to alpha phase transition was most commonly observed on samples that had radio frequency substrate bias greater than -100 V. We conclude that the main stress relief mechanism for tantalum thin films is the beta to alpha phase transformation that occurs at 700 to 800°C.

Direct Osmotic Pressure Measurements in Articular Cartilage Demonstrate Nonideal and Concentration-Dependent Phenomena

2020 ◽  
Vol 143 (4) ◽  
Author(s):  
Brandon K. Zimmerman ◽  
Robert J. Nims ◽  
Alex Chen ◽  
Clark T. Hung ◽  
Gerard A. Ateshian
Keyword(s):  
Articular Cartilage ◽  
Stress Relaxation ◽  
Osmotic Pressure ◽  
Electrostatic Interactions ◽  
Swelling Pressure ◽  
Confined Compression ◽  
Human Cartilage ◽  
Poisson Boltzmann ◽  
Triphasic Theory

Abstract The osmotic pressure in articular cartilage serves an important mechanical function in healthy tissue. Its magnitude is thought to play a role in advancing osteoarthritis. The aims of this study were to: (1) isolate and quantify the magnitude of cartilage swelling pressure in situ; and (2) identify the effect of salt concentration on material parameters. Confined compression stress-relaxation testing was performed on 18 immature bovine and six mature human cartilage samples in solutions of varying osmolarities. Direct measurements of osmotic pressure revealed nonideal and concentration-dependent osmotic behavior, with magnitudes approximately 1/3 those predicted by ideal Donnan law. A modified Donnan constitutive behavior was able to capture the aggregate behavior of all samples with a single adjustable parameter. Results of curve-fitting transient stress-relaxation data with triphasic theory in febio demonstrated concentration-dependent material properties. The aggregate modulus HA increased threefold as the external concentration decreased from hypertonic 2 M to hypotonic 0.001 M NaCl (bovine: HA=0.420±0.109 MPa to 1.266±0.438 MPa; human: HA=0.499±0.208 MPa to 1.597±0.455 MPa), within a triphasic theory inclusive of osmotic effects. This study provides a novel and simple analytical model for cartilage osmotic pressure which may be used in computational simulations, validated with direct in situ measurements. A key finding is the simultaneous existence of Donnan osmotic and Poisson–Boltzmann electrostatic interactions within cartilage.

Experimental In Situ Characterization and Creep Modeling of Tin-Based Solder Joints on Commercial Area Array Packages at −40 °C , 23 °C , and 125 °C

2004 ◽  
Vol 127 (4) ◽  
pp. 430-439 ◽  
Author(s):  
Ahmad Abu Obaid ◽  
Jay G. Sloan ◽  
Mark A. Lamontia ◽  
Antonio Paesano ◽  
Subhotosh Khan ◽  
...  
Keyword(s):  
Stress Relaxation ◽  
Constitutive Model ◽  
Solder Ball ◽  
Solder Joints ◽  
Shear Loading ◽  
Area Array ◽  
Commercial Area ◽  
Wide Range ◽  
Solder Balls

The objective of this work was to experimentally determine the in situ creep behavior and constitutive model equations for a commercial area array package and printed wiring board assembly at −40, 23, and 125 °C through shear loading. The chip is connected to the printed circuit board by means of solder joints made of 62%Sn–36%Pb–2%Ag alloy. It was shown that the creep rate of solder ball arrays could be investigated using a stress relaxation method. Under the shear relaxation mode, the creep strain increases with temperature and can be described by a power law model with coefficients determined by finite element modeling (FEM). An analytical model was developed to describe the stress relaxation of an array with an arbitrary number of solder balls by defining an equivalent solder ball shear area as a fitting parameter. The resulting constitutive model is in excellent agreement with both FEM and experimental results at all test temperatures. A parametric study is conducted to investigate the creep response as a function of temperature for arrays consisting of a wide range of solder balls.

