Enhanced thermal conduction and influence of interfacial resistance within flexible high aspect ratio copper nanowire/polymer composites

2017 ◽  
Vol 144 ◽  
pp. 70-78 ◽  
Author(s):  
Amit Rai ◽  
Arden L. Moore
2016 ◽  
Vol 53 ◽  
pp. 143-148 ◽  
Author(s):  
Woongchul Choi ◽  
Kyungwho Choi ◽  
Gang Yang ◽  
Jae Chul Kim ◽  
Choongho Yu

2013 ◽  
Vol 136 (1) ◽  
Author(s):  
Rahul S. Kapadia ◽  
Brian M. Louie ◽  
Prabhakar R. Bandaru

We report and model a linear increase in the thermal conductivity (κ) of polymer composites incorporated with relatively low length/diameter aspect ratio multiwalled carbon nanotubes (CNTs). There was no evidence of percolation-like behavior in the κ, at/close to the theoretically predicted threshold, which was attributed due to the interfacial resistance between the CNT and the polymer matrix. Concomitantly, the widely postulated high thermal conductivity of CNTs does not contribute to the net thermal conductivity of the composites. Through estimating the interfacial resistance and the thermal conductivity of the constituent CNTs, we conclude that our experimental and modeling approaches can be used to study thermal transport behavior in nanotube–polymer composites.


2016 ◽  
Vol 132 ◽  
pp. 16-23 ◽  
Author(s):  
Fritjof Nilsson ◽  
Johannes Krückel ◽  
Dirk W. Schubert ◽  
Fei Chen ◽  
Mikael Unge ◽  
...  

RSC Advances ◽  
2014 ◽  
Vol 4 (86) ◽  
pp. 46363-46368 ◽  
Author(s):  
C. Schmädicke ◽  
M. Poetschke ◽  
L. D. Renner ◽  
L. Baraban ◽  
M. Bobeth ◽  
...  

The growth of high aspect ratio copper nanowires with lengths of up to several micrometers and diameters of about 100 nm via directed electrochemical nanowire assembly (DENA) is presented.


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