A three-dimensional thermo-viscoelastic analysis of process-induced residual stress in composite laminates

2015 ◽  
Vol 129 ◽  
pp. 60-69 ◽  
Author(s):  
Anxin Ding ◽  
Shuxin Li ◽  
Jihui Wang ◽  
Lei Zu
Keyword(s):  
Residual Stress ◽  
Composite Laminates ◽  
Three Dimensional ◽  
Viscoelastic Analysis

scholarly journals Numerical Analysis of Curing Residual Stress and Deformation in Thermosetting Composite Laminates with Comparison between Different Constitutive Models

Materials ◽  
2019 ◽  
Vol 12 (4) ◽  
pp. 572 ◽  
Author(s):  
Jianfeng Dai ◽  
Shangbin Xi ◽  
Dongna Li
Keyword(s):  
Residual Stress ◽  
Composite Laminates ◽  
Viscoelastic Model ◽  
Three Dimensional ◽  
Constitutive Models ◽  
Curing Process ◽  
Linear Elastic ◽  
Stress And Deformation ◽  
Thermosetting Composite ◽  
Residual Stress And Deformation

A multi-physics coupling numerical model of the curing process is proposed for the thermosetting resin composites in this paper, and the modified “cure hardening instantaneously linear elastic (CHILE)” model and viscoelastic model are adopted to forecast residual stress and deformation during the curing process. The thermophysical properties of both models are evolved in line with temperature and degree of cure (DOC). Accordingly, the numerical simulation results are improved to be more accurate. Additionally, the elastic modulus of the materials is calibrated to be equal to the modulus of viscoelastic relaxation by a defined function of time in the CHILE model. Subsequently, this work effectuates the two proposed models in a three-dimensional composite laminate structure. Through comparing the two numerical outcomes, it is customary that the residual stress and deformation acquired by the modified model of CHILE conform to those ones assessed through adopting the viscoelastic model.

Influence of the Welded Joint on the Mechanical Behavior of Steel Piles during Static and Dynamic Deformation

2007 ◽  
Vol 345-346 ◽  
pp. 1469-1472
Author(s):  
Gab Chul Jang ◽  
Kyong Ho Chang ◽  
Chin Hyung Lee
Keyword(s):  
Residual Stress ◽  
Stress Distribution ◽  
Mechanical Behavior ◽  
Welded Joint ◽  
Dynamic Deformation ◽  
Three Dimensional ◽  
Steel Structures ◽  
Residual Stress Distribution ◽  
Dynamic Mechanical Behavior ◽  
Steel Piles

During manufacturing the welded joint of steel structures, residual stress is produced and weld metal is used inevitably. And residual stress and weld metal influence on the static and dynamic mechanical behavior of steel structures. Therefore, to predict the mechanical behavior of steel pile with a welded joint during static and dynamic deformation, the research on the influence of the welded joints on the static and dynamic behavior of steel pile is clarified. In this paper, the residual stress distribution in a welded joint of steel piles was investigated by using three-dimensional welding analysis. The static and dynamic mechanical behavior of steel piles with a welded joint is investigated by three-dimensional elastic-plastic finite element analysis using a proposed dynamic hysteresis model. Numerical analyses of the steel pile with a welded joint were compared to that without a welded joint with respect to load carrying capacity and residual stress distribution. The influence of the welded joint on the mechanical behavior of steel piles during static and dynamic deformation was clarified by comparing analytical results

Effect of Residual Stress or Plastic Deformation History on Fatigue Life Simulation of Pipeline Dents

2018 ◽  
Author(s):  
Xian-Kui Zhu ◽  
Rick Wang
Keyword(s):  
Residual Stress ◽  
Plastic Deformation ◽  
Fatigue Life ◽  
Residual Stresses ◽  
Three Dimensional ◽  
Strain History ◽  
Deformation History ◽  
Stress Strain ◽  
Element Analysis ◽  
Fea Model

Mechanical dents often occur in transmission pipelines, and are recognized as one of major threats to pipeline integrity because of the potential fatigue failure due to cyclic pressures. With matured in-line-inspection (ILI) technology, mechanical dents can be identified from the ILI runs. Based on ILI measured dent profiles, finite element analysis (FEA) is commonly used to simulate stresses and strains in a dent, and to predict fatigue life of the dented pipeline. However, the dent profile defined by ILI data is a purely geometric shape without residual stresses nor plastic deformation history, and is different from its actual dent that contains residual stresses/strains due to dent creation and re-rounding. As a result, the FEA results of an ILI dent may not represent those of the actual dent, and may lead to inaccurate or incorrect results. To investigate the effect of residual stress or plastic deformation history on mechanics responses and fatigue life of an actual dent, three dent models are considered in this paper: (a) a true dent with residual stresses and dent formation history, (b) a purely geometric dent having the true dent profile with all stress/strain history removed from it, and (c) a purely geometric dent having an ILI defined dent profile with all stress/strain history removed from it. Using a three-dimensional FEA model, those three dents are simulated in the elastic-plastic conditions. The FEA results showed that the two geometric dents determine significantly different stresses and strains in comparison to those in the true dent, and overpredict the fatigue life or burst pressure of the true dent. On this basis, suggestions are made on how to use the ILI data to predict the dent fatigue life.

scholarly journals Residual Strength Analysis Method for Composite Laminates with Internal Defects Using a Quasi-Three-Dimensional Model.

