Boron nitride filled epoxy with improved thermal conductivity and dielectric breakdown strength

2015 ◽  
Vol 110 ◽  
pp. 152-158 ◽  
Author(s):  
Martin Donnay ◽  
Spiros Tzavalas ◽  
Emmanuel Logakis
Keyword(s):  
Thermal Conductivity ◽  
Boron Nitride ◽  
Dielectric Breakdown ◽  
Breakdown Strength ◽  
Dielectric Breakdown Strength

scholarly journals Improved thermal conductivity and AC dielectric breakdown strength of silicone rubber/BN composites

2020 ◽  
Vol 2 ◽  
pp. 100023
Author(s):  
Maryam Sarkarat ◽  
Michael Lanagan ◽  
Dipankar Ghosh ◽  
Andrew Lottes ◽  
Kent Budd ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Silicone Rubber ◽  
Dielectric Breakdown ◽  
Breakdown Strength ◽  
Dielectric Breakdown Strength

scholarly journals Simultaneously Enhanced Thermal Conductivity and Dielectric Breakdown Strength in Sandwich AlN/Epoxy Composites

Nanomaterials ◽  
2021 ◽  
Vol 11 (8) ◽  
pp. 1898
Author(s):  
Zhengdong Wang ◽  
Xiaozhuo Wang ◽  
Silong Wang ◽  
Jieyu He ◽  
Tong Zhang ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Layer Thickness ◽  
Dielectric Breakdown ◽  
Breakdown Strength ◽  
Electronic Devices ◽  
Epoxy Composites ◽  
Power Equipment ◽  
Power Electronic ◽  
Sandwich Composites ◽  
Dielectric Breakdown Strength

Polymer-based composites with high thermal conductivity and dielectric breakdown strength have gained increasing attention due to their significant application potential in both power electronic devices and power equipment. In this study, we successfully prepared novel sandwich AlN/epoxy composites with various layer thicknesses, showing simultaneously and remarkably enhanced dielectric breakdown strength and thermal conductivity. The most optimized sandwich composite, with an outer layer thickness of 120 μm and an inner layer thickness of 60 μm (abbreviated as 120-60) exhibits a high through-plane thermal conductivity of 0.754 W/(m·K) (4.1 times of epoxy) and has a dielectric breakdown strength of 69.7 kV/mm, 8.1% higher compared to that of epoxy. The sandwich composites also have higher in-plane thermal conductivity (1.88 W/(m·K) for 120-60) based on the novel parallel models. The sandwich composites with desirable thermal and electrical properties are very promising for application in power electronic devices and power equipment.

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