Electrochemical migration behavior of silver nanopaste screen-printed for flexible and printable electronics

2013 ◽  
Vol 13 ◽  
pp. S190-S194 ◽  
Author(s):  
Kwang-Seok Kim ◽  
Jae-Oh Bang ◽  
Seung-Boo Jung
Keyword(s):  
Electrochemical Migration ◽  
Migration Behavior ◽  
Printable Electronics ◽  
Silver Nanopaste ◽  
Screen Printed

scholarly journals Electrochemical migration behavior of moldy printed circuit boards in a 10 mT magnetic field

RSC Advances ◽  
2021 ◽  
Vol 11 (45) ◽  
pp. 28178-28188
Author(s):  
Xuan Liu ◽  
Ziheng Bai ◽  
Qianqian Liu ◽  
Yali Feng ◽  
Chaofang Dong ◽  
...  
Keyword(s):  
Magnetic Field ◽  
External Magnetic Field ◽  
Failure Mechanism ◽  
Printed Circuit Boards ◽  
Electrochemical Migration ◽  
Migration Behavior ◽  
Circuit Boards ◽  
Printed Circuit

Proposed failure mechanism of electrochemical migration under an external magnetic field caused by mold.

Fabrication of an IPL-sintered Cu circuit and its electrochemical migration behavior

2021 ◽  
Vol 863 ◽  
pp. 158726
Author(s):  
Choong-Jae Lee ◽  
Dong-Gil Kang ◽  
Byeong-Uk Hwang ◽  
Kyung Deuk Min ◽  
Jinho Joo ◽  
...  
Keyword(s):  
Electrochemical Migration ◽  
Migration Behavior

Electrochemical Migration Characteristics of Screen-Printed Silver Patterns on FR-4 Substrate

2012 ◽  
Vol 12 (4) ◽  
pp. 3219-3223 ◽  
Author(s):  
Kwang-Seok Kim ◽  
Jee-Hyuk Ahn ◽  
Bo-In Noh ◽  
Seung-Boo Jung
Keyword(s):  
Electrochemical Migration ◽  
Screen Printed

ELECTROCHEMICAL MIGRATION BEHAVIOR OF Sn-3.0Ag-0.5Cu SOLDER ALLOY UNDER THIN ELECTROLYTE LAYERS

2019 ◽  
Vol 26 (06) ◽  
pp. 1850208 ◽  
Author(s):  
BOKAI LIAO ◽  
WENFENG JIA ◽  
RUIYAN SUN ◽  
ZHENYU CHEN ◽  
XINGPENG GUO
Keyword(s):  
Solder Alloy ◽  
Electrochemical Migration ◽  
Migration Behavior ◽  
Time To Failure ◽  
Sac305 Solder ◽  
Maximum Value ◽  
The Mean ◽  
Mean Time ◽  
Observation Results

The electrochemical migration (ECM) behavior of Sn-3.0Ag-0.5Cu solder alloy under thin electrolyte layers was investigated using a technique based on the coupling of in situ electrochemical measurements and optical observation. Results showed that the mean time to failure first increased and then decreased as thickness of the electrolyte layer increased, the maximum value was present at 200[Formula: see text][Formula: see text]m. The higher the bias voltage applied, the faster was the rate of dendrite growth. And, Sn leaded the ECM of SAC305 solder alloy. Mechanisms relevant have been proposed to explain the ECM behavior of Sn-3.0Ag-0.5Cu solder alloy.

Electrochemical Migration behavior of Sn9Zn

2019 ◽  
Author(s):  
Xiao Qi ◽  
Haoran Ma ◽  
Xiaogan Li ◽  
Shengyan Shang ◽  
Yunpeng Wang ◽  
...  
Keyword(s):  
Electrochemical Migration ◽  
Migration Behavior

scholarly journals Electrochemical Impedance Analysis for Growth Process of Electrochemical Migration on Screen-Printed Silver Wiring Electrode

2012 ◽  
Vol 63 (11) ◽  
pp. 694-699
Author(s):  
Isao SHITANDA ◽  
Kazuya INOUE ◽  
Katsuhiro YAMAMOTO ◽  
Yoshinao HOSHI ◽  
Masayuki ITAGAKI
Keyword(s):  
Growth Process ◽  
Electrochemical Impedance ◽  
Impedance Analysis ◽  
Electrochemical Migration ◽  
Screen Printed
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