Glass fiber reinforced high glass transition temperature thiol–ene networks

2011 ◽  
Vol 42 (11) ◽  
pp. 1800-1808 ◽  
Author(s):  
Stacy M. Trey ◽  
E. Kristofer Gamstedt ◽  
Edith Mäder ◽  
Sonny Jönsson ◽  
Mats Johansson
2016 ◽  
Vol 51 (11) ◽  
pp. 1605-1617 ◽  
Author(s):  
Md Shamsuddoha ◽  
Luke P Djukic ◽  
Md Mainul Islam ◽  
Thiru Aravinthan ◽  
Allan Manalo

Fiber-reinforced composites are a well-recognized option for repair and rehabilitation of the pipelines for the oil and gas industry. Infilled composite sleeve system provides an effective rehabilitation solution, where the sleeve acts as prime reinforcement without any direct contact with steel. However, the long-term performance of the repair is dependent, in part, on the effect of hygrothermal ageing of the composites. In this publication, glass transition temperature and mechanical properties are compared for glass-fiber reinforced vinyl ester composite, both as-manufactured and after hot-wet conditioning at 80℃. The tensile and shear strength reduced substantially during conditioning, whilst the elastic modulus was relatively stable. The average glass transition temperature of the composite dropped from the as-manufactured value of 110℃ to 97℃ and 101℃, after 1000 and 3000 h of conditioning, respectively, indicating that it is stable and that the composite is suitable for use as a pipeline repair material operating at 80℃. The results indicate that a 1000 h conditioning period, specified as a minimum period in ISO/TS 24817 is suitable for representing long-term properties for stiffness-based designs for the composite material and conditioning temperature investigated.


2011 ◽  
Vol 471-472 ◽  
pp. 415-419 ◽  
Author(s):  
M. Al-Qadhi ◽  
Necar Merah ◽  
K. Mezghani

Epoxy resin is one of the most applied thermoset polymers as a matrix for Glass Fiber Reinforced Pipes (GFRP). Curing process of epoxy resin is important for the integrity of the GFRP. The present work has been conducted to determine the proper pre-curing and post-curing temperatures and duration to develop epoxy-clay nanocomposite. During this study a differential scanning calorimeter (DSC) was used to determine the glass transition temperature and hence the degree of curing. Several samples of epoxy were prepared at different pre-curing and post-curing temperatures and durations. Pre-curing temperatures ranging from 80 to 150°C and post-curing temperatures ranging from 150 to 200°C were studied. The results show that the optimum pre-curing and post-curing temperatures are 100 and 170°C, respectively. Regarding the effect of curing duration, several specimens were prepared at the same pre-curing and post-curing temperatures with different curing durations of 1, 2, and 3 hours. It was observed that beyond one hour curing, the changes in the Tg and the degree of crosslinking were negligible. Using these optimum conditions samples of epoxy-clay nanocomposites were prepared using ultrasonication. The results showed that the addition of nonoclay to epoxy resulted in a reduction of the Tg.


2019 ◽  
Vol 53 (25) ◽  
pp. 3599-3614 ◽  
Author(s):  
Bryan M Louis ◽  
Florian Klunker ◽  
Paolo Ermanni

This study explores the toughening of fiber-reinforced composite laminates to prevent against mode 1 delamination by using a selective placement of nanosilica particles in only the out-of-tow interlaminar regions of the laminate. In place of a conventional homogenous particle distribution throughout the laminate, “selective toughening” through controlled particle deposition is examined with the objective to increase the nanosilica toughening efficiency. Using a laboratory-scale manufacturing route conceptually similar to a combined prepreg and resin-film process, uni-directional carbon fiber composite laminates containing high glass-transition temperature amine-cured Dow D.E.R. 330 epoxy are produced from both particle distribution configurations. Comparisons are made by double cantilever beam testing for mode 1 delamination fracture energy G1C and by examination of the fracture surfaces. The results show that further nanosilica toughening efficiency is possible with local deposition and toughening compared to the conventional homogenous particle distribution throughout the laminate. For the same total nanosilica particle content in the laminate, the delamination toughening effects are maintained or improved when locally toughened in only the out-of-tow interlaminar regions. For mode 1 delamination initiation and propagation, fracture energy increases in the range of 60% over the untoughened laminates are found for the laminates with a local particle distribution. By comparison, those laminates with a conventional homogeneous particle distribution saw increase of 20–35% over the untoughened laminates. The implications of the localized toughening approach are discussed to provide further guidance in optimizing the use of nanosilica particles and particle toughening in general in composite laminates.


Author(s):  
M. I. Valueva ◽  
I. V. Zelenina ◽  
M. A. Zharinov ◽  
M. A. Khaskov

The article presents results of studies of experimental carbon plastics based on thermosetting PMRpolyimide binder. Сarbon fiber reinforced plastics (CFRPs) are made from prepregs prepared by melt and mortar technologies, so the rheological properties of the polyimide binder were investigated. The heat resistance of carbon plastics was researched and its elastic-strength characteristics were determined at temperatures up to 320°С. The fundamental possibility of manufacturing carbon fiber from prepregs based on polyimide binder, obtained both by melt and mortar technologies, is shown. CFRPs made from two types of prepregs have a high glass transition temperature: 364°C (melt) and 367°C (solution), with this temperature remaining at the 97% level after boiling, and also at approximately the same (86–97%) level of conservation of elastic strength properties at temperature 300°С.


Polymers ◽  
2021 ◽  
Vol 13 (11) ◽  
pp. 1734
Author(s):  
Erick Franieck ◽  
Martin Fleischmann ◽  
Ole Hölck ◽  
Larysa Kutuzova ◽  
Andreas Kandelbauer

We report on the cure characterization, based on inline monitoring of the dielectric parameters, of a commercially available epoxy phenol resin molding compound with a high glass transition temperature (>195 °C), which is suitable for the direct packaging of electronic components. The resin was cured under isothermal temperatures close to general process conditions (165–185 °C). The material conversion was determined by measuring the ion viscosity. The change of the ion viscosity as a function of time and temperature was used to characterize the cross-linking behavior, following two separate approaches (model based and isoconversional). The determined kinetic parameters are in good agreement with those reported in the literature for EMCs and lead to accurate cure predictions under process-near conditions. Furthermore, the kinetic models based on dielectric analysis (DEA) were compared with standard offline differential scanning calorimetry (DSC) models, which were based on dynamic measurements. Many of the determined kinetic parameters had similar values for the different approaches. Major deviations were found for the parameters linked to the end of the reaction where vitrification phenomena occur under process-related conditions. The glass transition temperature of the inline molded parts was determined via thermomechanical analysis (TMA) to confirm the vitrification effect. The similarities and differences between the resulting kinetics models of the two different measurement techniques are presented and it is shown how dielectric analysis can be of high relevance for the characterization of the curing reaction under conditions close to series production.


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