In Situ Measurements of Stress Relaxation During Strained Layer Heteroepitaxy

1999 ◽  
Vol 583 ◽  
Author(s):  
E. Chason ◽  
J. Yin ◽  
K. Tetz ◽  
R. Beresford ◽  
L. B. Freund ◽  
...  
Keyword(s):  
Elevated Temperature ◽  
Stress Relaxation ◽  
Epitaxial Growth ◽  
Real Time ◽  
Misfit Strain ◽  
Misfit Stress ◽  
Relaxation Kinetics ◽  
Substrate Interface ◽  
Temperature Relaxation

AbstractWe present real-time measurements of stress relaxation kinetics during epitaxial growth obtained using a wafer-curvature-based technique optimized for in situ studies. Depending on the temperature and misfit strain, different mechanisms of stress relaxation are observed. In heterolayers of InGaAs grown on GaAs (001) substrates, relaxation occurs by a dislocationmediated mechanism. In SiGe layers grown on Si (001) substrates at elevated temperature, relaxation occurs by the formation of islands on the surface. These islands elastically relax misfit stress without the introduction of dislocations at the island-substrate interface.

The Effect of Anisotropy of Medium on the Stress State around a Borehole

2011 ◽  
Vol 291-294 ◽  
pp. 2139-2144
Author(s):  
Yong Shu Jiao ◽  
Mu Hui Fan ◽  
Li Juan Li ◽  
Zong Xi Cai
Keyword(s):  
Maximum Shear Stress ◽  
Bedding Plane ◽  
Fracture Analysis ◽  
In Situ Stress ◽  
Stress Changes ◽  
Degree Of Anisotropy ◽  
Inclined Boreholes ◽  
Collapse Failure ◽  
Inclined Borehole

Based on the analytical solution for the stress field around an inclined borehole in an anisotropic medium, a computer program was developed and a serial parametric study was conducted. The effects of parameters such as degree of anisotropy, borehole inclination, bedding plane inclination and in-situ stress conditions on the stress distribution around a borehole were evaluated. The results showed that medium anisotropy has little effect on borehole fracture analysis at low borehole inclinations, but its influence becomes significant for highly inclined boreholes. As the degree of anisotropy varies the maximum shear stress changes remarkably. This indicates that the degree of anisotropy plays a role in the collapse failure of a borehole. The information generated in these studies can be used in predicting the fracture or collapse-initiating pressures.

An in Situ Dual Indentation and Optimization Method to Determine Mechanical Properties of Articular Cartilage

2007 ◽  
Author(s):  
Jonathan E. Pottle ◽  
J.-K. Francis Suh
Keyword(s):  
Articular Cartilage ◽  
Stress Relaxation ◽  
Structural Integrity ◽  
Reaction Force ◽  
Model Parameters ◽  
Unconfined Compression ◽  
Confined Compression ◽  
Practical Applications

The efficacy of the biphasic poroviscoelastic (BPVE) theory [1] in constitutive modeling of articular cartilage biomechanics is well-established [2–4]. Indeed, this model has been used to simultaneously predict stress relaxation force across confined compression, unconfined compression, and indentation protocols [2,3]. Previous works have also demonstrated success in simultaneously curve-fitting the BPVE model to reaction force and lateral deformation data gathered from stress relaxation tests of articular cartilage in unconfined compression [4]. However, a potential limitation of practical applications of such a successful model is seen in some commonly-employed mechanical testing methods for articular cartilage, such as confined compression and unconfined compression. These methods require the excision of a disk of cartilage from its underlying subchondral base, which likely would compromise the structural integrity of the tissue, causing swelling and curling artifacts of the sample [5]. Indentation represents a testing protocol that can be used with an intact cartilage layer. This results in a specimen more closely resembling cartilage in vivo. Using an agarose gel construct, our previous study [6] has demonstrated that a unique set of the six BPVE model parameters of a soft tissue can be determined readily from in situ dual indentation method using stress relaxation and creep viscoelastic protocols. The objective of the current study is to validate the efficacy of this technique as a means to determine the BPVE material parameters of articular cartilage.

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