Scanning acoustic microscopy (SAM) was used in the evaluation of bone remodeling around a cylindrical unicortical defect. SAM is a technique for the nondestructive evaluation of materials, and has only recently been employed as an orthopaedic research tool. The utility of SAM was demonstrated by using it to measure an elastic property known as acoustic impedance. Specifically, the acoustic impedance of bone formed by remodeling around a cylindrical defect was measured. The defects were filled with either a low modulus “void” or rigid inclusion to create various states of stress in the bone in the vicinity of the defect. After six months of implantation of the inclusions in the sheep metatarsal, new bone formation on periosteal and endosteal surfaces about the defect region was observed. These regions of new bone were less stiff and had 18.0 ± 6.5% lower acoustic impedance than the pre-existing bone in the intracortical region of the metatarsal. There was no difference in the degree of new bone formation about void and rigid inclusions. Both underwent significant adaptational changes in response to the elevated stress about the defect. These changes affected the basic structure of the bone cross-section at the level of the defect and effectively reduced the stress levels about the defect. By using SAM to measure acoustic impedance, it was seen that little internal remodeling occurred in the intracortical region. Hence, the primary mechanism of strain-induced bone remodeling observed in this experimental model was surface remodeling.
Abstract
The electronics supply chain is being increasingly infiltrated by non-authentic, counterfeit electronic parts, whose use poses a great risk to the integrity and quality of critical hardware. There is a wide range of counterfeit parts such as leads and body molds. The failure analyst has many tools that can be used to investigate counterfeit parts. The key is to follow an investigative path that makes sense for each scenario. External visual inspection is called for whenever the source of supply is questionable. Other methods include use of solvents, 3D measurement, X-ray fluorescence, C-mode scanning acoustic microscopy, thermal cycle testing, burn-in technique, and electrical testing. Awareness, vigilance, and effective investigations are the best defense against the threat of counterfeit parts.
Abstract
A failure analysis application utilizing scanning acoustic microscopy (SAM) and time domain reflectometry (TDR) for failure analysis has been developed to isolate broken stitch bonds in thin shrink small outline package (TSSOP) devices. Open circuit failures have occurred in this package due to excessive bending of the leads during assembly. The tools and their specific application to this technique as well as the limitations of C-SAM, TDR and radiographic analyses are discussed. By coupling C-SAM and TDR, a failure analyst can confidently determine whether the cause of an open circuit in a TSSOP package is located at the stitch bond. The root cause of the failure was determined to be abnormal mechanical stress placed on the pins during the lead forming operation. While C-SAM and TDR had proven useful in the analysis of TSSOP packages, it can potentially be expanded to other wire-bonded packages.
Abstract
For stacked die package delamination inspection using C-mode acoustic microscope, traditional interface and thorough scan techniques cannot give enough of information when the delamination occurs in multi-interfaces, and echoes from adjacent interfaces are not sufficiently separated from each other. A thinner thickness in the stacked-die package could complicate C-mode scanning acoustic microscopy (CSAM) analysis and sometimes may lead to false interpretations. The first objective of this paper is to briefly explain the CSAM mechanism. Based on that, some of the drawbacks of current settings in detecting the delamination for stacked-die packages are presented. The last objective is to introduce quantitative B-scan analysis mode (Q-BAM) and Zip-Slice technologies in order to better understand and improve the reliability of detecting the delamination in stacked-die packages. Therefore, a large portion of this paper focuses on the Q-BAM and Zip-Slice data acquisition and image interpretation.
Abstract
This paper discusses the application of two different techniques for failure analysis of Cu through-silicon vias (TSVs), used in 3D stacked-IC technology. The first technique is GHz Scanning Acoustic Microscopy (GHz- SAM), which not only allows detection of defects like voids, cracks and delamination, but also the visualization of Rayleigh waves. GHz-SAM can provide information on voids, delamination and possibly stress near the TSVs. The second is a reflection-based photoelastic technique (SIREX), which is shown to be very sensitive to stress anisotropy in the Si near TSVs and as such also to any defect affecting this stress, such as delamination and large voids.
The aim of this study was to investigate the behavior of dental-derived human mesenchymal stem cells (d-hMSCs) in response to differently surface-treated implants and to evaluate the effect of d-hMSCs on local osteogenesis around an implant in vivo. d-hMSCs derived from alveolar bone were established and cultured on machined, sandblasted and acid-etched (SLA)-treated titanium discs with and without osteogenic induction medium. Their morphological and osteogenic potential was assessed by scanning electron microscopy (SEM) and real-time polymerase chain reaction (RT-PCR) via mixing of 5 × 106 of d-hMSCs with 1 mL of Metrigel and 20 μL of gel-cell mixture, which was dispensed into the defect followed by the placement of customized mini-implants (machined, SLA-treated implants) in New Zealand white rabbits. Following healing periods of 2 weeks and 12 weeks, the obtained samples in each group were analyzed radiographically, histomorphometrically and immunohistochemically. The quantitative change in osteogenic differentiation of d-hMSCs was identified according to the type of surface treatment. Radiographic analysis revealed that an increase in new bone formation was statistically significant in the d-hMSCs group. Histomorphometric analysis was in accordance with radiographic analysis, showing the significantly increased new bone formation in the d-hMSCs group regardless of time of sacrifice. Human nuclei A was identified near the area where d-hMSCs were implanted but the level of expression was found to be decreased as time passed. Within the limitations of the present study, in this animal model, the transplantation of d-hMSCs enhanced the new bone formation around an implant and the survival and function of the stem cells was experimentally proven up to 12 weeks post-sacrifice.
In Vivo Study for Clinical Application of Dental Stem Cell Therapy Incorporated with Dental Titanium Implants