Nanofibrillated Cellulose/MgO@rGO composite films with highly anisotropic thermal conductivity and electrical insulation

2020 ◽  
Vol 392 ◽  
pp. 123714 ◽  
Author(s):  
Meng Ma ◽  
Lin Xu ◽  
Lele Qiao ◽  
Si Chen ◽  
Yanqin Shi ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Composite Films ◽  
Nanofibrillated Cellulose ◽  
Electrical Insulation ◽  
Anisotropic Thermal Conductivity

Highly anisotropic thermal conductivity and electrical insulation of nanofibrillated cellulose/Al2O3@rGO composite films: effect of the particle size

2021 ◽  
Author(s):  
Meng Ma ◽  
Qindan Chu ◽  
Hao Lin ◽  
Lin Xu ◽  
Huiwen He ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Particle Size ◽  
Heat Dissipation ◽  
Composite Films ◽  
Nanofibrillated Cellulose ◽  
Al2o3 Particle ◽  
Electrical Insulation ◽  
Drying Methods ◽  
Anisotropic Thermal Conductivity ◽  
Al2o3 Particles

Abstract Abstract: Nanofibrillated cellulose (NFC) film has received tremendous attention due to its excellent electrical insulation, which shows great application prospects in the field of electronic devices. However, the low efficient heat dissipation of NFC film largely limits its use in advanced applications. In this work, the rGO hybrid fillers loaded alumina (Al2O3) particles with different sizes were synthesized by different drying methods and then they were mixed with NFC to prepare a series of NFC-based composite films. The effect of Al2O3 particle sizes on the thermal conductivity of NFC-based composite films was studied. The results showed that the surface areas of l-Al2O3 particles were smaller than that of s-Al2O3 particles, resulting in the smaller interface thermal resistance and superior thermal conductivity of the film containing l-Al2O3 particles. The NFC-based composite films showed great potential for the applications in thermal management by adjusting the particle size of fillers.

Ultrathin flexible reduced graphene oxide/cellulose nanofiber composite films with strongly anisotropic thermal conductivity and efficient electromagnetic interference shielding

2017 ◽  
Vol 5 (15) ◽  
pp. 3748-3756 ◽  
Author(s):  
Weixing Yang ◽  
Zedong Zhao ◽  
Kai Wu ◽  
Rui Huang ◽  
Tianyu Liu ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Graphene Oxide ◽  
Electromagnetic Interference ◽  
Composite Films ◽  
Emi Shielding ◽  
Electromagnetic Interference Shielding ◽  
Nanofiber Composite ◽  
Anisotropic Thermal Conductivity ◽  
Reduced Graphene ◽  
Cnf Films

In this study, ultrathin flexible RGO/CNF films with outstanding EMI shielding performances and strongly anisotropic thermal conductivity were successfully fabricated.

Upconversion nanoparticle–Ag@C@Ag composite films for rapid temperature sensing

CrystEngComm ◽  
2021 ◽  
Author(s):  
Hu Huang ◽  
Lingqiong Wu ◽  
Shengbin Cheng ◽  
Xiaofeng Wu ◽  
Shiping Zhan ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Ag Nanoparticles ◽  
Response Rate ◽  
Composite Films ◽  
Temperature Sensing ◽  
Upconversion Nanoparticles ◽  
Rapid Temperature

The response rate of optical temperature sensing of upconversion nanoparticles is significantly improved by coupling with Ag@C@Ag nanoparticles which have excellent thermal conductivity.

scholarly journals Improved Copper–Epoxy Adhesion by Laser Micro- and Nano-Structuring of Copper Surface for Thermal Applications

Polymers ◽  
2021 ◽  
Vol 13 (11) ◽  
pp. 1721
Author(s):  
Mario Mora ◽  
Hippolyte Amaveda ◽  
Luis Porta-Velilla ◽  
Germán F. de la Fuente ◽  
Elena Martínez ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Bonding Strength ◽  
Copper Surface ◽  
Heat Sinks ◽  
Electrical Insulation ◽  
Cryogenic Temperatures ◽  
Shear Tests ◽  
Patterned Structures ◽  
Different Temperatures ◽  
Mechanical Tensile

The objective of this work is the enhancement of metal-to-metal bonding to provide high thermal conductivity together with electrical insulation, to be used as heat sinks at room and cryogenic temperatures. High thermal conductive metal (copper) and epoxy resin (Stycast 2850FT) were used in this study, with the latter also providing the required electrical insulation. The copper surface was irradiated with laser to induce micro- and nano-patterned structures that result in an improvement of the adhesion between the epoxy and the copper. Thus, copper-to-copper bonding strength was characterized by means of mechanical tensile shear tests. The effect of the laser processing on the thermal conductivity properties of the Cu/epoxy/Cu joint at different temperatures, from 10 to 300 K, is also reported. Using adequate laser parameters, it is possible to obtain high bonding strength values limited by cohesive epoxy fracture, together with good thermal conductivity at ambient and cryogenic temperatures.

Enhanced thermal conductivity of polyimide composite film filled with hybrid fillers

2021 ◽  
pp. 095400832110003
Author(s):  
Ruiyi Li ◽  
Chengcheng Ding ◽  
Juan Yu ◽  
Xiaodong Wang ◽  
Pei Huang
Keyword(s):  
Thermal Conductivity ◽  
Composite Film ◽  
Hexagonal Boron Nitride ◽  
Composite Films ◽  
Resistance Index ◽  
Reference Value ◽  
Residual Rate ◽  
Practical Applications ◽  
Hybrid Fillers ◽  
The Matrix

In this article, the polyimide (PI) composite films with synergistically improving thermal conductivity were prepared by adding a few graphene nanoplatelets (GNP) and various hexagonal boron nitride (h-BN) contents into the PI matrix. The thermal conductivity of PI composite film with 1 wt% GNP and 30 wt% h-BN content was 1.21 W(m·k)− 1, which was higher than that of the PI composite film with 30 wt% h-BN content (0.45 W(m·k)− 1), the synergistic efficiency of GNP under various h-BN content (10 wt%, 20 wt%, and 30 wt%) were 1.70, 2.71, and 3.09, respectively. And it was found that the increased h-BN content can suppress the dielectric properties caused by GNP in the matrix. The dielectric permittivity and dielectric loss tangent of 1 wt% GNP/PI composite film were 10.69, 0.661 at 103 Hz, respectively, and that of the 30 wt% h-BN + GNP/PI composite film were 4.29 and 0.1367, respectively. Moreover, the mechanical properties of the PI composite film were suitable for practical applications. And the heat resistance index and the residual rate at 700°C of PI composite film increased to 326.8°C, 74.43%, respectively, and these of PI film were 292.6°C and 59.26%. Thus, it may provide a reference value for applying the filler hybridization/PI film in the electronic packaging materials.

Sandwich-structured PVA/rGO films from self-construction with high thermal conductivity and electrical insulation

2021 ◽  
Vol 207 ◽  
pp. 108707
Author(s):  
Fanghua Luo ◽  
Min Zhang ◽  
Songlin Chen ◽  
Jianfeng Xu ◽  
Chen Ma ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Electrical Insulation ◽  
High Thermal Conductivity
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