Experimental characterization of a fiber metal laminate for underwater applications

2015 ◽  
Vol 129 ◽  
pp. 36-46 ◽  
Author(s):  
E. Poodts ◽  
D. Ghelli ◽  
T. Brugo ◽  
R. Panciroli ◽  
G. Minak
Keyword(s):  
Experimental Characterization ◽  
Fiber Metal Laminate ◽  
Fiber Metal

Dynamic Characterization of a Fiber-Metal Laminate

2013 ◽  
Vol 535-536 ◽  
pp. 48-51 ◽  
Author(s):  
Rafael Celeghini Santiago ◽  
Marcilio Alves
Keyword(s):  
High Speed ◽  
High Strain ◽  
Strain Rates ◽  
Dynamic Characterization ◽  
Fiber Glass ◽  
Strain And Strain Rate ◽  
Fiber Metal Laminate ◽  
Split Hopkinson ◽  
Fiber Metal

The mechanical strength of a fiber-metal laminate is not so well explored at high strain rates, although its constituents are prone to exhibit such effects. In this paper, we describe an investigation of aluminium-fiber glass material using the Split Hopkinson bar device. We report on various experimental issues related to these tests, giving some emphasis to the use of high speed filming to obtain information on the specimen strain and strain rate.

Development and characterization of novel fiber-metal-laminate (FML) using aluminium sheet and ceramic mat

2019 ◽  
Vol 9 (4) ◽  
pp. 358-364
Author(s):  
V. N. Anbazhagan ◽  
R. Edwin Raj ◽  
J. T. Winowlin Jappes
Keyword(s):  
Aluminium Sheet ◽  
Fiber Metal Laminate ◽  
Fiber Metal

Experimental Characterization of the Bearing Strength of Fiber Metal Laminates

2007 ◽  
Vol 41 (26) ◽  
pp. 3109-3131 ◽  
Author(s):  
P.P. Krimbalis ◽  
C. Poon ◽  
Z. Fawaz ◽  
K. Behdinan
Keyword(s):  
Experimental Characterization ◽  
Fiber Metal Laminates ◽  
Bearing Strength ◽  
Fiber Metal

Experimental Characterization of the Reliability of 3-Terminal Dual-Damascene Copper Interconnect Trees

2002 ◽  
Vol 716 ◽  
Author(s):  
C. L. Gan ◽  
C. V. Thompson ◽  
K. L. Pey ◽  
W. K. Choi ◽  
F. Wei ◽  
...  
Keyword(s):  
Stress Conditions ◽  
Experimental Characterization ◽  
Contact Lines ◽  
Tree Structures ◽  
Similar Test ◽  
Dual Damascene ◽  
Copper Interconnect ◽  
Test Conditions

AbstractElectromigration experiments have been carried out on simple Cu dual-damascene interconnect tree structures consisting of straight via-to-via (or contact-to-contact) lines with an extra via in the middle of the line. As with Al-based interconnects, the reliability of a segment in this tree strongly depends on the stress conditions of the connected segment. Beyond this, there are important differences in the results obtained under similar test conditions for Al-based and Cu-based interconnect trees. These differences are thought to be associated with variations in the architectural schemes of the two metallizations. The absence of a conducting electromigrationresistant overlayer in Cu technology, and the possibility of liner rupture at stressed vias lead to significant differences in tree reliabilities in Cu compared to Al.

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