1993 ◽  
Vol 59 (563) ◽  
pp. 1697-1701 ◽  
Author(s):  
Tsuyoshi Nishiwaki ◽  
Atsushi Yokoyama ◽  
Zen'ichiro Maekwa ◽  
Hiroyuki Hamada ◽  
Yoshinori Maekawa ◽  
...  
Keyword(s):  
Residual Strength ◽  
Composite Laminates ◽  
Three Dimensional ◽  
Strength Analysis ◽  
Analysis Method ◽  
Dimensional Model ◽  
Three Dimensional Model ◽  
Internal Defects

scholarly journals Wave Propagation Analysis in Composite Laminates Containing a Delamination Using a Three-Dimensional Spectral Element Method

2012 ◽  
Vol 2012 ◽  
pp. 1-19 ◽  
Author(s):  
Fucai Li ◽  
Haikuo Peng ◽  
Xuewei Sun ◽  
Jinfu Wang ◽  
Guang Meng
Keyword(s):  
Wave Propagation ◽  
Lamb Wave ◽  
Composite Laminates ◽  
Composite Structures ◽  
Spectral Element Method ◽  
Three Dimensional ◽  
Spectral Element ◽  
Wave Mode ◽  
Diagonal Form ◽  
Element Method

A three-dimensional spectral element method (SEM) was developed for analysis of Lamb wave propagation in composite laminates containing a delamination. SEM is more efficient in simulating wave propagation in structures than conventional finite element method (FEM) because of its unique diagonal form of the mass matrix. Three types of composite laminates, namely, unidirectional-ply laminates, cross-ply laminates, and angle-ply laminates are modeled using three-dimensional spectral finite elements. Wave propagation characteristics in intact composite laminates are investigated, and the effectiveness of the method is validated by comparison of the simulation results with analytical solutions based on transfer matrix method. Different Lamb wave mode interactions with delamination are evaluated, and it is demonstrated that symmetric Lamb wave mode may be insensitive to delamination at certain interfaces of laminates while the antisymmetric mode is more suited for identification of delamination in composite structures.

Minimization of the Local Residual Stress in 3D Flip Chip Structures by Optimizing the Mechanical Properties of Electroplated Materials and the Alignment Structure of TSVs and Fine Bumps

2011 ◽  
Author(s):  
Kohta Nakahira ◽  
Hironori Tago ◽  
Fumiaki Endo ◽  
Ken Suzuki ◽  
Hideo Miura
Keyword(s):  
Mechanical Properties ◽  
Residual Stress ◽  
Thermal Deformation ◽  
Flip Chip ◽  
Flexural Rigidity ◽  
Three Dimensional ◽  
Strain Gauges ◽  
Copper Interconnection ◽  
Induced Stress ◽  
Alignment Structure

Since the thickness of the stacked silicon chips in 3D integration has been thinned to less than 100 μm, the local thermal deformation of the chips has increased drastically because of the decrease of the flexural rigidity of the thinned chips. The clear periodic thermal deformation and thus, the thermal residual stress distribution appears in the stacked chips due to the periodic alignment of metallic bumps, and they deteriorate the reliability of products. In this paper, the dominant structural factors of the local residual stress in a silicon chip are discussed quantitatively based on the results of a three-dimensional finite element analysis and the measurement of the local residual stress in a chip using stress sensor chips. The piezoresistive strain gauges were embedded in the sensor chips. The length of each gauge was 2 μm, and an unit cell consisted of 4 gauges with different crystallographic directions. This alignment of strain gauges enables to measure the tensor component of three-dimensional stress fields separately. Test flip chip substrates were made by silicon chip on which the area-arrayed tin/copper bumps were electroplated. The width of a bump was fixed at 200 μm, and the bump pitch was varied from 400 μm to 1000 μm. The thickness of the copper layer was about 40 μm and that of tin layer was about 10 μm. This tin layer was used for the rigid joint formation by alloying with copper interconnection formed on a stress sensing chip. The measured amplitude of the residual stress increased from about 30 MPa to 250 MPa depending on the combination of materials such as bump, underfill, and interconnections. It was confirmed that both the material constant of underfill and the alignment structure of fine bumps are the dominant factors of the local deformation and stress of a silicon chip mounted on area-arrayed metallic bumps. It was also confirmed experimentally that both the hound’s-tooth alignment between a TSV (Through Silicon Via) and a bump and control of mechanical properties of electroplated copper thin films used for the TSV and bump is indispensable in order to minimize the packaging-induced stress in the three-dimensionally mounted chips. This test chip is very effective for evaluating the packaging-process induced stress in 3D stacked chips quantitatively.

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