Multi-functional hydroxyapatite/polyvinyl alcohol composite aerogels with self-cleaning, superior fire resistance and low thermal conductivity

2018 ◽  
Vol 158 ◽  
pp. 128-136 ◽  
Author(s):  
Wenwen Guo ◽  
Jiajia Liu ◽  
Ping Zhang ◽  
Lei Song ◽  
Xin Wang ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Polyvinyl Alcohol ◽  
Fire Resistance ◽  
Low Thermal Conductivity ◽  
Composite Aerogels ◽  
Self Cleaning

scholarly journals Mechanically Strong, Low Thermal Conductivity and Improved Thermal Stability Polyvinyl Alcohol–Graphene–Nanocellulose Aerogel

Gels ◽  
2021 ◽  
Vol 7 (4) ◽  
pp. 170
Author(s):  
Xiuya Wang ◽  
Pengbo Xie ◽  
Ke Wan ◽  
Yuanyuan Miao ◽  
Zhenbo Liu ◽  
...  
Keyword(s):  
Mechanical Properties ◽  
Thermal Conductivity ◽  
Thermal Stability ◽  
Polyvinyl Alcohol ◽  
Low Density ◽  
Composite Aerogel ◽  
Ternary Composite ◽  
Low Thermal Conductivity ◽  
Good Thermal Stability ◽  
Composite Aerogels

Porous aerogel materials have advantages of a low density, low thermal conductivity and high porosity, and they have broad application prospects in heat insulation and building energy conservation. However, aerogel materials usually exhibit poor mechanical properties. Single-component aerogels are less likely to possess a good thermal stability and mechanical properties. It is necessary to prepare multiple-composite aerogels by reinforcement to meet practical application needs. In this experiment, a simple preparation method for polyvinyl alcohol (PVA)–graphene (GA)–nanocellulose (CNF) ternary composite aerogels was proposed. This is also the first time to prepare ternary composite aerogels by mixing graphene, nanocellulose and polyvinyl alcohol. A GA–CNF hydrogel was prepared by a one-step hydrothermal method, and soaked in PVA solution for 48 h to obtain a PVA–GA–CNF hydrogel. PVA–GA–CNF aerogels were prepared by freeze drying. The ternary composite aerogel has advantages of excellent mechanical properties, a low thermal conductivity and an improved thermal stability, because strong hydrogen bonds form between the PVA, GA and CNF. The composite aerogels were characterized by scanning electron microscopy, Fourier transform infrared spectroscopy, X-ray diffractometry, Brunauer–Emmett–Teller analysis, dynamic thermal analysis, thermogravimetry and thermal constant analysis to characterize the properties of the ternary composite aerogels. The lightweight, low-density and porous PVA–GA–CNF composite aerogels withstood 628 times their mass. The thermal conductivity of the composite aerogels was 0.044 ± 0.005 W/mK at room temperature and 0.045 ± 0.005 W/mK at 70 °C. This solid, low thermal conductivity and good thermal stability PVA–GA–CNF ternary composite aerogel has potential application in thermal insulation.

Alkaline Aluminosilicate Binder-Based Adhesives with Increased Fire Resistance for Structural Timber Elements

2019 ◽  
Vol 808 ◽  
pp. 172-176 ◽  
Author(s):  
Pavel V. Krivenko ◽  
Sergii G. Guzii ◽  
Olga P. Bondarenko
Keyword(s):  
Thermal Conductivity ◽  
Fire Resistance ◽  
Fire Protection ◽  
Water Resistance ◽  
Structural Timber ◽  
Reaction Products ◽  
Low Thermal Conductivity ◽  
Artificial Stone ◽  
Thermal Conductivity Λ ◽  
Astm E119

The paper presents data on the use of the alkaline aluminosilicate binder-based adhesive of the system Na2O•Al2O3•(4-6)SiO2•(17-20)H2O for gluing and fire protection of structural timber elements. The results of the study of thermoresistant phases in the reaction products of the alkaline aluminosilicates are reported and discussed. The results allowed to show that at SiO2/Al2O3 between 5 and 6 the zeolite-like phases of heulandite types, which, under action of temperatures, are able to form a porous aluminosilicate artificial stone with low thermal conductivity (λ=0.09 Wt/m•К, DSTU B V.2.7-105-2000 (GOST 7076-99)) are formed in the reaction products. The use of the developed aluminosilicate adhesives allow for to classify the structural timber elements as hardly burnable and hardly flammable materials (GOST 12.1.044-1989, EN 13823 + A1: 2014-12, ASTM E119-07). They have the following characteristics: water resistance D3 (EN 204:2001), resistance in splitting up 7.8 MPa (GOST 16483.5-1973), adhesion in normal pull-off test up to 2.6 MPa (GOST 32299-2013 (ISO 4624:2002)).

