Cure shrinkage characterization and modeling of a polyester resin containing low profile additives

2007 ◽  
Vol 38 (3) ◽  
pp. 994-1009 ◽  
Author(s):  
Mohsan Haider ◽  
Pascal Hubert ◽  
Larry Lessard
Keyword(s):  
Polyester Resin ◽  
Low Profile ◽  
Cure Shrinkage

The effect of the addition of a low profile additive on the curing shrinkage of an unsaturated polyester resin

1999 ◽  
Vol 39 (1) ◽  
pp. 18-25 ◽  
Author(s):  
C. J. Liu ◽  
M. S. Kiasat ◽  
A. H. J. Nijhof ◽  
H. Blokland ◽  
R. Marissen
Keyword(s):  
Polyester Resin ◽  
Unsaturated Polyester ◽  
Unsaturated Polyester Resin ◽  
Low Profile ◽  
Curing Shrinkage

Chemical thickening of low profile polyester resin systems

1974 ◽  
Vol 14 (2) ◽  
pp. 143-146 ◽  
Author(s):  
F. R. Volgstadt ◽  
C. L. Sieglaff
Keyword(s):  
Polyester Resin ◽  
Low Profile

Phase separation in styrenated polyester resin containing a poly(vinyl acetate) low-profile additive

Polymer ◽  
1985 ◽  
Vol 26 (1) ◽  
pp. 109-112 ◽  
Author(s):  
Clive B. Bucknall ◽  
Peter Davies ◽  
Ivana K. Partridge
Keyword(s):  
Phase Separation ◽  
Vinyl Acetate ◽  
Polyester Resin ◽  
Low Profile

Study on Low Profile SMC for the Production of Cylinder Head Cover

2011 ◽  
Vol 221 ◽  
pp. 418-421
Author(s):  
Ming Yang ◽  
Yu Jing Nie ◽  
Xiu Fang Zhu ◽  
Rui Feng Ming
Keyword(s):  
Cylinder Head ◽  
Performance Testing ◽  
Test Sample ◽  
National Standards ◽  
Automotive Application ◽  
Low Profile ◽  
Cylinder Head Cover ◽  
Sheet Moulding Compound ◽  
Head Cover ◽  
Cure Shrinkage

In this paper, one kind of low profile SMC (Sheet Moulding Compound) has been introduced and used to produce the cylinder head cover. Two kinds of low profile additives (polystyrene and polyester resin) were blended and added to the resin to compensate for the cure shrinkage. The cure shrinkage of obtained low profile SMC was only 0.05%, which met the requirements for class A surfaces. Test sample were prepared by mould pressing. Properties testing of SMC were conducted according to the National standards. Results showed that all of the indexes of the low profile SMC met the specifications for the production of cylinder head cover. Some properties of cylinder head cover products have been investigated in detail. Experimental and performance testing results showed that this kind of cylinder head cover is suitable for the automotive application.

Latest Technologies of Epoxy Molding Compound (EMC) for FO-WLP

2020 ◽  
Vol 2020 (1) ◽  
pp. 000051-000056
Author(s):  
Masahiro Iwai ◽  
Ken Ukawa ◽  
Go Ichizawa ◽  
Takeshi Mori
Keyword(s):  
Cost Reduction ◽  
Flip Chip ◽  
Melt Viscosity ◽  
Epoxy Molding Compound ◽  
Molding Compound ◽  
Filler Size ◽  
Large Size ◽  
Low Profile ◽  
Cure Shrinkage

Abstract FO-WLP is used for RF etc. for mobile as a package excellent in low profile, low warpage, cost reduction, electric performance etc. and this market is expanding since it began to be used in Application processer (AP) in 2016. It is expected that adoption to AP for mobile will continue to grow and further expansion to other products is also expected. Meanwhile, Epoxy molding compound (EMC) for FO-WLP is required to have functions not found in EMC for low-end packages. For example, since the molding area is large and the molding thickness is thin, if a conventional EMC is used, the warpage becomes large after curing and it cannot proceed to the subsequent process. In order to control warpage after curing, it is important to reduce cure shrinkage of EMC. In addition, in order to fill completely the gap between flip chip bumps of large size chip, control of filler size, melt viscosity etc. is more severely required.

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