Synthesis and characterization of Co sub-micro chains by solvothermal route: Process design, magnetism and excellent thermal stability

2011 ◽  
Vol 173 (1) ◽  
pp. 233-240 ◽  
Author(s):  
Lianfeng Duan ◽  
Shusheng Jia ◽  
Rongmin Cheng ◽  
Lijun Zhao
Keyword(s):  
Thermal Stability ◽  
Process Design ◽  
Synthesis And Characterization ◽  
Excellent Thermal Stability ◽  
Solvothermal Route

scholarly journals Synthesis and characterization of carborane-containing poly(hydroxy ethers) with excellent thermal stability

2017 ◽  
Vol 35 (12) ◽  
pp. 1463-1473 ◽  
Author(s):  
Zhen Yang ◽  
Ning Li ◽  
Xiao-xue Yang ◽  
Xiao-a Zhang ◽  
Sheng-ling Jiang ◽  
...  
Keyword(s):  
Thermal Stability ◽  
Synthesis And Characterization ◽  
Excellent Thermal Stability

scholarly journals Synthesis and Characterization of Semicrystalline Polyimides Containing Bridged Linkages

2018 ◽  
Vol 2018 ◽  
pp. 1-7 ◽  
Author(s):  
Min Chao
Keyword(s):  
Thermal Stability ◽  
Weight Loss ◽  
Glass Transition ◽  
Transition Temperature ◽  
Glass Transition Temperature ◽  
High Weight ◽  
Softening Temperature ◽  
Synthesis And Characterization ◽  
Excellent Thermal Stability

A series of polyimides (PI) containing bridged linkages were prepared successfully through a three-step technique. The results indicated that the glass transition temperature (Tg) of polyimides was affected by flexibility of polymer chain and the intermolecular interactions. ODPA-TPER-based polyimide possesses the lowest Tg, which was 214°C. All polyimides had semicrystalline characteristics, and ODPA-TPER-based PI exhibited the lowest melting temperature (Tm) at 316°C. The polyimides had high weight loss temperatures, which indicated that bridged linkages can reduce the softening temperature, meanwhile keeping excellent thermal stability.

Synthesis and Characterization of Novel Thermal Stability Poly (ester-imide-ether) with Excellent Lower Temperature Elastic Recovery

2012 ◽  
Vol 554-556 ◽  
pp. 258-262
Author(s):  
Jiao Jiao Shang ◽  
Jian Wu Lan ◽  
Shao Jian Lin ◽  
Si Chen ◽  
Ya Ni Li
Keyword(s):  
Thermal Stability ◽  
Differential Scanning Calorimetry ◽  
Elastic Recovery ◽  
Synthesis And Characterization ◽  
Scanning Calorimetry ◽  
Excellent Thermal Stability ◽  
Melt Polymerization ◽  
Ft Ir ◽  
Lower Temperature

A new poly(ester-imide-ether) (PEIE) was prepared by melt polymerization from 1,4-butanediol(BD), polytetrahydrofuran diol (PTMG) and a novel imide dicarboxylic acid monomer which was synthesized from 3,3',4,4'-biphenyltetracarboxylic di-anhydride(BPDA) and glycine acid(GLY). The structure, thermal behaviour and elastic recovery of polymer were characterized by FT-IR. thermogravimetric analysis (TGA), differential scanning calorimetry thermograms (DSC) and laboratory stretching machine. The results showed this polymer has excellent thermal stability, 5 % weight loss temperature was at 354°C. Meanwhile, the DSC curve showed that glass-transition temperature and crystallization temperature of the polymer were at -30 °C and 160 °C, respectively. The excellent elastic recovery was still displayed at low temperature.

Solvent-resistant polyetherimide network systems via phenylethynylphthalic anhydride endcapping

1994 ◽  
Vol 6 (4) ◽  
pp. 423-435 ◽  
Author(s):  
G W Meyer ◽  
B Tan ◽  
J E McGrath
Keyword(s):  
Thermal Stability ◽  
Room Temperature ◽  
Synthesis And Characterization ◽  
Compression Moulding ◽  
Network Systems ◽  
Excellent Thermal Stability ◽  
Glass Transition Temperatures ◽  
Structural Adhesives ◽  
Phenylene Diamine

The synthesis and characterization of a highly processable thermosetting polyimide system based on 22'-bis[4-(3,4-dicarboxyphenoxy)phenyl]propane dianhydride or bisphenol A dianhydride (BPA-DA) endcapped with 4-phenylethynylphthalic anhydride is described. The system afforded oligomers that were readily melt processable at high curing temperatures (380-420 CC). Imide oligomers ranging from MR = 2000 to 40 000 g molI and copolyimides were synthesized using the ester acid of the dianhydrides and either meta- and/or para-phenylene diamines as comonomers via solution imidization techniques. The oligomers were shown to display low melt viscosity values and to flow under low pressure during compression moulding. The thermally cured polymers formed tough creasable films and displayed excellent solvent resistance which was correlated to their high gel fractions (>95%). Very significant increases in glass transition temperatures were observed after cure of a 3000., oligomer. The mera-phenylene diamine-based polymer exhibited a cured Ts approximately 30C lower (233C) than the para:meta (70:30) system (267C). The all para-phenylene diamine-based homopolymers could be completely cyclized in solution but crystallized at room temperature to produce fine insoluble powders. The resulting moderately semicrystalline homopolymer showed a TM of up to 321 'C which was not observed on the second heating. These polyimides also show excellent thermal stability as judged by thermogravimetric analysis (TGA) and are being examined as structural adhesives and matrix resins.

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