Identification of cohesive zone model and elastic parameters of fiber-reinforced cementitious composites using digital image correlation and a hybrid inverse technique

2011 ◽  
Vol 33 (5) ◽  
pp. 572-585 ◽  
Author(s):  
Bin Shen ◽  
Glaucio H. Paulino
Keyword(s):  
Digital Image Correlation ◽  
Digital Image ◽  
Cohesive Zone ◽  
Cohesive Zone Model ◽  
Image Correlation ◽  
Cementitious Composites ◽  
Zone Model ◽  
Elastic Parameters ◽  
Inverse Technique ◽  
Fiber Reinforced Cementitious Composites

scholarly journals Experimental characterisation of a cohesive zone model using digital image correlation

2010 ◽  
Vol 6 ◽  
pp. 43004
Author(s):  
V. Huon ◽  
V. Richefeu ◽  
W. Shuang ◽  
A. Chrysochoos ◽  
Y. Monerie ◽  
...  
Keyword(s):  
Digital Image Correlation ◽  
Digital Image ◽  
Cohesive Zone ◽  
Cohesive Zone Model ◽  
Image Correlation ◽  
Zone Model ◽  
Experimental Characterisation

Damage Accumulation and Life-Prediction Models for SnAgCu Leadfree Electronics Under Shock-Impact

2009 ◽  
Author(s):  
Pradeep Lall ◽  
Sandeep Shantaram ◽  
Arjun Angral ◽  
Mandar Kulkarni ◽  
Jeff Suhling
Keyword(s):  
Digital Image Correlation ◽  
Digital Image ◽  
Thermal Aging ◽  
Cohesive Zone ◽  
Life Prediction ◽  
Failure Modes ◽  
Damage Index ◽  
Image Correlation ◽  
Shock Impact ◽  
Cohesive Zone Elements

Relative damage-index based on the leadfree interconnect transient strain history from digital image correlation, explicit finite-elements, cohesive-zone elements, and component’s survivability envelope has been developed for life-prediction of two-leadfree electronic alloy systems. Life prediction of pristine and thermally-aged assemblies, have been investigated. Solder alloy system studied include Sn1Ag0.5Cu, and 96.5Sn3.5Ag. Transient strains during the shock-impact have been measured using digital image correlation in conjunction with high-speed cameras operating at 50,000 fps. Both the board strains and the package strains have been measured in a variety of drop orientations including JEDEC horizontal drop orientation, vertical drop orientation and intermediate drop orientations. In addition the effect of sequential stresses of thermal aging and shock-impact on the failure mechanisms has also been studied. The thermal aging condition used for the study includes 125°C for 100 hrs. The presented methodology addresses the need for life prediction of new lead-free alloy-systems under shock and vibration, which is largely beyond the state of art. Three failure modes have been predicted including interfacial failure at the copper-solder interface, solder-PCB interface, and the solder joint failure. Explicit non-linear finite element models with cohesive-zone elements have been developed and correlated with experimental results. Velocity data from digital image correlation has been used to drive the attachment degrees of freedom of the submodel and extract transient interconnect strain histories. Explicit finite-element sub-modeling has been correlated with the full-field strain in various locations, orientations, on both the package and the board-side. The survivability of the leadfree interconnections under sequential loading (thermal aging and shock-impact) from simulation has been compared with pristine circuit assemblies subjected to shock-impact. Sequential loading changes the failure modes and decreases the drop reliability as compared to the room temperature experimental results. Damage index based survivability envelope is intended for component integration to ensure reliability in harsh environments.

scholarly journals Mixed-mode cohesive zone parameters from integrated digital image correlation on micrographs only

2019 ◽  
Vol 156-157 ◽  
pp. 179-193 ◽  
Author(s):  
A.P. Ruybalid ◽  
J.P.M. Hoefnagels ◽  
O. van der Sluis ◽  
M.P.F.H.L. van Maris ◽  
M.G.D. Geers
Keyword(s):  
Digital Image Correlation ◽  
Digital Image ◽  
Cohesive Zone ◽  
Mixed Mode ◽  
Image Correlation ◽  
Zone Parameters ◽  
Integrated Digital Image Correlation

scholarly journals Fracture Behaviour of Real Coarse Aggregate Distributed Concrete under Uniaxial Compressive Load Based on Cohesive Zone Model

Materials ◽  
2021 ◽  
Vol 14 (15) ◽  
pp. 4314
Author(s):  
Jingwei Ying ◽  
Jin Guo
Keyword(s):  
Finite Element ◽  
Uniaxial Compression ◽  
Digital Image ◽  
Cohesive Zone Model ◽  
Compressive Load ◽  
Strain Ratio ◽  
Image Correlation ◽  
Zone Model ◽  
Cohesive Elements ◽  
Compression Loading

Two-dimensional meso-scale finite element models with real aggregates are developed using images obtained by digital image processing to simulate crack propagation processes in concrete under uniaxial compression loading. The finite element model is regarded as a three-phase composite material composed of aggregate, mortar matrix and interface transition zone (ITZ). Cohesive elements with traction–separation laws are used to simulate complex nonlinear fracture. During the experiment, digital image correlation (DIC) was used to obtain the deformation and cracks of the specimens at different loading stages. The concept of strain ratio is proposed to describe the effectiveness of simulation. Results show that the numerical strain ratio curve and stress–strain curves are both in good agreement with experimental data. The consistency between the cracks obtained by simulation and those obtained by DIC shows the good performance of cohesive elements as well as the effectiveness of simulation. In summary, the model is able to provide accurate predictions of the whole fracture process in concrete under uniaxial compression loading.

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