Enhanced thermal conduction and influence of interfacial resistance within flexible high aspect ratio copper nanowire/polymer composites
2017 ◽
Vol 144
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pp. 70-78
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2013 ◽
Vol 76
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pp. 29-36
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2016 ◽
Vol 53
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pp. 143-148
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2016 ◽
Vol 132
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pp. 16-23
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2012 ◽
Vol 19
(3)
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pp. 960-967
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Keyword(s):
Keyword(s):