Low-density graphene/carbon composite aerogels prepared at ambient pressure with high mechanical strength and low thermal conductivity

RSC Advances ◽  
2015 ◽  
Vol 5 (7) ◽  
pp. 5197-5204 ◽  
Author(s):  
Kang Guo ◽  
Zijun Hu ◽  
Huaihe Song ◽  
Xian Du ◽  
Liang Zhong ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Mechanical Strength ◽  
Compression Strength ◽  
Ambient Pressure ◽  
Carbon Matrix ◽  
Carbon Composite ◽  
Low Density ◽  
High Mechanical Strength ◽  
Low Thermal Conductivity ◽  
Composite Aerogels

SEM and TEM pictures show that GNSs can be well-dispersed in a carbon matrix. The resultant composite CAs exhibited high compression strength and extremely low thermal conductivity of 0.028 W m−1 K−1.

Structure and Thermoelectric Properties of New Quaternary Tin and Lead Bismuth Selenides, K1+xM4-2xBi7+xSe15 (M = Sn, Pb) and K1+xSn5-xBi11+xSe22

2000 ◽  
Vol 626 ◽  
Author(s):  
Antje Mrotzek ◽  
Kyoung-Shin Choi ◽  
Duck-Young Chung ◽  
Melissa A. Lane ◽  
John R. Ireland ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Single Crystal ◽  
Thermoelectric Properties ◽  
Three Dimensional ◽  
Structure Type ◽  
Narrow Gap ◽  
Low Thermal Conductivity ◽  
Seebeck Coefficients ◽  
Metal Atoms ◽  
Anionic Framework

ABSTRACTWe present the structure and thermoelectric properties of the new quaternary selenides K1+xM4–2xBi7+xSe15 (M = Sn, Pb) and K1-xSn5-xBi11+xSe22. The compounds K1+xM4-2xBi7+xSe15 (M= Sn, Pb) crystallize isostructural to A1+xPb4-2xSb7+xSe15 with A = K, Rb, while K1-xSn5-xBi11+xSe22 reveals a new structure type. In both structure types fragments of the Bi2Te3-type and the NaCl-type are connected to a three-dimensional anionic framework with K+ ions filled tunnels. The two structures vary by the size of the NaCl-type rods and are closely related to β-K2Bi8Se13 and K2.5Bi8.5Se14. The thermoelectric properties of K1+xM4-2xBi7+xSe15 (M = Sn, Pb) and K1-xSn5-xBi11+xSe22 were explored on single crystal and ingot samples. These compounds are narrow gap semiconductors and show n-type behavior with moderate Seebeck coefficients. They have very low thermal conductivity due to an extensive disorder of the metal atoms and possible “rattling” K+ ions.

A Novel Poly(Ionic Liquid) as the Thermal Insulating Material

2020 ◽  
Vol 13 (3) ◽  
pp. 241-247
Author(s):  
Wenxin Wei ◽  
Guifeng Ma ◽  
Hongtao Wang ◽  
Jun Li
Keyword(s):  
Thermal Conductivity ◽  
Ionic Liquid ◽  
Glass Transition ◽  
Transition Temperature ◽  
Glass Transition Temperature ◽  
Flame Resistance ◽  
Insulating Material ◽  
Low Thermal Conductivity ◽  
Thermal Insulating ◽  
Poly Ionic Liquid

Objective: A new poly(ionic liquid)(PIL), poly(p-vinylbenzyltriphenylphosphine hexafluorophosphate) (P[VBTPP][PF6]), was synthesized by quaternization, anion exchange reaction, and free radical polymerization. Then a series of the PIL were synthesized at different conditions. Methods: The specific heat capacity, glass-transition temperature and melting temperature of the synthesized PILs were measured by differential scanning calorimeter. The thermal conductivities of the PILs were measured by the laser flash analysis method. Results: Results showed that, under optimized synthesis conditions, P[VBTPP][PF6] as the thermal insulator had a high glass-transition temperature of 210.1°C, high melting point of 421.6°C, and a low thermal conductivity of 0.0920 W m-1 K-1 at 40.0°C (it was 0.105 W m-1 K-1 even at 180.0°C). The foamed sample exhibited much low thermal conductivity λ=0.0340 W m-1 K-1 at room temperature, which was comparable to a commercial polyurethane thermal insulating material although the latter had a much lower density. Conclusion: In addition, mixing the P[VBTPP][PF6] sample into polypropylene could obviously increase the Oxygen Index, revealing its efficient flame resistance. Therefore, P[VBTPP][PF6] is a potential thermal insulating material.

Origin of low thermal conductivity in monolayer PbI2

2021 ◽  
Vol 327 ◽  
pp. 114223
Author(s):  
E. Bolen ◽  
E. Deligoz ◽  
H. Ozisik
Keyword(s):  
Thermal Conductivity ◽  
Low Thermal Conductivity
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