Overstress accommodation in notched woven-ply thermoplastic laminates at high-temperature: Numerical modeling and validation by Digital Image Correlation

2013 ◽  
Vol 45 (1) ◽  
pp. 290-302 ◽  
Author(s):  
B. Vieille ◽  
J. Aucher ◽  
L. Taleb
2017 ◽  
Vol 28 (3) ◽  
pp. 035007 ◽  
Author(s):  
Wei Wang ◽  
Chenghai Xu ◽  
Hua Jin ◽  
Songhe Meng ◽  
Yumin Zhang ◽  
...  

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